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Thread: Anandtech News

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    Anandtech: AMD Launches Ryzen Pro with Vega: Mobile APUs and Desktop APUs

    Both AMD and Intel have product lines catered to the commercial market: large scale business deployments that require stability and administration-at-a-distance across tens of thousands of units. Imagine a company like Pepsico investing in a computing infrastructure that requires its US staff to all have a company laptop: not only is it a big operation, but it has big requirements for manageability and performance. This is what the commercial computing market is all about. This is not to be confused with the embedded market, which has different requirements.
    AMD’s ‘Pro’ platforms are the equivalent to Intel’s ‘vPro’ platforms, and AMD has provided Pro level processors for over a decade. In that time we have seen Kaveri Pro and Carrizo Pro processors announced for large scale deployments, with AMD reinforcing these platforms with long stable image support for software (18 months), guaranteed processor availability (24 months), longer term warranty (36 months), and an open source CPU agnostic management platform (DASH) so customers are not locked into a proprietary ecosystem.
    AMD’s latest push of its Pro ecosystem is with its new high-performance x86 Zen cores and Radeon Vega graphics. There are three mobile parts for commercial-grade notebooks, and four desktop parts for commercial-grade laptops. These models follow the consumer grade hardware and are identical in core counts, frequencies, and capabilities, but come with the updated support as listed above along with a guarantee that these parts use some of the best silicon from the production line. Memory support is also identical to the consumer parts.
    Ryzen Pro APUs
    Cores Base Turbo GPU TDP
    Ryzen 7 Pro 2700U 4C / 8T 2.2 GHz 3.8 GHz Vega 10 15 W
    Ryzen 5 Pro 2500U 4C / 8T 2.0 GHz 3.6 GHz Vega 8 15 W
    Ryzen 3 Pro 2300U 4C / 4T 2.5 GHz 3.4 GHz Vega 6 15 W
    Ryzen 5 Pro 2400G 4C / 8T 3.6 GHz 3.9 GHz Vega 11 65 W
    Ryzen 5 Pro 2400GE 4C / 8T 3.2 GHz 3.8 GHz Vega 11 35 W
    Ryzen 3 Pro 2200G 4C / 4T 3.5 GHz 3.7 GHz Vega 8 65 W
    Ryzen 3 Pro 2200GE 4C / 4T 3.2 GHz 3.6 GHz Vega 8 35 W
    Ryzen Pro for Mobile has three APUs, one each for Ryzen 7, Ryzen 5, and Ryzen 3. All three have a 15W nominal TDP which can be adjusted from 12W to 25W depending on the design of the chassis and performance required.
    Ryzen Pro for Desktop has four APUs, mirroring the APUs on the consumer platform with two at 65W and two at 35W. These components use the same AM4 socket as well, however they will not be sold at retail.
    AMD lists the benefits of these parts similarly to the consumer grade components however a lot of them will actually be used in the commercial space: transparent secure memory encryption (SME), secure boot (hardware-based), application whitelist, fTPM and TPM 2.0 support, and KVM support through DASH. Also, AMD likes to promote that they offer a Ryzen 3 grade Pro processor for the lower performance segment, whereas the competition start at Core i5.
    While not to blow AMD’s trumpet, one of the important aspects to these commercial systems is deployment. In AMD’s presentation to the press, they compared the required admin time, system time, and steps to deployment, between vPro and Ryzen Pro systems. The results were identical if not slightly better: an AMD-based Lenovo Thinkpad taking 35 steps and around 40 minutes, with the Intel-based Lenovo Thinkpad also taking 35 steps and about 43 minutes.
    AMD also stated the opportunities in the commercial segment for them. Most online technology websites focus on the consumer platforms, but AMD stated in our presentation that out of the premium segment of computing, out of a potential $30 billion total addressable market (TAM), around $10b of that is purely for commercial products, and they hope that Ryzen Pro can very easily fit the bill. To compare to the consumer segment, AMD listed this as also around $10b, making the standard CPUs that go into commercial systems just as important as the Ryzen 7 2700X or latest Threadripper for revenue. The thing here is, while the Pro APUs are lower cost, they are sold in 1000s of units to laptop companies with contracts with major businesses. It is a lot about volume.
    Gallery: AMD Ryzen Pro with Vega

