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Thread: Anandtech News

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    #7521

    Anandtech: Acer Releases ET322QK LCD: 31.5-inch VA, 4K, HDR10, FreeSync, Around $500

    Acer has released its new display designed primarily for console gaming and HTPCs. The ET322 combines a fairly large diagonal size, a 4K resolution, and HDR10 capability with a relatively low price. The product will be available only in Japan (at least initially), but nothing prevents Acer from releasing something similar on other markets.
    Acer’s ET322 QKwmiipx is based on a VA panel with 3840×2160 resolution, 300 nits brightness, 3000:1 static contrast ratio, 4 ms response time and 178° viewing angles. As a bonus feature, the monitor supports AMD's FreeSync dynamic refresh rate technology, but for some reason the manufacturer does not disclose either the maximum refresh rate of the unit or FreeSync's operational range.
    The display formally supports HDR10 data, but its level of brightness is considered too low for HDR, so the actual HDR user experience is something that remains to be seen. In addition, the Acer ET322 has the so-called 6-axis color adjustment feature that promises a more realistic color reproduction by enabling users to manually regulate RGB and CMY color components as well as adjust Saturation and Hue. As for connectivity, the Acer ET322 has two HDMI 2.0 inputs with HDCP 2.2 support, so they can be plugged to PCs, consoles, STBs, UHD Blu-ray players and so on. To further simplify setups featuring the display, it has two 2 W speakers and a 3.5-mm audio jack.
    Acer ET322QK Display
    ET322QKwmiipx
    Panel 31.5" VA
    Native Resolution 3840 × 2160
    Refresh Rate unknown
    Dynamic Refresh Rate Technology AMD FreeSync
    Response Time 4 ms
    Brightness 300 cd/m²
    Contrast 3000:1
    Viewing Angles 178°/178° horizontal/vertical
    Color Saturation 100% sRGB
    HDR Support HDR10
    Inputs 2 × HDMI 2.0 with HDCP 2.2
    Audio 2 × 2 W speakers
    headphone jack
    Mechanical Chassis Color White
    VESA Wall Mounting 100 × 100 mm
    Price ¥55,000 - ¥59,000
    (around $485 - $517)
    Detailed Information Link
    The ET family of displays from Acer is a rather special lineup that is sold only in Japan. The ET-series monitors are designed primarily for those who want to replace their TVs with large displays and use them with game consoles, PCs, or media players. The ET LCDs feature stands that resemble those of TVs: they cannot swivel or pivot, their tilt adjustments are very limited (if present at all). Meanwhile, such monitors always support features like picture-in-picture and picture-by-picture because owners of large displays may want to watch content from different sources at the same time.
    The Acer ET322QKwmiipx hit the market in Japan on November 10. PC Watch estimates that its market price will be around ¥55,000 (approximately $485), which is not too high for the Land of the Rising Sun and which will likely drop over time. Right now. the Acer ET322 is available from Amazon.co.jp for ¥58,646 (around $517). Meanwhile, Acer’s ET430Kwmiiqppx (43”, 4K, IPS) display is available for ¥62,196 ($547) from the same retailer.
    Buy Acer KG281K: 28-inch, 4K, FreeSync on Amazon.com
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    Sources: Acer, PC Watch, Hermitage Akihabara


