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Thread: Anandtech News

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    #11571

    Anandtech: Intel to Drop Celeron and Pentium Branding From Laptop Parts In 2023

    While we’re still over a quarter out from the end of 2022, Intel already has its eyes aimed at 2023 and its eventual refresh of its mobile processors. To that end, today the company has announced that they are making some branding changes for the low-end.
    Starting in 2023, Intel will be retiring the Pentium and Celeron brands for laptop processors. In its place, Intel will have a singular “Intel Processor” brand for the low end of the market, while the Core branding (with its multiple tiers) will remain in place for the rest of Intel’s mobile product stack.
    “Whether for work or play, the importance of the PC has only become more apparent as the torrid pace of technological development continues to shape the world. Intel is committed to driving innovation to benefit users, and our entry-level processor families have been crucial for raising the PC standard across all price points. The new Intel Processor branding will simplify our offerings so users can focus on choosing the right processor for their needs.”
    -Josh Newman, Intel vice president and interim general manager of Mobile Client Platforms

    Notably, this change only applies to future laptop parts. At this point Intel is not announcing a change for desktop parts or embedded parts. But with that said, I would not be the least bit surprised if these change ultimately came to desktops as well, as mobile is effectively Intel’s leading consumer market segment these days. So technology and names tend to percolate up to the desktop segment, keeping the two in sync.
    Intel’s current generation Pentium and Celeron offerings are both based on Alder Lake-U processors with a single performance core and four (one block of) efficiency cores. The only differences between these SKUs, besides price, is clockspeeds – specifically, that the Celeron parts lack turbo. So if Intel is going to pursue a similar strategy in future generations, then it’s not outlandish to fold two similar products under a single brand. Though the decision to forgo any kind of specific branding is an unusual one for Intel.
    With that said, there’s also been a notable absence of “pure” Atom parts in this segment in this generation. Intel has yet to produce a true entry-level part using its Gracemont Atom cores; so everything below the Alder Lake Pentiums/Celerons has been the last-generation Tremont Atoms. So larger changes may be afoot for Intel’s cheapest laptop product segment.


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    #11572

    Anandtech: EVGA and NVIDIA To Split: EVGA Won’t Make Next-Gen NVIDIA Cards

    In a move that will have significant repercussions for the video card industry in North America and Europe, EVGA today has announced that the company is parting ways from NVIDIA. As a result, the company will not be producing video cards based on NVIDIA’s next-generation of GPUs – and won’t be immediately switching allegiance to AMD or Intel, either. Consequently, NVIDIA is losing their largest add-in board (AIB) in North America, and the broader North American video card market is losing one of its biggest and best-known vendors.
    In a brief announcement posted on EVGA’s forums, the company outlined their parting from NVIDIA, while underscoring that this affects the next-generation of video cards, and that EVGA will continue to provide current-gen products and support existing customers.


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    #11573

    Anandtech: AMD Launches Mendocino APUs: Zen 2-based Ryzen and Athlon 7020 Series with