    The major partners for AMD’s Ryzen Pro line are the usual names: HP, Lenovo, and Dell. On the Ryzen Pro for Mobile, AMD is in the HP ProBook 645 G4, the HP Elitebook 7x5 line, the Lenovo Thinkpad Ax85 models, and the Dell Latitude 5495. The Ryzen Pro for Desktop processors are in HP’s EliteDesk G4 mini-towers, the Lenovo ThinkCentre M7x5 family, Dell’s Optiplex 5055, and HP’s 285 desktops. A number of systems have already been announced, such as those from HP.
    Just in case anyone was going to ask, I don’t think AMD has plans for Threadripper Pro. But, if you have a big enough order…
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    Anandtech: VESA and MIPI Announce VDC-M 1.1: Display Compression Standard for Mobile

    As of late, the pursuit for higher resolutions, faster refresh rates, better contrasts, higher brightness, and more colors in displays, has created bandwidth demands that are pushing the limits of current interface standards. With that in mind, VESA has already announced DisplayPort 1.4’s successor to have double the bandwidth of 1.4.
    From the side of mitigating bandwidth demands with data compression, a little over four years ago, VESA and the MIPI Alliance developed and released the first iteration of their Display Stream Compression (DSC) standard, a visually lossless codec intended to reduce the amount of transmitted image data. But where high-end external displays have much leeway in regards to power consumption and system design, the same cannot be said for mobile and embedded devices looking to incorporate the latest premium display technologies.
    It is for this mobile and embedded space that today VESA and MIPI are formally announcing the VESA Display Compression-M v1.1 (VDC-M) standard, which was first mentioned at MWC2018. Slotting in as VESA’s third compression standard after DSC 1.1 (2014) and DSC 1.2 (2017), VDC-M 1.1 focuses on smartphones and other similarly embedded mobile display applications. At the expense of higher circuit complexity and no DSC 1.1 backwards compatibility, VDC-M offers a 5:1 compression ratio (4:1 for 24 bit color) as opposed to DSC’s 3:1 compression, but at the same visually lossless quality. In other words, VDC-M allows compression of 30-bit or 24-bit images down to 6 bits per pixel (bpp), while claiming “visually lossless viewing with no attendant loss of bandwidth” based on commissioned testing by York University.
    Historically-speaking, VDC-M is more in-line with the mobile/laptop-oriented DSC 1.1, which has been publicly adopted into MIPI’s DSI 1.2 and DSI-2 1.0 standards, as well as VESA’s embedded DisplayPort (eDP) 1.4b. Though to be clear, for VDC-M, VESA is optimizing the codec for smartphones as opposed to the laptop-inclusive DSC 1.1/eDP 1.4, and isn't currently being worked into the eDP specification, instead featuring solely with DSI-2 1.1 for the time being. With the primary goals of increasing battery life, reducing form factor, and decreasing cost, much of these benefits will be driven with the codec reducing the video interface data rate by lowering clockspeeds.
    At a high level, VDC-M allows system designers to reduce the link clock rate in order to lower system power, or alternatively opt to increase resolution and/or color bit depth using the same display interface. With compression, manufacturers can also reduce the number of interface wires, interconnects, and other connectors. In turn, these can lessen frame buffer load for video memory. VESA is pointing to these possibilities as methods of tuning power, weight/z-height, and system cost for mobile devices while still providing the needed display bandwidth. VESA notes that equalization requirements result in high speed interfaces consuming power at both TX (transmit) and RX (receive) ends.
    The exact details of the added circuit complexity can be found in the public VDC-M standard documentation, but in short, there are some additional logic blocks necessary for the higher degree of compression. These include a 2 x 8 discrete cosine transform, a 2-line buffer for read-and-store of 2 x 8 blocks for the next block’s vertical prediction process, and a 4-stream multiplexer for achieving 4 pixels/clock decoding. And where DSC decoders require additional complexity for certain mode decision processing, VDC-M signals the modes used in each block. As usual, designers will be able to estimate design complexity from the open C source code.
    While VDC-M is VESA’s latest display compression standard, it largely operates in a different sphere to the fairly recent DSC 1.2, which is not only designed for maximizing resolutions on external displays but also largely unavailable to consumers; DSC 1.2 support is included in DisplayPort 1.4, as well as the competing HDMI 2.1, but consumer-ready devices and displays conforming to either standard are not due for some time. In the meantime, existing interfaces require adjustments like 4:2:2 chroma subsampling to push ultra-high resolutions at ultra-high refresh rates (e.g. 4K at 144Hz).
    On the MIPI Alliance side, they are publicly announcing DSI-2 v1.1 today, which incorporates the VDC-M standard into the DSI-2 transport layer. As DSC-2 already supports DSC, manufacturers will be able to choose either codec as desired. Additionally, Hardent has announced upcoming availability of VDC-M encoder and decoder blocks.
    More information on VDC-M and VESA’s display stream compression codecs can be found on their site. Like DSC, VDC-M is a publicly open specification and is available in full on VESA's site. York University will present their DSC and VDC-M evaluation at Display Week 2018 next week.
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    Anandtech: Honor 10 Launch and Hands On: Kirin 970, More AI, More Notch