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    #7522

    Anandtech: HPE Unveils ProLiant DL385 Gen10: Dual Socket AMD EPYC

    In a video on YouTube, which has since been hastily removed, Hewlett Packard Enterprise (HPE) opened the can a little early on announcing a new dual socket AMD EPYC based system in a 2U form factor. As pointed out over at ServeTheHome, this is an important metric in the EPYC story: it is one of the first machines from a top 3 server equipment manufacturer.
    Before the video was removed, it showed a dual-socket design with a full set of memory slots (that’s 32x, supporting a total of 4TB). Leveraging the 128 PCIe lanes that the configuration would bring, the DL385 Gen10 showed support for up to 24 NVMe drives (or 30 2.5” SATA SSDs) as well as either three double-wide GPUs or five single-slot GPUs. The aim for such a server seems to be a crossover between storage and compute, or the ability to maintain constant compute throughput with plenty of memory and fast local storage, such as large datasets for AI or deep learning network training. Redundant power supplies and HPE iLO management are also featured.
    In AMD’s press release for this week’s Supercomputing 17 event, HPE was listed as one of the vendors now ready to start offering availability of EPYC-based systems, now that the major cloud and hosting providers are getting to grips with the technology. HPE VP and GM, Justin Hotard, was quoted in AMD’s press release, saying that ‘AMD delivers the power … to help break barriers’, but no official or specific products were mentioned in the quote given to AMD. Along those lines, we would expect HPE to have its own announcement, probably this week as it is SuperComputing, although posting/deposting a video says a lot.
    We suspect that when HPE pull the proper trigger on the launch, the video will be re-enabled and data sheets will start flowing. We will report when it happens, but here’s the video embed in case it comes online soon.
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    #7523

    Anandtech: Samsung Pre-Announces 16 Gbps GDDR6 Chips for Next-Gen Graphics Cards

    In a surprisingly early revelation, Samsung has confirmed their plans to produce GDDR6 memory. The announcement was made as a part of Samsung’s pre-CES marketing campaign and does not disclose any dates or timeframes. Though it is worth noting that with speeds up to 16Gbps, Samsung's chips are the fastest GDDR6 chips announced to date.
    Last week Samsung issued a press release covering its products that had been recognized as CES 2018 Innovation Awards winners. Among other things, Samsung mentioned a number of unreleased products, including the Exynos 9 Series 9810 SoC for the next Galaxy smarphone, GDDR6 memory, as well as the Gear IconX (2018) headphones. Though with a focus on the awards themselves, Samsung has released little in the way of information on the products receiving awards. And while it is clear why Samsung would decide to withhold details about upcoming products (competition, the company does not want to spoil the actual launch, etc.), it is noteworthy that CEA does not require participating products to be mass-produced, or at least have a clear commercial availability timeframe.
    GDDR6 is a memory standard that is set to be supported by all three leading DRAM manufacturers, so Samsung's participation has been expected. Less expected was any kind of announcement or reveal before the memory is shipping, as Samsung is notoriously tight-lipped about forthcoming memory products. Consequently and unfortunately, the announcement itself contains little details about the ICs themselves as well as the whole stack of GDDR6 products that Samsung is going to offer. What we do know is that they will feature data transfer rates of up to 16 Gbps at 1.35 V.
    Formally Announced GDDR6 Plans by DRAM Makers
    Micron Samsung SK Hynix
    Capacity 8 Gb unknown 8 Gb
    Data Rate Over 12 Gbps 16 Gbps 12 Gbps, 14 Gbps
    Voltage unknown 1.35 V 1.35 V
    Process Technology 16 nm 18 nm (?) unknown
    Availability Timeframe Early 2018 unknown Early 2018
    Ahead of full scale production, one of the big questions on our end is which process and fab(s) Samsung will be using for this cutting-edge memory, especially with the ongoing DRAM shortage. A natural suspect would be Samsung’s 18 nm fabrication process for DRAMs, but the South Korean giant has not confirmed it. Yet another question is capacity of the said GDDR6 16 Gbps chips. Given the transfer rates, it is reasonable to guess that we are dealing with 8 Gb chips – especially since Micron and Hynix have already announced their own 8Gb chips – but we do not know this for sure.
    Samsung is known for memory chips rated to run faster than competing offerings from its rivals. However, it's worth noting that AMD and NVIDIA don't always run new-generation memory at its maximum rated speed, often due to needing to nail down their memory controllers and firmwares. So the availability of 16Gbps chips does not necessarily mean that next year’s graphics cards will use Samsung's memory at its full speed.
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    #7524

    Anandtech: The GIGABYTE Aorus AX370-Gaming 5 Review: Dual Audio Codecs

    Today we are having a look at a LED-laden, gaming-focused, ATX motherboard from GIGABYTE: the Aorus AX370-Gaming 5. If a user wants LEDs for Ryzen at under $200, here is one of the primary contenders. Being part of GIGABYTE's gaming product line means we get SLI support, and GIGABYTE is using a gaming-focused network controller (one of two) and some overclocking options for the processor. The interesting part of this board, however, is the use of dual audio codecs: one for the rear panel and one for the front panel. To physically do this requires a couple of compromises, so we have put the board through its paces to see if it is worth buying.

