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    Anandtech: Acer XZ1-Series Curved Gaming Displays: WQHD, 144 Hz, FreeSync, HDR10

    Acer has quietly introduced two new curved gaming monitors that offer premium gaming features such as 144 Hz FreeSync and HDR10 support for relatively affordable prices. Acer’s XZ1-series LCDs share design elements with the company’s aggressively-styled Predator displays and will definitely appeal to those looking for inexpensive monitors with serious gaming capabilities.
    Acer’s XZ1 family currently consists of two displays: the 27-inch XZ271Ubmijpphzx (XZ271U) and the 31.5-inch XZ321QUbmijpphzx (XZ321QU). Both monitors are based on 16:9 aspect ratio curved VA-type panels featuring a 2560×1440 resolution, 250 - 300-nits brightness, a 3000:1 contrast ratio, 1 ms MPRT response times, and a 144 Hz refresh rate. Acer says that the monitors cover 85% of the NTSC color space, which means that technically they can reproduce more than 100% of the sRGB color gamut (i.e., show more colors than the sRGB covers itself).
    In a bid to distinguish the XZ1 from its more expensive product families, Acer has to keep its “premium” features at an essential level. The manufacturer advertises three premium gaming features for its XZ1 LCDs (besides, of course, its maximum refresh rate of 144 Hz and a low response time). First up, the monitors support AMD’s FreeSync dynamic refresh rate technology with a 48 – 144 Hz range, which is wide enough to support AMD’s Low Frame Rate (LFC) capability. Secondly, the monitors formally support HDR10 data, yet their peak brightness level is much too low for HDR, so actual experience is something that remains to be seen. Finally, the XZ1 series support Acer’s Black Boost mode that automatically adjusts brightness of dark scenes in games to make it easier for gamers to find their opponents in the dark.
    Being aimed at gamers who tend to have PCs and consoles, Acer’s XZ1 displays are outfitted with a rather rich set of inputs: one DisplayPort 1.2, one mini DisplayPort 1.2, and two HDMI 2.0 headers. Given the number of inputs, the monitors fully support PiP and PbP for two devices, which is fine for products of this class. In addition, the LCDs are equipped with two 7 W stereo speakers and a headphone jack. Finally, they feature a quad-port USB 3.0 Type-A hub.
    Just like Acer’s Predator monitors, the XZ1 displays come equipped with highly adjustable stands that can tilt between -5 to 25 degrees, swivel +/- 25 degrees, and provide height adjustments of up to 120 mm.
    Specifications of Acer's XZ1-Series Gaming Displays
    XZ271U XZ321QU
    Panel 27" VA 31.5" VA
    Native Resolution 2560 × 1440
    Maximum Refresh Rate 144 Hz
    Dynamic Refresh Tech AMD FreeSync with LFC
    Range 48 - 144 Hz
    Brightness 250 cd/m² 300 cd/m²
    Contrast 3000:1
    Viewing Angles 178°/178° horizontal/vertical
    Response Time 1 ms MPRT
    Pixel Pitch 0.2335 mm² 0.2724 mm²
    Pixel Density 108 PPI 93 PPI
    Curvature 1800R (?)
    Color Gamut Support sRGB: 100% (?)
    NTSC: 85%
    Inputs 1 × DisplayPort 1.2
    1 × miniDisplayPort 1.2
    2 × HDMI 2.0 (one with MHL 2.1 support)
    USB Hub 4-port USB 3.0 hub
    Audio 2 × 7 W Speakers
    3.5 mm Headphone Output
    Proprietary Enhancements Acer's Black Boost
    Acer's Flickerless Technology
    Power Consumption Idle ~ 0.5 W
    Normal 34 W 43 W
    Maximum 92 W 120 W
    Stand Adjustments Tilt -5 ~ +25°
    Swivel +/-25°
    Height 120 mm
    Pivot - -
    VESA Mounts 100 × 100 mm
    Launch Timeframe September 2018
    Additional Information Link Link
    Acer’s XZ271U and XZ321QU gaming monitors were introduced in Japan last week, where they will be available for ¥48,000 ($427) and ¥55,000 ($490) respectively. Meanwhile, both monitors can already be purchased at, but at higher prices ($527 and $550). Keeping in mind that prices are typically high in Japan, expect Acer's XZ1 family to become more affordable at a retail store near you in the coming months.
    Buy Acer XZ271U on
    Buy Acer XZ321QU on
    Related Reading:

    Sources: Acer Japan, PC Watch


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    Anandtech: Zhaoxin Displays x86-Compatible KaiXian KX-6000: 8 Cores, 3 GHz, 16 nm Fin