    In a world filled with rectangular blocks with displays, it takes a large effort to differentiate. The new Honor 10, launched today at an event in London, follows the trend of premium smartphones in 2018: more display, and added a notch. Under the hood is the latest HiSilicon Kirin 970 chipset, as seen in the Huawei Mate 10 and P20, with the added AI functional blocks to accelerate certain apps built on machine learning algorithms. The Honor line is always seen as a more cost effective way to yet most of the latest features from the Huawei main brand, and this year is no different.


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    Anandtech: When Size Matters: Corsair Launches Obsidian 1000D Super-Tower Case

    A few days ago, Corsair announced the launch of its most ambitious and largest case yet with the new Obsidian 1000D Super-Tower PC Case. Just as its name implies the case is quite large. So large in fact, it is able to house a complete E-ATX and Mini-ITX system concurrently - two motherboards, two power supplies, two full PCs in one case. It's not all about what can fit on the inside however that makes the case. The exterior styling uses brushed aluminum and includes four smoke tempered glass panels which help give the Super-Tower a premium appearance that can be a focal point of an enthusiast build. The inside is designed to house some of the most ambitious and powerful PCs imaginable inside its dual-system, three-chambered layout.
    The chassis measures in at a real estate-heavy 27.3” x 12.1” x 27.3” (LxWxH) which easily eclipses the 900D from years ago. The entire case, empty, weighs in at a hefty 65lbs making this thing a bit cumbersome to move around I'd image. The exterior of the case is adorned by the smoke tinted tempered glass panels. Where there isn’t glass, on top (the two flanking panels), there are brushed aluminum details adding to the overall high-end vibe it exudes.
    The louvered top is raised from the chassis allowing for air to exhaust, though perhaps not free-flowing. There is ample room in front for intake through its large dust filter (dust filters are also found on the rear, top, and bottom) so airflow shouldn’t be an issue. The chassis supports eight fans up front (13 in total) to get cool air in the chassis. The back panel has a total of seven expansion slots for PCIe, nine including the vertical GPU mounting space (video card can be mounted either way). Towards the bottom is space for the two power supplies as well as a Mini-ITX sized motherboard. Both glass side panels use hinges at the back and open up for easier access.
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    Sparing little expense, the front panel is loaded with modern options including two USB 3.1 Type-C ports (a rarity to have one today), and four USB 3.0 ports for a lot of USB storage options. Other buttons/ports include the power and reset buttons and 3.5 mm jacks for headphone and microphone. Unique to the 1000D, the power button and all USB ports have RGB LED backlighting in them lighting up that portion of the case I don’t recall seeing that in a chassis before. Using the integrated Corsair Commander Pro fan and lighting controller (mounted on the motherboard tray), users are able to control up to six PWM fans and two RGB LED strips through the iCUE software. The controller also has four temperature probes and contains the plugs for the front panel USB 3.0 ports.
    Inside the case, the primary E-ATX system mounts to a raised motherboard ‘island’ with cable routing holes throughout. The motherboard island is backed by French-door-type rear compartment that holds the 2.5” drives and hides cables. The Mini-ITX system sits above the ATX PSU mount. AS far as storage goes, the 1000D will hold a whopping 11 drives; five in 3.5-inch format and six 2.5-inch each in their own dedicated compartments. That should be plenty of internal storage, even with two systems inside.
    Using two different systems in one case can pose some cooling challenges. To combat this potential issue, the 1000D has many cooling options. The front panel holds up to eight 120mm fans, three 140mm fans on top and two 120/140mm fans mounts on the back for a total of 13 fans - none of which appear to be included. Corsair says there is room for up to four 480mm radiators simultaneously (requires the purchase of additional trays). By default, it will hold 2x480mm radiators in front, and one 420mm radiator on top. Fan and radiator installation should be a bit easier as the chassis has built-in radiator mounting trays which slid out from the chassis. Corsair says there is a wide variety of pump and reservoir mounting points adding to its flexible nature inside.
    The Corsair 1000D is truly a beast of a case allowing for TWO systems to fit inside, plenty of storage for BOTH systems, as well as integrated fan and RGB controller. While beauty is in the eye of the beholder, the tempered glass panels and brushed aluminum details do give the case a premium look. With its premium look does come a premium price. The 1000D is available now at your favorite etailers including Amazon and Newegg. Pricing comes in at a wallet-emptying $499.99 which puts it in the company of fully customized cases. The case includes a two-year warranty as well.