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    #7525

    Anandtech: Ryzen Mobile Now On Sale: HP’s ENVY X360

    The biggest question when AMD formally launched its Ryzen Mobile platform was all about ‘when’. At the time AMD announced three primary partners and three systems, with the aim that all the units would be available before the holidays. When we spoke to the vendors, only HP seemed to have a closer date than ‘Q1’, with the Envy X360 planned for some time in November. This week it formally went on sale over at hp.com, and it seems to also be available at retail over at Best Buy.
    Stopped by @BestBuy today. Picked up the first @AMDRyzen mobile with @Radeon Vega graphics. Thanks to @HP team for great partnership. https://t.co/6LQGlEwnjQ pic.twitter.com/PYaJXlNbST
    — Lisa Su (@LisaSu) November 13, 2017
    We reported on the unit at launch: the HP Envy x360 with Ryzen Mobile is a 15.6-inch convertible laptop with a 1920x1080 edge-to-edge display, and will feature the AMD Ryzen 5 2500U quad-core SoC. This processor uses four of AMD’s Zen cores, running up to 3.6 GHz, paired with Vega 8 graphics (that’s 8 compute units, so 512 Vega SPs) running up to 1100 MHz with a 15W TDP. It is listed as having 6MB of cache, although this is split between 2 MB of L2 cache, and 4 MB of L3 cache (and the caches are very different in their use).
    At Ryzen Mobile launch, it was stated that the Envy x360 would only support 8 GB of DRAM maximum, which to most people was a little odd. Thankfully that is not the case, and HP offers up to 16 GB. HP initially offered the unit with a 4+4 GB DDR4-2400 dual-channel memory configuration, although that seems to have already been sold out, with 12 GB (4+8) and 16 GB (8+8) options left. The base storage option is a 1TB SATA hard drive, although for a premium HP does offer several PCIe NVMe SSD options or combinations therein.
    The design uses a full-size island-style backlit keyboard with a numeric keypad, and the unit comes with a 3-cell, 55.8 Wh battery, and Intel 802.11ac wireless connectivity. There is an IR camera for Windows Hello support, a USB-C with DisplayPort and with power capabilities, and HP lists the laptop as able to drive two UHD displays. HP’s partnership with Bang & Olufsen continues, handling the audio duties. It also features a stylus for Windows Ink.
    HP ENVY x360 Ryzen Mobile
    CPU AMD Ryzen 5 2500U
    Quad-core, Eight-thread,
    2.0GHz to 3.6GHz
    GPU AMD Radeon Vega 8 Graphics
    8 Radeon RX Vega CUs
    Up to 1100 MHz
    Display 15.6" 1920x1080 IPS with Touch
    Memory 8 GB (4+4) DDR4-2400
    12 GB (4+8) DDR4-2400
    16 GB (8+8) DDR4-2400
    Storage Up to 512 GB SSD
    Up to 1 TB HDD
    Up to 256GB SSD + 1TB HDD
    Wireless Intel 802.11ac w/Bluetooth 4.2
    I/O 1 USB-C 3.1 Gen 1 with DP 1.2 and Power
    2 USB 3.0
    1 HDMI
    Headset Jack
    Power 65W AC Adapter
    55.8 Wh Battery
    Dimensions 14.16" x 9.8" x 0.77"
    Weight 4.75 lbs
    Starting Price $699 with 8GB DRAM + 1TB HDD
    So when this laptop initially went on sale, the base configuration (8GB of memory, 1TB HDD) was being sold with an additional discount for $599 total. Very quickly it seems that the deal ran out, as well as the 8GB memory configuration. Currently, the website offers the 12GB memory configuration, still with the 1TB storage option, but for $805 and shipping set for 11/27. Obviously, this price is not as lucrative as the $599 price, but seems more than reasonable when compared to the Intel version. The Intel version, when not running a brand new $200 discount, features a Core i7-8550U with HD630 graphics, the same DRAM/storage combo, but with a non-IR enabled camera, for $930. It would be interesting to see how they match up in CPU performance, gaming performance, and power consumption.
    I am told we have a unit incoming for review. Watch this space.
    Gallery: Ryzen Mobile Now On Sale: HP’s ENVY X360