    Even though the main focus this month has been on AMD's upcoming launch of its Ryzen 7000 desktop series processors based on the Zen 4 architecture, AMD is also in the process of launching its 7020 series of processors designed for entry-level mobile, codenamed Mendocino. It has launched four new SKUs for mobile, including two Ryzen series models and two Athlon variants, all based on its Zen 2 architecture.
    As we learned in May, AMD's Zen 2 based 'Mendocino' APUs are designed as part of its lower-end mobile processor stack for entry-level thin notebook and laptop solutions. The affordable APUs incorporate up to 4 Zen 2 CPU cores, as well as AMD's integrated Radeon 610M graphics, all with a maximum TDP of 15W.
    Focusing specifically on the AMD 7020 series APUs announced today, the top SKU is the Ryzen 5 7520U. Using AMD's new Ryzen Mobile CPU numbering system, the 7520U is a model year 2023 chip under the Ryzen 5 series banner using its Zen 2 core architecture. The U suffix technically means 15-28W, but in this case AMD has confirmed that all of the current chips have a max TDP of 15W.
    The AMD Ryzen 5 7520U benefits from a 2.8 GHz base frequency across its four cores, with a 1T boost frequency of up to 4.3 GHz. It also includes a total of 6MB of cache, split between 4MB of L3 and 2MB of L2 (512KB per core).
    AMD Ryzen 7020 Series (Mendocino) Lineup
    SKU Cores/Threads CPU Frequency
    (Base)
    CPU Frequency
    (1T Boost)
    Cache iGPU TDP
    Ryzen 5 7520U 4C / 8T 2.8 GHz 4.3 GHz 2MB L2 + 4MB L3 Radeon 610M 15 W
    Ryzen 3 7320U 4C / 8T 2.4 GHz 4.1 GHz 2MB L2 + 4MB L3 Radeon 610M 15 W
    Athlon Gold 7220U 2C / 4T 2.4 GHz 3.7 GHz 1MB L2 + 4MB L3 Radeon 610M 15 W
    Athlon Silver 7120U 2C / 4T 2.4 GHz 3.5 GHz 1MB L2 + 2MB L3 Radeon 610M 15 W
    Moving down the stack is the Ryzen 3 7320U, which has four cores and eight threads but a base core clock speed of 2.4 GHz and a single core boost frequency of up to 4.1 GHz. Like the Ryzen 5 7520U, it also benefits from a combined cache of 6 MB across its L2/L3 cache structure.
    Looking at the Athlon-branded 7020 series chips, the Athlon Gold 7220U offers two cores and four threads, with a base frequency of 2.4 GHz, a single core boost frequency of up to 3.7 GHz, and 5 MB of shared L2/L3 cache. The Athlon Silver 7120U is pretty much the Athlon Gold 7220U, but it has a slightly lower 1T boost frequency of 3.5 GHz and half as much L3 cache (for a total of 3MB instead of 5MB)

    AMD Radeon 610M with two graphics cores for performance at the entry-level
    All of today's announced AMD's Zen 2 Ryzen and Athlon 7020 series will support up to 32 GB of LPDDR5 memory in a dual-channel (64-bit) configuration, and feature two graphics cores/CUs based on its RNDA 2 technology, which AMD is branding the Radeon 610M integrated graphics chip. All four mobile APUs will also include a TDP of up to 15 W.
    At the time of writing, AMD hasn't revealed specific pricing aside from a total laptop price range of between $399 and $699. However, it has announced that its AMD Ryzen 7020 Series Ecosystem partners are Acer, HP, Lenovo, and Microsoft, with notebooks featuring these chips expected to start appearing on retail shelves sometime in Q4 2022.
    Source: AMD


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    #11574

    Anandtech: NVIDIA: H100 Hopper Accelerator Now in Full Production, DGX Shipping In Q1

    With NVIDIA’s fall GTC event in full swing, the company touched upon the bulk of its core business in one way or another in this morning’s keynote. On the enterprise side of matters, one of the longest-awaited updates was the shipment status of NVIDIA’s H100 “Hopper” accelerator, which at introduction was slated to land in Q3 of this year. As it turns out, with Q3 already nearly over H100 is not going to make its Q3 availability date. But, according to NVIDIA the accelerator is in full production, and the first systems will be shipping from OEMs in October.



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    #11575

    Anandtech: Intel Announces Serpent Canyon: Alder Lake and Arc Amalgamate in NUC12 Ent