    Corsair Carbide 1000D Super-Tower
    Model 1000D
    Case Type Super-Tower
    Dimensions (W)12.1"
    (H) 27.4"
    Color Black
    Material Aluminum / Tempered Glass
    Net Weight 29.4kg
    External Drive Bays None
    HDD/SSD Bays 11 (5 x 3.5" + 6 x 2.5")
    Expansion Slots 7 (+2 for vertical GPU)
    Motherboard Type Up to E-ATX (Primary)
    Mini-ITX (Secondary)
    System Fan Front: 8x 120mm
    Top: 3x 140mm
    Rear: 2x 120/140mm
    I/O Ports 2x USB 3.1 Type-C
    4x USB3.0
    2x 3.5mm jacks
    Power and Reset Buttons
    VGA Card Support (L)400mm
    CPU Cooling Support (H)180mm
    PSU Support/ ATX PSU (Primary)
    SFX (Secondary)
    Radiator Support Front: 2x 480mm
    Top: 1x 420mm
    Rear: 1x 240mm
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    Anandtech: Microsoft Announces The Surface Hub 2

    Three years ago Microsoft announced the Surface Hub, which was their new device for reinventing the conference room. It was a beast of a machine, at up to 280 lbs for the 84” model, but it was announced way back in 2015, and that’s an eternity for a computing device. Today, they are announcing its successor, the aptly named Surface Hub 2. It’s a new take on the office space, with a beautiful new design, and some interesting features not seen before in this kind of device.
    Like its predecessor, the Surface Hub 2 is designed for the conference room, and is a digital whiteboard, conferencing system, and display, all rolled into one. It features a “4K+” resolution for the 50.5-inch 3:2 display, and the 3:2 is needed because the entire device is meant to rotate between portrait and landscape as needed, with a new feature called Dynamic Rotation which lets you rotate the display with the displayed image staying static.
    It’s also designed to be paired with multiple other Surface Hubs, allowing them to be tiled with up to four Surface Hubs offering apps to utilize all four displays as if they were just a single one. This trick feature is helped by the incredibly thin bezels on the new device.
    The new Surface Hub will feature Windows Hello logins, to automatically sign in people for the conference, and far-field microphones for video conferencing. Although not mentioned, it’s certainly going to support a pen interface, although we’ll have to wait and see if it’s the pen style from the original Surface Hub, or if they’ve been able to get the lower voltage pens from the rest of the Surface lineup to work on such a large display.
    Microsoft isn’t providing much on details yet, but are just teasing the new model for the moment. Their goal is to have it available for sale in 2019, with more information later in the year. As for pricing, the original 55-inch was first priced at $7000, so don’t expect this one to be a replacement for your 32-inch desktop monitor just yet.
    Source: Microsoft


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    Anandtech: Top 5 in 3 Years: A Group Interview with George Zhao, Honor President

    This week, Honor launched the $400 high-end Honor 10 smartphone, featuring the Kirin 970, a 5.84-inch 19:9 display, dual rear cameras, and enhanced AI capabilities. As part of the launch, we sat down with George Zhao, President of Honor, as part of a group interview.