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    #7526

    Anandtech: Cheap Supercomputers: LANL has 750-node Raspberry Pi Development Clusters

    One of the more esoteric announcements to come out of SuperComputing 17, an annual conference on high-performance computing, is that one of the largest US scientific institutions is investing in Raspberry Pi-based clusters to aid in development work. The Los Alamos National Laboratory’s High Performance Computing Division now has access to 750-node Raspberry Pi clusters as part of the first step towards a development program to assist in programming much larger machines.
    Buy Raspberry Pi 3 Model B on Amazon.com
    The platform at LANL leverages a modular cluster design from BitScope Designs, with five rack-mount Bitscope Cluster Modules, each with 150 Raspberry Pi boards with integrated network switches. With each of the 750 chips packing four cores, it offers a 3000-core highly parallelizable platform that emulates an ARM-based supercomputer, allowing researchers to test development code without requiring a power-hungry machine at significant cost to the taxpayer. The full 750-node cluster, running 2-3 W per processor, runs at 1000W idle, 3000W at typical and 4000W at peak (with the switches) and is substantially cheaper, if also computationally a lot slower. After development using the Pi clusters, frameworks can then be ported to the larger scale supercomputers available at LANL, such as Trinity and Crossroads.
    “It’s not like you can keep a petascale machine around for R&D work in scalable systems software. The Raspberry Pi modules let developers figure out how to write this software and get it to work reliably without having a dedicated testbed of the same size, which would cost a quarter billion dollars and use 25 megawatts of electricity.” Said Gary Grider, leader of the High Performance Computing Division at Los Alamos National Laboratory.
    The collaboration between LANL and BitScope was formed after the inability to find a suitable dense server that offered a platform for several-thousand-node networking and optimization – most solutions on the market were too expensive, and anyone offering something like the Pi in a dense form factor was ‘just people building clusters with Tinker Toys and Lego’. After the collaboration, the company behind the modular Raspberry Pi rack and blade designs, BitScope, plans to sell the 150-node Cluster Modules at retail in the next few months. No prices were given yet, although BitScope says that each node will be about $120 fully provisioned using the element14 version of the latest Raspberry Pi (normally $35 at retail). That means that a 150-note Cluster Module will fall in around $18k-$20k each.
    The Bitscope Cluster Module is currently being displayed this week at Supercomputing 17 in Denver over at the University of New Mexico stand.
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    Sources: BitScope, EurekAlert
    Gallery: Cheap Supercomputers: LANL has 750-node Raspberry Pi Development Clusters




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    #7527

    Anandtech: ECS Adds LIVA Q to Lineup: a 5 Oz Apollo Lake Nettop with HDMI 2.0 for Con