    Intel officially unveiled the final member of their Alder Lake-based NUC12 family earlier this week. The NUC12 Enthusiast (like the three previous Enthusiast NUCs) caters to the gaming / creators market looking for a small form-factor machine with a discrete GPU.
    As a refresher, Intel created the NUC Enthusiast category back in 2016 with the introduction of the Skull Canyon NUC (NUC6i7KYK). With a 4" x 5" motherboard, it had a slightly larger footprint compared to the traditional NUCs. However, the increased size allowed the incorporation of a 45W TDP processor with increased graphics flex. The second generation Hades Canyon moved to a slightly larger board (5.5" x 8"), while retaining the industrial design of the Skull Canyon NUC. It used the Kaby Lake-G processors with a Kaby Lake processor and an AMD GPU packaged together (with a total TDP budget between 65W and 100W). The NUC11 Enthusiast (Phantom Canyon) went for a more traditional gaming notebook-type architecture with a Tiger Lake-U Core i7-1165G7 and a NVIDIA RTX 2060 laptop GPU.
    The NUC12 Enthusiast retains a similar architecture. The key difference lies in the fact that this is first NUC to utilize Intel's Arc discrete GPU. The specifications of the GPU are much more powerful than the NVIDIA RTX2060, and this has resulted in a redesign of the cooling solution as well as the chassis dimensions compared to the NUC11 Enthusiast.
    Similar to the Phantom Canyon family, Serpent Canyon will also come in two varieties - a barebones version, and another with a 1TB SSD / 16GB of DDR4-3200 RAM / Windows 11 Home pre-installed. The SKUs utilize the Intel Core i7-12700H notebook processor and the Intel Arc A770M discrete GPU with 16GB of VRAM.
    The NUC12 Enthusiast sports a rich set of I/Os. There are two Thunderbolt 4 ports (one in the front and one in the rear) that also carry the display output from the Intel Iris Xe Graphics in the Core i7-12700H. Two USB 3.2 Gen 2 Type-A ports and a SDXC UHS-II slot, along with an audio jack and a quad-microphone array round out the front panel. On the rear, we have an audio output jack (supporting TOSLINK), a single 2.5 Gbps LAN port, four USB 3.2 Gen 2 Type-A ports (with a hub chip behind), and the display outputs (1x HDMI 2.1 4Kp60 and 2x Display Port 2.0 (1.4 certified)) from the Intel Arc A770M.
    The table below compares the specifications of the flagships in the last three generations of Enthusiast NUCs.
    Intel Enthusiast NUCs
    Model Serpent Canyon
    (NUC12SNKi72)
    Phantom Canyon
    (NUC11PHKi7C)
    Hades Canyon
    (NUC8i7HVK)
    CPU Intel Core i7-12700H
    Alder Lake, 6P + 8E / 20T
    4.7 GHz (P) / 3.5 GHz (E)
    45W TDP (Up to 115W)
    Intel Core i7-1165G7
    Tiger Lake-U, 4C/8T
    2.8 - 4.7 GHz
    28W TDP
    Intel Core i7-8809G
    Kaby Lake, 4C/8T
    3.1 - 4.2 GHz
    100W Package TDP
    GPU Intel® Intel Arc A770M 16GB GDDR6 @ 1.65 GHz (Discrete) NVIDIA GeForce RTX 2060 6GB GDDR6 (N18E-G1-B Notebook Class 115W) @ 1.285 GHz (Discrete)
    Intel® Iris® Xe Graphics (96EU) @ 1.3 GHz (Integrated / On-Die)
    Radeon RX Vega M GH 4GB HBM2 @ 1.19 GHz (Discrete / On-Package)
    Intel® HD Graphics 630 @ 1.1 GHz (Integrated / On-Die)
    Memory 2x DDR4-3200 SODIMMs
    1.2V, 64GB max.
    2x DDR4-2400+ SODIMMs
    1.2V, 32GB max.
    Motherboard 7" x 8"(Custom) 5.5" x 8" (Custom)
    Storage 2x M.2 22x80 (key M) PCIe 4.0 x4 NVMe SSD (CPU-attached)
    1x M.2 22x80 (key M) SATA3 or PCIe 3.0 x4 NVMe SSD (via PCH)
    1x M.2 22x80/110 (key M) PCIe 3.0 x4 NVMe/AHCI SSD
    1x M.2 2280 (key M) SATA3 or PCIe 3.0 x4 NVMe/AHCI SSD
    2x M.2 22x42/80 (key M) SATA3 or PCIe 3.0 x4 NVMe/AHCI SSD
    I/O Ports 2x Thunderbolt 4 Fast-Charging (front + rear)
    1x USB 3.2 Gen 2 Type-A (front)
    1x USB 3.2 Gen 2 Type-A Fast-Charging (front)
    4x USB 3.2 Gen 2 Type-A (rear)
    1x SDXC UHS-II Card Slot (front)
    CIR (front)
    1x SATA III Power + Data Internal Header
    2x USB 2.0 Internal Header
    2x Thunderbolt 3 (rear)
    4x USB 3.2 Gen 1 Type-A (rear)
    1x USB 3.2 Gen 2 Type-A (front)
    1x USB 3.2 Gen 2 Type-C (front)