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    Anandtech: Microsemi Licenses Crossbar ReRAM Non-Volatile Memory

    Crossbar, Inc. has announced Microsemi as the first licensee for their embedded Resistive RAM (ReRAM) memory technology. ReRAM is one of several up and coming non-volatile memory technologies, and is one of the more promising potential competitors to Intel's 3D XPoint memory. Crossbar has been developing their flavor of ReRAM for years and currently fabricates the memory on a 40nm process at SMIC. They now have a new fab partner that can manufacture ReRAM on a 1x nm process, and it is this capability that has attracted their first major customer. Microsemi has a very broad product catalog, and they aren't ready to reveal what they plan to use ReRAM for. The embedded ReRAM technology from Crossbar will enable Microsemi to add blocks of ReRAM to the ASICs they are designing for production on an advanced 1x nm process.
    Crossbar touts compatibility with standard CMOS fabrication processes as one of the key advantages of their ReRAM over new non-volatile memory technologies. Manufacturing ReRAM only requires adding a few extra steps to the back end of line wafer processing, and doesn't require radical changes to the materials involved. Crossbar now has plans for commercial production of ReRAM on a 1x nm node and they claim that it can scale down to processes smaller than 10nm. This is expected to make Crossbar's ReRAM a relatively inexpensive embedded memory that won't impose serious constraints on the rest of the ASIC. By contrast, Everspin's magnetoresistive RAM (MRAM)—which is also currently being manufactured on a 40nm process—will be moving to GlobalFoundries 22nm FD-SOI this year but probably won't be available on a high-performance FinFET process in the near future. Embedded flash memory has trouble scaling below about 40nm while retaining the endurance typically required of embedded memories, and 3D NAND cannot be easily added to a logic process.
    Like most new non-volatile memory technologies, ReRAM isn't ready to compete head-on against DRAM or NAND flash memory. Its first path to commercialization is therefore through use as a special-purpose embedded memory, where its different tradeoffs between performance, endurance and density make it a good fit for certain applications. Currently, Crossbar quotes performance as read latencies on the order of 10ns, write latencies around 10µs, and write endurance in excess of 1M cycles. ReRAM is also accessible at the byte level instead of using large erase blocks like flash memory. Crossbar expects 10 years of data retention and has not observed problems with read or write operations disturbing the state of adjacent memory cells.
    Separately from the new Microsemi partnership, Crossbar will also soon be demonstrating the use of their embedded ReRAM in an in-memory compute architecture for AI. At the Embedded Vision Summit next week, Crossbar will demonstrate object and facial recognition based on a pre-trained FaceNet model stored in ReRAM. Since the memory is on the same chip as the compute elements of the neural network, it can use very wide data paths to offer high performance without the high power draw that an external DRAM solution like HBM would bring or the much larger die area that SRAM would require. Facial recognition is an appropriately read-heavy workload for ReRAM, but the ReRAM will have no trouble handling the model updates that result from registering new faces. The demo is intended to show how ReRAM can be useful for AI tasks on battery-powered devices that don't have the option of offloading their computational workload to the cloud. Because ReRAM is non-volatile, the AI chip can be powered down but is instantly ready to perform recognition upon waking up, without having to re-load the model from storage into SRAM or DRAM. Since this demo chip is still using a 40nm manufacturing process and is just intended as a proof of concept, the embedded ReRAM array is only a single megabyte, but Crossbar expects that similar chips made on the 1x nm process that will soon be available would use many MB of ReRAM to support more complex models while still offering extremely high and consistent recognition performance.


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    Anandtech: Logitech Unveils G305 Mouse with Lightspeed Wireless, ‘Hero’ 12,000 DPI Se

    Logitech this week introduced its new entry-level gaming mouse that uses its proprietary Lightspeed wireless interconnection technology as well as its latest HERO sensor. The Logitech G305 mouse uses a proven ambidextrous form-factor but does not offer features like adjustable weight or RGB lighting.
    The G305 is Logitech’s second mouse to feature the company’s latest HERO (high efficiency rated optical) sensor with 12,000 DPI sensitivity, up to 400 inches per second detection speed, and up to 40G acceleration. In addition, the mouse uses the proprietary Lightspeed wireless interconnection technology that allegedly cuts the input lag by improving the internal architecture, reducing the polling rate of wireless receivers to 1 ms, rising signal strength, applying a proprietary frequency hopping mechanism that uses the strongest interference-free channel, and optimizing software.
    One of the advantages of Logitech’s HERO sensor (and to a degree Lightspeed technology) is a very long battery life. The manufacturer promises that the G305 mouse can last for 250 hours on one AA battery and up to nine months when its polling rate is reduced to 8 ms.
    The Logitech G305 is outfitted with six programmable buttons, in line with other entry-level gaming mice. As for weight, it weighs only 99 grams, which some gamers might find too light, but which becomes an advantage when the mouse is used when travelling.
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    Logitech’s G305 Lightspeed wireless gaming mouse will be available in black and white later this month for a suggested retail price of $59.99. This price is a little bit lower when compared to Logitech’s G603 mouse featuring the HERO sensor as well as the Lightspeed technology ($69.99), but which is more expensive than the price of Logitech’s G502 (starts at $49.99) that has a previous-gen 12,000 DPI sensor, adjustable weight, 11 programmable buttons, and RGB lighting.
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    Gallery: Logitech Unveils G305 Mouse with ‘Lightspeed’ Wireless Tech & ‘Hero’ 12,000 DPI Sensor