    ECS has expanded its family of ultra-compact LIVA-branded PCs for consumers with a new model called the LIVA Q, which is smaller than some mice. The new system is an upgraded and rebranded version of the company’s PB01CF launched earlier this year. Both nettops are based on Intel’s Apollo Lake platform, but have different positioning: the PB01CF is aimed at digital signage and similar applications, whereas the LIVA Q is meant for consumers and SOHO.
    The ECS LIVA Q is based on either quad-core Pentium N4200 or dual-core Celeron N3350 and therefore its more advanced version offers higher general purpose and graphics performance than the PB01CF. The new system also offers up to 4 GB of LPDDR4 memory and up to 64 GB of eMMC storage, neither of the options are available on the product released earlier this year. As for connectivity, the LIVA Q has an 802.11ac Wi-Fi + Bluetooth 4.1 wireless module (the PB01CF seems to have BT disabled), a GbE connector, two USB Type-A ports, a microSD card reader, as well as an HDMI 2.0 display output (implemented using a bridge chip) capable of 4Kp60 (vs. HDMI 1.4 on the PB01CF) and supporting the HDMI-CEC function for remotes. The LIVA Q system does not have any analog connectors for audio or video, which may be considered as a limitation by some consumers.
    The ECS PB01CF is one of the smallest contemporary desktop computers these days and given the ongoing trend towards miniaturization of desktops, it was very plausible for the manufacturer to bring its 0.15-liter nettop that measures 7×7×3.1 cm to the consumer space. Since the original unit was architected rather precisely for digital signage and very basic computing, ECS introduced some performance and connectivity upgrades to the consumer model. The enhancements clearly make the LIVA Q more consumer-friendly than the PB01CF is, but the system is still somewhat behind the LIVA Z in terms of features and performance, so there will be no competition in the LIVA lineup.
    Brief Specifications of ECS' 5 Oz Nettops
    LIVA Q
    Performance
    LIVA Q
    Value
    PB01CF
    CPU Pentium N4200
    4C/4T
    1.1 – 2.5 GHz
    2 MB cache
    6 W
    Celeron N3350
    2C/2T
    1.1 – 2.4 GHz
    2 MB cache
    6 W
    PCH integrated
    Graphics Intel HD Graphics 505
    18 EUs
    Intel HD Graphics 500
    12 EUs
    Memory 2 GB or 4 GB LPDDR4 2 GB LPDDR4
    Storage 32 GB or 64 GB eMMC 32 GB eMMC
    Wi-Fi IEEE 802.11ac with an Intel controller
    Bluetooth 4.1 not listed
    Ethernet Gigabit Ethernet with RJ45 connector
    Display Outputs 1 × HDMI 2.0
    up to 4Kp60
    (may not be available on all SKUs)
    1 × HDMI 1.4
    up to 4Kp30
    Audio via HDMI
    USB 1 × USB 3.0 Type-A (5 Gbps)
    1 × USB 2.0 Type-A (480 Mbps)
    Card Reader microSD card reader
    Dimensions 70 mm × 70 mm × 31 mm (0.15 liters, 5 ounces)
    PSU External External 24 W
    VESA Mounts 75 mm/100 mm
    OS Support Microsoft Windows 10 64-bit
    Ubuntu 16.04 LTS
    Microsoft Windows 10 Home 64-bit
    ECS has not touched upon ETA and MSRP for the LIVA Q. Given that the nettop can feature various configurations, its price will vary as well. Just in case you are curious, the bigger Apollo Lake-based LIVA Z costs from $170 to $250 in the U.S.
    Gallery: ECS LIVA Q


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    #7528

    Anandtech: Lenovo Announces New ThinkStation P520/P520C and ThinkPad 52s: Up to 18 Co