    1x USB 3.2 Gen 1 Type-A Fast-Charging (front)
    1x SDXC UHS-I Card Slot (front)
    CIR (front)
    1x SATA III Power + Data Internal Header
    2x USB 2.0 Internal Header
    Networking Intel Killer Wi-Fi 6E AX1690i
    (2x2 802.11ax Wi-Fi inc. 6 GHz + Bluetooth 5.2 module)
    1 × 2.5 GbE ports (Intel I225-LM)
    Intel Wi-Fi 6 AX201
    (2x2 802.11ax Wi-Fi + Bluetooth 5.1 module)
    1 × 2.5 GbE port (Intel I225-LM)
    Intel Dual Band Wireless-AC 8265
    (2x2 802.11ac Wi-Fi + Bluetooth 4.2 module)
    2 × GbE ports (Intel I219-LM + Intel I210-AT)
    Display Outputs 2x DP 2.0 (1.4 certified) (via Thunderbolt 4 Type-C, iGPU)
    1x HDMI 2.1 (up to 4Kp60) (rear, dGPU)
    2x DP 2.0 (1.4 certified, dGPU)
    2x DP 1.4a (via Thunderbolt 4 Type-C ports, iGPU Display Pipe)
    1x mini-DP 1.4a (rear, dGPU, up to 8Kp60, MST)
    1x HDMI 2.0b (rear, dGPU, up to 4Kp60)
    1x HDMI 2.0a (front, dGPU)
    1x HDMI 2.0a (rear, dGPU)
    2x mini-DP 1.3 (rear, dGPU)
    2x DP 1.3 (via Thunderbolt 3 Type-C ports, dGPU)
    Audio 7.1 digital (over HDMI and DisplayPort)
    L+R+mic (front)
    L+R+TOSLINK (rear)
    Audio Codec Realtek ALC274 Realtek ALC700
    Enclosure Metal and plastic
    Kensington lock with base security
    Power Supply 330W (19V @ 16.9A) Adapter 230W (19V @ 12.1A) Adapter
    Dimensions 230mm x 180mm x 60mm / 2.5L 221mm x 142mm x 42mm / 1.3L 221mm x 142mm x 39mm / 1.2L
    Miscellaneous Features Vertical stand included Vertical stand and VESA mount included VESA mount included
    Lid with customizable RGB LED illumination behind user-replaceable mask
    CEC support for HDMI ports
    Front-panel CIR support for IR remotes
    Status LEDs in front panel
    Beam-forming microphone array
    3-year warranty
    The block diagram below gives some insights into the design of the system in relation to the I/O capabilities.
    Despite the Arc A770M supporting a PCIe 4.0 x16 link to the host processor, the Serpent Canyon configuration keeps the connection at x8. Both PCIe 4.0 M.2 2280 slots are CPU-attached ones. The SD card slot is connected via a PCIe lane instead of USB - this should allow maximum possible performance for different SD cards. While the official specifications indicate that the slot is UHS-II, the technical product specifications document also indicates SD Express support. This depends on the exact SD controller being used in the board, and we have reached out to Intel for clarification. Three of the four Type-A ports in the rear are enabled by a 1:4 Gen 2 hub, which is not ideal in terms of bandwidth sharing. However, the availability of additional ports is always welcome. On the display front, the front Thunderbolt 4 port can support a display bandwidth of around 17 Gbps, while the rear port can support up to 35 Gbps. With multi-stream support on the Type-C port, the system can drive a total of six diifferent displays - five at 4Kp144 (DP/Alt-DP) and one at 4Kp60 (HDMI). Two 8Kp60 displays can also be driven using a multi-cable / -port solution.
    Intel also provided a complete teardown picture along with the press release. The combined cooling solution for the CPU and dGPU with the thermal shroud and heat pipes is clearly seen. Whether this solution aids in / enables performance tuning via the Intel Deep Link Dynamic Power Share feature remains to be seen in hands-on evaluation.
    Overall, the Serpent Canyon NUC is a huge step-up for Intel. Moving to a fully in-house solution for both the CPU and dGPU in a small form-factor portable machine will enable the company to gain a larger share of the gaming / creator systems / eSports total addressable market. Based on paper specifications, the level of integration and gaming prowess in the NUC12 Enthusiast should be well beyond what has traditionally been possible in this form factor. On the pricing front, the Mini-PC version with pre-installed OS will come in at $1350, while the barebones version can be purchased for $1180 later this month. These numbers roughly track the introductory pricing for previous-generation Enthusiast NUCs.