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    Anandtech: HP EliteBook 1050 G1: Six-Core CPU, NVIDIA GPU, RAID, 15.6-inch 4K LCD

    HP has introduced a new high-end laptop aimed at demanding users. The new EliteBook 1050 G1 notebook comes with Intel’s Coffee Lake CPUs with up to six cores, a discrete GeForce GTX 1050 GPU (in select configurations), and may be outfitted with a 4K LCD. Like all Elite-branded systems, the EliteBook 1050 was designed with requirements of various enterprises and government agencies in mind, so it may be equipped with encrypted storage and other advanced security features, including a TPM 2.0 module and an encrypted fingerprint reader.
    HP’s EliteBook 1050 are positioned a bit below the company’s ZBook 15 G5 mobile workstations introduced earlier this year. This means that they are considerably lighter and thinner than ZBooks: the new units are 1.89 cm/0.74 inch thick and weigh 2.06 kilograms/4.54 pounds. Meanwhile, the EliteBook 1050 PCs offer far higher performance than mainstream 15.6-inch machines: the most advanced configurations will be powered by Intel’s six-core Core i7-8850H processor (even entry-level configs feature quad-core CPUs), NVIDIA’s GeForce GTX 1050 graphics chip with 4 GB of GDDR5 memory (select SKUs), up to 32 GB of DDR4-2666 memory, and up to 4 TB PCIe/NVMe storage with RAID support. Versions of the EliteBook 1050 for government agencies will use SED or FIPS 140-2 self-encrypting SSDs.
    Display options that HP plans to offer with the EliteBook 1050 G1 deserve a special mentioning. The most affordable variants of the laptop will be equipped with an anti-glare FHD display panel featuring 400 nits of brightness. The systems designed for people who value privacy will be outfitted with an anti-glare FHD panel featuring HP’s Sure View privacy screen coating and a 650 nits brightness to make the LCD comfortable to use in various conditions. Finally, HP will offer a 4K UHD display panel with a 400 nits brightness for those who need a very high resolution. All the LCDs to be supplied with the EliteBook 1050 G1 will use IPS technology, will cover 100% of the sRGB color gamut, and will be equipped with an ambient light sensor to adjust their brightness automatically.
    Moving on to connectivity. Like many other 2018 HP Elite-branded machines, the new EliteBook 1050 laptops feature Intel’s dual band Wireless-AC 9560 CRF solution that supports 802.11ac Wave 2 Wi-Fi with up to 1.73 Gbps throughput as well as Bluetooth 5.0. In addition, the new notebooks also feature NXP’s NPC300 I2C NCI NFC controller. As for wired connectors, the EliteBook 1050 G1 comes with two Thunderbolt 3 headers, two USB 3.0 ports, an HDMI output, an SD card reader, and a TRRS audio jack.
    When it comes to audio and conferencing capabilities, the EliteBook 1050 G1 is equipped with a 720p webcam (with or without a privacy hatch), IR sensors, a microphone array with noise cancellation capabilities, a speaker system co-developed with Bang & Olufsen featuring integrated amplifiers, and a keyboard with controls for Skype calls.
    HP plans to offer the EliteBook 1050 G1 systems in various configurations equipped with a 64 Wh or a 95.6 Wh battery. In the best case scenario, the laptop will work for 16 hours on one charge (based on Mobile Mark 2014 testing), the company said.
    General Specifications of the HP EliteBook 1050 G1
    LCD Diagonal 15.6"
    1920×1080 | 400 nits
    1920×1080 | 650 nits, Sure View privacy
    3840×2160 | 400 nits
    Anti Glare Yes
    CPU Options Core i5-8300H (4C/8T)
    Core i5-8400H (4C/8T)
    Core i7-8750H (6C/12T)
    Core i7-8850H (6C/12T)
    Graphics Integrated HD Graphics 630 (24 EUs)
    Discrete NVIDIA GeForce GTX 1050
    4 GB GDDR5 memory
    RAM 32 GB DDR4-2667
    2 SO-DIMM slots
    Storage SSD 256 GB - 2 TB PCIe NVMe M.2 SSD
    256 GB - 512 GB PCIe NVMe M.2 SED SSD
    512 GB M.2 SATA FIPS 140-2 SSD
    256 GB SATA SED
    RAID Optional
    Total Capacity 4 TB
    Wireless Wi-Fi Intel Wireless-AC 9560 CRF
    802.11ac (2x2) Wi-Fi
    with or without vPro
    Bluetooth Bluetooth 5.0
    NFC HP Module with NXP NFC controller NPC300 I2C NCI
    Modem None
    USB 3.1 2 × TB 3
    3.0 2
    × Type-A
    Thunderbolt 2 × TB 3 (data, DP 1.3 displays)
    Titan Ridge controller
    Display Outputs 1 × HDMI 1.4/2.0 (iGPU/dGPU)
    2 × TB3 with DP 1.3
    Gigabit Ethernet None
    Card Reader SD Card Reader
    Webcam 720p camera with shutter or
    720p + IR camera with shutter
    Fingerprint Sensor Yes (encrypted, optional)
    Other I/O Microphone, stereo speakers, audio jack
    Battery 64 Wh, 95.6 Wh
    Dimensions Width 36 cm | 14.17 inch
    Depth 24.5 cm | 9.65 inch
    Thickness 2 cm | 0.79 inch
    Weight 2.06 kilograms | 4.54 lbs
    Price Starting at $1,899
    HP will start selling the EliteBook 1050 G1 laptops later this month at a price starting at $1,899.
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    Anandtech: NVIDIA Updates on G-Sync HDR: 4Kp144 Monitors On Sale at End of May, Other