    Today, Lenovo is announcing a new line of workstations under the ThinkStation P520 banner. Dubbed the ThinkStation P520 and ThinkStation P520C, the new workstations support Intel's new Xeon-W series processors from the quad-core Xeon W-2123, up to the 18 Core behemoth W-2195, and and paired with NVIDIA's Quadro professional graphics. The flagship P520 is geared towards creative professionals working with 3D animation and visual effects, while the P520c is a more cost-effective unit designed for educators and students.
    Meanwhile, along with the two desktop workstation, Lenovo is also releasing the ThinkPad 52s, their first quad-core Ultrabook mobile workstation. The 52s offers 8th Generation Intel Core i5/i7 processors as well as NVIDIA's Quadro graphics.
    The ThinkStation P520 is able to support the 18 core flagship Xeon W-Series processor W-2123 on the C422 chipset with support up to 256GB of DDR4 memory using its eight DRAM slots. For Graphics, the P520 supports up to 2x NVIDIA Quadro P6000 cards able to deliver high-performance in demanding 3D applications. The chassis supports a total of eight drives, up to four internal bays, with either six 2.5(up to 12TB) or 3.5-inch (up to 36TB) and M.2(up to 2TB). Intel VROC is supported for NVMe SSDs, while RAID 0, 1,5, and 10 are options for SATA based storage. Connectivity wise, there are four USB 3.1 (5 Gbps) Type-A connectors an optional Thunderbolt 3 Type-C connector (via FLEX Module for front bay) as well as Microphone and Headphone jacks for front port connectivity.
    The back consists of four USB 3.1 (5 Gbps) Type-A ports, two USB 2.0 ports, two PS/2 ports for keyboard and mouse, Gigabit Ethernet, Audio, eSATA and Firewire connectivity. Wireless duties are managed by Intel Dual Band Wireless AC8265 device offering 2T/2R 2.4/5GHz and Bluetooth 4.2. The 520 has an optional 15-in-1 card reader (9-in-1 included), as well as a 9mm slim ODD.
    The ThinkStation P520c supports the same Xeon W series CPUs, up to the 18 core W-2123, but instead of 256GB DRAM support, it offers 128GB DDR4 2666 with four DRAM slots. The Graphics are different as well with the P520c supporting up to a single NVIDIA Quadro P5000 graphics card. Storage capacity is a bit less on here with the P520c supporting a total of six drives; four 3.5-inch (up to 16TB) or four 2.5” (up to 8TB). It supports RAID 0, 1, 5, and 10 on SATA as well as VROC support for NVMe drives. Connectivity for 520c front ports are two USB 3.1 (5 Gbps) Type-A ports, Microphone/Headphone jacks, as well as optional Thunderbolt 3 Support via the FLEX module in the front bay.
    The back panel has four USB 3.1 (5 Gbps) ports, two USB 2.0 ports, Gigabit Ethernet, Audio connections, eSATA, and Firewire connectivity. Wireless functionality is also handled by the Intel Dual Band Wireless AC8265 device. Optional removable storage for the 520c consists of either a 9-in-1 or 15-in-1 media card readers a 9mm ODD, or front accessible drive tray.
    The overall aesthetics of the P520/P520C has not changed at all from its predecessors. The 520 is a rack-mountable tower measuring 6.5” x 18” x 17.3” while the 520c is a (6.9” x 16.8” X 14.8”) without a designation for being rack mountable. The cases are black with hexagon grills in front along with a red line at the top for some color.
    Lenovo ThinkStation P520 and P520c
    P520 P520c
    Warranty Period 1-4 Year Warranty
    Product Page N/A
    Price ($US) N/A
    Type Workstation
    Processor Family Intel Xeon W Series Processors (up to 18c 4.5 GHz)
    Processors W-2123 to W-2195
    Memory Up to 256GB DDR4-2666 Up to 128GB DDR4 2666
    Network Connectivity Gigabit Ethernet
    Intel Dual Band Wireless AC-8265 - 2T/2R + Bluetooth 4.2
    Internal Storage Up to 8 Total Drives
    Max 3.5" = 6 (36TB)
    Max 2.5" = 6 (12TB)
    Max M.2 = 2 (2TB)
    Up to 4 Total Drives
    Max 3.5" = 4 (16TB)
    Max 2.5" = 4 (8TB)
    Max M.2 = 2 (2TB)
    Graphics Up to 2x NVIDIA Quadro P6000 Up to NVIDIA Quadro P5000
    Expansion Slots 2 x PCIe x16 Gen 3
    1 x PCIe x8 Gen 3
    2 x PCIe x4 Gen 3
    1 x PCI
    2 x PCIe x16 Gen 3
    1 x PCIe x8 Gen 3
    2 x PCIe x4 Gen 3
    Display N/A
    Ports and Connectors (Back) 4 x USB 3.0
    2 x USB 2.0
    2 x PS/2
    1 x Gigabit Ethernet
    1 x Audio Line-In
    1 x Audio Line-Out
    1 x Microphone-In
    1 x eSATA
    1 x Firewire
    Ports and Connectors
    (Front)
    4 x USB 3.0
    1 x Mic/Headphone Combo
    1 x Thunderbolt 3 (Type-C)
    2 x USB 3.0
    1 x Microphone
    1 x Headphone
    1 x Thunderbolt 3 (Type-C)
    Dimensions 18" x 6.5" x 17.3"
    (Rack Mountable)
    16.8" x 6.9" x 14.8
    Gallery: Lenovo P520 and P520c Gallery