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    #11576

    Anandtech: AMD Zen 4 Ryzen 9 7950X and Ryzen 5 7600X Review: Retaking The High-End

    During AMD’s ‘together we advance_PCs’ event at the end of August, the company unveiled its Ryzen 7000 series of desktop processors, with four SKUs aimed at the mid-range and high-end market segments. After whetting the audience's appetites with that announcement, tomorrow AMD will be officially releasing their long-awaited next-generation CPUs.
    The launch of the Ryzen 7000 series brings a lot to digest, for casual fans and hardcore hardware enthusiasts alike. For their newest lineup of chips, AMD has given their desktop CPU platform a top-to-bottom update, not only releasing new CPUs, but releasing an entirely new platform, socket AM5 around it. As a result, for the first time in a few generations these chips are not drop-in compatible with existing AMD motherboards. But at the same time it has allowed AMD to deliver on a collection of platform improvements, ranging from DDR5 and PCIe 5.0 support to improved power management capabilities. AMD has even managed to sneak an entry-level Radeon RDNA2 architecture-based iGPU into the chip.

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    #11577

    Anandtech: NZXT Unveils N7 Z790 Motherboard for Intel 13th Gen Core Series

    With a lot of news and info dropping on Intel's latest Z790 chipset using the LGA1700 socket, NZXT has pulled the trigger and announced its N7 Z790 motherboard. Available in either white or black, it features a 2.5 GbE controller, Wi-Fi 6E CNVi, benefits from support for PCIe 5.0, and includes three M.2 slots.
    In addition to the announcement of Intel's 13th Gen Core series processors, codenamed Raptor Lake, NZXT has announced its plans to launch the N7 for Z790. As we've seen from NZXT motherboards in the past, the N7 Z790 has a large swathe of armor covering the board and is available in both back and white color schemes. It should be noted that neither the black nor white model includes any integrated RGB LED lighting. Typical with an NZXT product, the N7 Z790 comes with support with their CAM software.
    Some of the NZXT N7 Z790's main features include one full-length PCIe 5.0 x16 slot, two full-length PCIe 4.0 slots operating at x4/x4, and two PCIe 3.0 x1 slots. Also present on the NZXT N7 Z790 are three M.2 slots, two with support for PCIe 4.0 x4 NVMe drives and one with support for both PCIe 4.0 x4 and SATA. NZXT also includes four SATA ports with support for RAID 0, 1, 5, and 10 arrays for more conventional storage. NZXT is also advertising support for DDR5-6000 memory, with a combined total of 128 GB supported across four slots.
    NZXT is also advertising a 16+1+2-phase power delivery, with one 8-pin EPS 12 V and one 4-pin 12 V power connector pairing to deliver power to the CPU. Powering the rest of the board's components is a 24-pin 12V power connector.
    The rear I/O is modest yet practical, with two USB 3.2 G2 Type-A and three USB 3.2 G1 Type-A; interestingly, NZXT doesn't include any rear panel Type-C connectivity. Also on the rear panel are five 3.5 mm audio jacks and one S/PDIF optical output powered by a Realtek ALC1220 HD audio codec, with two antenna ports for an unspecified Wi-Fi 6E CNVi. Finishing off the rear panel is a single HDMI TM video output, with one Realtek RTL8125BG 2.5 GbE controller.
    Gallery: NZXT Unveils N7 Z790 Motherboard for Intel 13th Gen Core