    While NVIDIA's upcoming ultra-premium G-Sync HDR monitors have been in the public eye for some time now, the schedule slips have become something of a sticking point, prompting the company in March to state that 27” 4K 144 Hz models would be shipping and on the market in April. Needless to say, those displays are yet to launch, though preorders for the Acer Predator X27 and ASUS ROG Swift PG27UQ were listed in Europe in mid-April.
    Putting some amount of speculation to rest, NVIDIA has indicated the end of May for shipping and e-tail availability of the Acer Predator X27 and ASUS ROG Swift PG27UQ, though ultimately this decision is in the hands of Acer and ASUS. On that note, Acer stated that they had no updates on availability at this time. Both models were first showcased as reference prototypes during CES 2017, and as part of the larger G-Sync HDR lineup, the Predator X27 and PG27UQ will be the first monitors on the market.
    NVIDIA G-SYNC HDR 2018 Monitor Lineup
    Predator X27
    ROG Swift PG27UQ
    Predator X35
    ROG Swift PG35VQ
    Predator BFGD
    ROG Swift PG65
    OMEN X 65 BFGD
    Panel 27" IPS-type (AHVA) 35" VA
    1800R curve
    65" VA?
    Resolution 3840 × 2160 3440 × 1440 (21:9) 3840 × 2160
    Pixel Density 163 PPI 103 PPI 68 PPI
    Max Refresh Rates OC
    (4:2:2 chroma subsampling)
    200Hz 120Hz
    Standard 120Hz
    (4:2:2 chroma subsampling)
    (4:4:4 chroma subsampling)
    Unknown Unknown
    60Hz 60Hz 60Hz
    Variable Refresh NVIDIA G-Sync HDR Scaler/Module NVIDIA G-Sync HDR Scaler/Module NVIDIA G-Sync HDR Scaler/Module
    Response Time 4 ms 4 ms? Unknown
    Brightness 1000 cd/m² 1000 cd/m² 1000 cd/m²
    Contrast Unknown Unknown Unknown
    Backlighting FALD (384 zones) FALD (512 zones) FALD
    Quantum Dot Yes Yes Yes
    HDR Standard HDR10 Support HDR10 Support HDR10 Support
    Color Gamut DCI-P3 DCI-P3 DCI-P3
    Inputs 2 × DisplayPort 1.4
    1 × HDMI 2.0
    DisplayPort 1.4
    HDMI 2.0
    DisplayPort 1.4
    HDMI 2.0
    Price TBA TBA TBA
    Availability May/June 2018 Q4 2018? Summer 2018? Fall 2018
    NVIDIA did not mention the comparable 27" and 35" AOC models (AGON AG273UG, AGON AG353UCG) were not mentioned but are presumably operating on a similar release timeline. There was also no mention of Acer's Predator XB272-HDR.
    While the 27” 4K 144 Hz models were originally slated for a late 2017 launch, Acer and ASUS made a surprising announcement last August on delaying their G-Sync HDR flagships to Q1 2018. Even with NVIDIA’s current end-of-May assessment, ASUS remarked offhand that a June launch was more likely, as firmware and other development work was still ongoing. Not that those were the only G-Sync HDR displays announced – at Computex 2017, Acer and ASUS unveiled 35” curved ultrawide 200 Hz G-Sync HDR displays originally for a Q4 2017 release. Meanwhile, at CES 2018 NVIDIA had already pushed forward with revealing 65-inch smart TV esque G-Sync HDR monitors with integrated SHIELDs, dubbing them “Big Format Gaming Displays” (BFGDs). No update was provided on the schedule for the 35” and BFGDs, only that they were due to come later this year.