    Lenovo ThinkPad P52s

    The P52s, like the desktop workstations above, are a generational upgrade in that the internals have been updated to the latest hardware. In this case, Lenovo is offering increased core count and storage, while in true Lenovo business laptop fashion, the looks essentially stay the same.
    The P52s laptop uses the latest 8th Generation Intel Core i5/i7 processors, likely from the U-series processors which the P51 used, upgraded to the 8th generation i5-8250U up to i7-8650U. For graphics, it will use a NVIDIA Quadro P500 video card versus the M520 for graphics in the P51s. There are three 15.6” monitor options an available; a 1080p IPS, a 1080p IPS touchscreen, or a 4K UHD is also available. It supports up to 32GB of DDR4 2400 MHz DRAM in two SODIMM slots. Mass storage options include a single 5400 RPM HDD up to 2TB and up to a 1TB NVMe SSD. Battery options include a fixed 4-Cell 32WHr front battery with an upgradeable rear batter location. The options for the removable battery are 3-Cell (24WHr), 6-Cell (48WHR), or 6-Cell (72WHr). The included power supply is 65W.
    Connectivity on the P52s consists of two USB 3.0 ports (one always-on charging), USB-C, Thunderbolt 3 support, HDMI 1.4, Gigabit Ethernet, mic/headphone combo jack, and an (optional) smart card reader. Wireless duties are handled by the Dual Band Intel 8265 2T/2R with Bluetooth 4.1. WWAN duties are handled through Sierra EM7565, a 4G LTE-A embedded device, and the Fibocom L831-EAU. Also integrated is a 720p camera and optional IR camera. Overall, the P52s improves upon the P51 in storage options, the addition of integrated 4G capabilities, along with a nice bump in core count - doubling that of the P51. Like the workstations above, there doesn’t appear to be any obvious aesthetic changes here either. Just a hardware upgrade.
    The P520 and P520c have ISV certifications for Adobe, Autodesk, AVID, Altair, AVEVA, Bentley, Dassault, Nemetschek, PTX, Siemens, Barxo, Eizo, and Mckesson software. The P52s is ISV certified for Autodesk, AVID, Bentley, Dassault, PTC, and Siemens software.
    The ThinkPad 51s, the previous generation model, is currently starting at $962 so we expect the pricing around there, if not a bit higher. Pricing nor availability was mentioned in the documentation for the P52s or the P520/P520c Lenovo provided, but we expect to see these updated ThinkStations and ThinkPad on the market soon.
    Lenovo ThinkPad P52s
    P52s
    Warranty Period 1-4 Year Warranty
    Product Page N/A
    Price ($US) N/A
    Type Ultrabook
    Processor Family 8th Generation Intel Core i5/i7 Processor
    Processors i5-8250U - i7-8650U
    Memory Up to 32GB DDR4-2400
    Network Connectivity Gigabit Ethernet
    Intel Dual Band Wireless AC-8265 - 2T/2R + Bluetooth 4.1
    Intel vPro 8265 2T/2R + Bluetooth 4.1
    WWAN - Sierra EM7564 (4G LTE) / Fibocom L831-EAU
    Internal Storage HDD: Up to 2TB (5400RPM)
    SSD: Up to 1TB NVMe SSD
    Graphics NVIDIA Quadro P500
    Expansion Slots N/A
    Display 15.6"
    FHD (1920x1080) IPS
    FHD Touch (1920x1080) IPS
    4K UHD (3840x2160) IPS
    Ports and Connectors (Back) 2 x USB 3.0 (1 Always-on Charging)
    1 x USB-C
    1 x Intel Thunderbolt 3
    1 x RJ45 Gigabit Ethernet
    1 x HDMI 1.4
    1 x Side Docking Connector
    1 x Mic/Headphone Combo Jack
    1 x Smart Card Reader
    Dimensions / Weight 0.79" x 14.4" x 9.95" / From 4.3 lbs (1.95kg)
    Gallery: Lenovo P52s Gallery