    The NZXT N7 Z790 is scheduled to release with an MSRP of $300 and will be available in Q4 2022 in the USA. NZXT hasn't shared whether or not this will be released in other regions.
    Source: NZXT


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    #11578

    Anandtech: Intel Innovation 2022 Keynote: Live Blog (9am PT, 4pm UTC)

    It's time again for another Intel event, Intel Innovation 2022. With plenty of tech things to reveal to the world ranging from AI, client computing, and data center/cloud computing. Intel is also expected to showcase the generation of products for consumers.
    With AMD's big Ryzen 7000 launch having only taken place just yesterday, Intel is expected to showcase its next generation of products for consumers. Leading the keynote will be visionary Intel CEO Pat Gelsinger.
    The live blog will start with the opening keynote from Intel Innovation at 9am PT / 16:00 UTC / 18:00 CEST.


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    #11579

    Anandtech: Intel Demos Sapphire Rapids Hardware Accelerator Blocks In Action At Innov

    With Intel’s annual Innovation event taking place this week in San Jose, the company is looking to recapture a lot of technical momentum that has slowly been lost over the past couple of years. While Intel has remained hard at work releasing new products over the time, the combination of schedule slips and an inability to show off their wares to in-person audiences has taken some of the luster off the company and its products. So for their biggest in-person technical event since prior to the pandemic, the company is showing off as much silicon as they can, to convince press, partners, and customers alike that CEO Pat Gelsinger’s efforts have put the company back on track.
    Of all of Intel’s struggles over the past couple of years, there is no better poster child than their Sapphire Rapids server/workstation CPU. A true next-generation product from Intel that brings everything from PCIe 5 and DDR5 to CXL and a slew of hardware accelerators, there’s really nothing to write about Sapphire Rapids’ delays that hasn’t already been said – it’s going to end up over a year late.
    But Sapphire Rapids is coming. And Intel is finally able to see the light at the end of the tunnel on those development efforts. With general availability slated for Q1 of 2023, just over a quarter from now, Intel is finally in a position to show off Sapphire Rapids to a wider audience – or at least, members of the press. Or to take a more pragmatic read on matters, Intel now needs to start seriously promoting Sapphire Rapids ahead of its launch, and that of its competition.
    For this year’s show, Intel invited members of the press to see a live demo of pre-production Sapphire Rapids silicon in action. The purpose of the demos, besides to give the press the ability to say “we saw it; it exists!” is to start showing off one of the more unique features of Sapphire Rapids: its collection of dedicated accelerator blocks.
    Along with delivering a much-needed update to the CPU’s processor cores, Sapphire Rapids is also adding/integration dedicated accelerator blocks for several common CPU-critical server/workstation workloads. The idea, simply put, is that fixed function silicon can do the task as quickly or better than CPU cores for a fraction of the power, and for only a fractional increase in die size. And with hyperscalers and other server operators looking for big improvements in compute density and energy efficiency, domain specific accelerators such as these are a good way for Intel to deliver that kind of edge to their customers. And it doesn’t hurt either that rival AMD isn’t expected to have similar accelerator blocks.

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