    Despite the launch on the horizon, full specifications and pricing have yet to be published. The features and specifications remain the same as we have known earlier: utilizing AU Optronics’ M270QAN02.2 AHVA panel, the 27” G-Sync HDR monitors bring 3840×2160 resolutions with up to 144 Hz refresh rate (at half chroma) and quantum dot film, and offering DCI-P3 color gamut and HDR10 support, a peak brightness of 1000 nits brightness, and full array local dimming (FALD) functionality with a 384 zone direct LED backlighting system. On top of that, Acer and ASUS include their own monitor features and OSDs; for the actively cooled ROG Swift PG27UQ, this includes Tobii eye-tracking and ultra-low motion blur (ULMB).
    For the few refresh rate asterisks, the amount of bandwidth needed for HDR at 10-bit 4Kp144 with 4:4:4 chroma subsampling exceeds DisplayPort 1.4's capability, and so setting the refresh rate above 98 Hz will have the monitor drop to 4:2:2 chroma and use dithering with 8bit and frame rate control (FRC). Though this bandwidth bottleneck is largely out of ASUS/Acer and NVIDIA’s hands, with DisplayPort 1.5 and even HDMI 2.1 very much too new to be incorporated in these models.
    That being said, a straight conversion of European preorder prices sans VAT puts the price range at $2500 to $3000, though this does not directly implicate US pricing. As G-Sync HDR flagship gaming monitors, they have essentially every feature of ultra-high-end consumer/gaming monitors. But additionally, the AU Optronics AHVA panel is pricier as it is only purchased as combined LCD and backlight unit, and with the cost of the upgraded G-Sync HDR scaler and module, adds a cost premium that is passed onto consumers.
    Ultimately, the HDR situation itself is also a little murky. Outside of HDR10 support, NVIDIA’s G-Sync HDR certification mandates and requirements are kept between them and the manufacturers, and so the specific dynamic range of G-Sync HDR isn’t clear. Presumably there are quantized public guidelines with minimum peak brightness, localized dimming capability, minimum percentage coverage of DCI-P3 gamut, and the like. In other words, much like VESA’s open DisplayHDR 400, 600, and 1000 standards that are both directly linked to numerical performance metrics but also can be independently verified by consumers themselves with VESA’s open test tools and test benchmarks.
    At the time, NVIDIA did not express any standardized HDR specifications outside of their G-Sync HDR certification process, reiterating that G-Sync HDR represented a premium gaming experience and expecting OEMs and monitor manufacturers to list any HDR specs relevant to their models. In any case, these 27” monitors adhere and thus carry the UHD Alliance’s Ultra HD Premium logo, which is 4K specific. For the publicly-announced G-Sync HDR displays, it appears that only three types of AU Optronics panels are involved, and so capabilities and featuresets will naturally align closely. NVIDIA also stated that G-Sync HDR had no particular focus on Windows HDR support.
    As HDR monitors are a burgeoning market segment, NVIDIA brought up the need for consumer education on the wide spectrum of HDR performance. For consumers looking for a high-end variable refresh rate monitor with HDR, an HDR brand not strictly attached to performance parameters isn’t quite as elucidating as "4K", "IPS", "144 Hz refresh rate", or "4ms response time". As new panel technologies are developed and mature, it will be interesting to see how these changes would be conveyed through the “G-Sync HDR” brand.
    Gallery: NVIDIA Spring 2018 Press Tour Presentation

    Source: NVIDIA


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