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    Source: Lenovo


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    #7529

    Anandtech: Intel To Launch 3D XPoint DIMMs in 2H 2018

    Presenting at the UBS Global Technology Conference today, Navin Shenoy, Intel Executive Vice President and General Manager of their Data Center Group, shared an update on Intel's roadmap for 3D XPoint DIMMs. Intel claims that they are on track to launch 3D XPoint memory modules in the second half of 2018. They are projecting that 3D XPoint DIMMs will be an $8B market by 2021.
    After launching several Optane SSD products this year based on 3D XPoint memory, Intel had said almost nothing about their progress toward 3D XPoint DIMM memory modules. Intel first publicly showed a prototype 3D XPoint NVDIMM in January 2016, only a few months after unveiling 3D XPoint memory itself. When the first Optane products launched earlier this year, we were told Intel would have more to say on the subject of 3D XPoint DIMMs in 2018, but today's announcement makes it clear they will be selling the actual hardware within about a year.
    The launch of 3D XPoint DIMMs will depend on several pieces coming together. First, Intel's 3D XPoint memory must be sufficiently mature to meet the performance and endurance requirements of DIMM-based usage. Their Optane SSDs have all used a PCIe and NVMe interface that adds substantial latency overhead and makes it difficult to assess how close the underlying 3D XPoint memory can come to DRAM performance levels. The Optane SSDs are also shipping with relatively conservative write endurance ratings relative to the eventual expectations for 3D XPoint products: The Optane SSD DC P4800X's 30 drive writes per day for 5 years is not significantly higher than high-endurance flash-based enterprise SSDs can provide.
    Second, Intel will need to continue increasing production of 3D XPoint memory as their family of Optane SSDs expands and is joined by 3D XPoint DIMMs. Yesterday, Intel and Micron celebrated the completion of an expansion to building 60 of their IM Flash production facilities in Lehi, Utah. This will significantly increase their production capacity of 3D XPoint memory. So far, Intel seems to have been using almost all of the production of 3D XPoint memory for their Optane products while Micron has yet to publicly introduce any mass-produced 3D XPoint-based products. Micron will most likely start announcing and shipping 3D XPoint products under their QuantX brand within the next year, so Intel won't be getting the full benefit of this capacity boost.
    Third, 3D XPoint DIMMs will require server platform support because they are unlikely to operate as standard DDR4 DIMMs. The JEDEC NVDIMM-P standard for persistent memory DIMMs has not been finalized and is expected next year. It's not certain whether the 3D XPoint DIMMs will adhere to the NVDIMM-P standard or if they will use a proprietary interface, but either way they are likely to require updated CPU and motherboard support. Intel's recently-launched Xeon Scalable platform can support DRAM+flash NVDIMM-N modules. The launch next year of 3D XPoint DIMMs may foretell a simultaneous refresh of the Xeon Scalable platform.


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    #7530

    Anandtech: Seagate BarraCuda Pro 12TB HDD Review

    Data storage requirements have seen an exponential increase over the last several years. Both cloud and local storage requirements continue to be served by hard drives where workloads are either largely sequential or not performance sensitive. While the advancements in storage capacity have primarily served the interests of datacenters (enabling more storage capacity per rack), the products have trickled down to consumers in the form of drives for NAS (network-attached storage) units and pre-installed in external / DAS (direct-attached storage) enclosures. Seagate is the only one of the three hard drive vendors to target the desktop storage market with their highest capacity drives. We looked at the 10TB BarraCuda Pro drive last year, and the 12TB follow-up was launched last month. This review takes a look at the drive's characteristics and performance for typical desktop workloads.

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