    Zhaoxin, a joint venture between Via Technologies and the Chinese government, this week for the first time displayed its upcoming x86-compatible CPU, the KaiXian KX-6000. The SoC features eight cores running at 3 GHz and increases performance over its predecessor by at least 50%.
    The KaiXian KX-6000 is a successor to the KX-5000 CPU launched earlier this year. Both chips integrate eight-core x86-64 cores with 8 MB of L2 cache, a DirectX 11.1-capable iGPU with an up-to-date display controller, a dual-channel DDR4-3200 memory controller, contemporary I/O interfaces (PCIe, SATA, USB, etc), and so on. The key differences between the KaiXian KX-5000 and the KaiXian KX-6000 are frequencies and manufacturing technology: the former is produced using TSMC’s 28 nm fabrication process and runs at up to 2 GHz, whereas the latter is made using TSMC’s 16 nm technology and operates at up to 3 GHz. Zhaoxin claims that the Kaixian KX-6000 offers compute performance comparable to that of Intel’s 7th Generation Core i5 processor, which is a quad-core non-Hyper-Threaded CPU. Obviously, performance claims like that have to be verified, yet a 50% performance bump over the direct predecessor already seems beefy enough.
    As the picture below shows, the thinner manufacturing process enabled Zhaoxin to make the KaiXian KX-6000 die smaller when compared to the predecessor, which will eventually shrink its manufacturing cost. Meanwhile, the two processors use different HFCBGA packaging and therefore cannot use the same motherboards. Meanwhile it is unknown whether the new KaiXian KX-6000 is compatible with Zhaoxin’s USB 3.1 Gen 2-capable ZX-200 chipset.
    The Zhaoxin KaiXian KX-6000 relies on the LuJiaZui microarchitecture, which is an evolution of the WuDaoKou microarchitecture that powers the KX-5000 processor introduced in early 2018. Based on what we know today, the LuJiaZui is an x86-64-compatible superscalar, multi-issue, out-of-order microarchitecture that supports contemporary instruction sets extensions like SSE 4.2 and AVX along with virtualization and encryption technologies. Zhaoxin has yet to disclose differences between its LuJiaZui and WuDaoKou designs. Therefore, all we can do is speculate that since the microarchitectures are launched within one year from each other they are very similar, but the newer one has minor optimizations that, perhaps, enable higher clocks, improved caching, better memory support, etc.
    Zhaoxin has not announced when it plans to start commercial shipments of its KaiXian KX-6000 processors, as right now it only displays its picture (which proves that it exists). Based on the previously published roadmap, we'd expect the CPU to hit the market in 2019, though when exactly is anyone's guess.
    Zhaoxin's Kaixian KX-5000 and KX-6000 CPUs
    Kaixian KX-5000
    Kaixian KX-6000
    Core Count 4 - 8 Up to 8
    L2 Cache 8 MB 8 MB
    Frequency Up to 2 GHz Up to 3 GHz
    ISA x86-64
    ISA Extensions SSE 4.2, AVX ?
    APIC Yes
    Virtualization VMX technology, compatible with Intel's VT-X
    Temperature monitoring, overheat protection Yes
    Power States C1, C2, C3, C4, P-State ?
    Hardware Encryption Engines Advanced encryption engine (ACE), SHA-1, SHA-256, SM3/SM4, Randomizer ?
    Security TXT, EDB ?
    iGPU DirectX 11.1 feature set.
    Hardware-accelerated video encoding/decoding.
    Outputs: DP, eDP, HDMI, D-Sub
    Max Resolution: 4K
    Number of Displays: 3
    Packaging x-ball HFCBGA
    37.5 x 37.5 mm
    y-ball HFCBGA
    37.5 x 37.5 mm
    Process Technology TSMC 28 nm TSMC 16 nm FinFET
    Related Reading:

    Source: PC Watch


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    Anandtech: The ASUS ROG Strix B360-G Gaming Review: A Polarizing $100 Motherboard Des

    The B360 market should be a battleground for new PC builds: it offers almost all the features needed for everyone. There is a lot of scope for motherboard manufacturers to be creative in this space, and still offer a reasonably priced product: ASUS' take here is the Strix B360-G Gaming, a microATX offering that dives deep into the ROG Strix branding. For users looking to build a single-GPU gaming system, ASUS thinks they have a board you should be looking at.


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    Anandtech: TechInsights Publishes Apple A12 Die Shot: Our Take

    As is custom by now every year, we look forward to TechInsights teardown of the latest new mobile SoCs. This time around we’re delighted to see a new die shot of the new Apple A12, the first commercially available 7nm piece of silicon.
    While TechInsights posted their take on the block identification and labelling, found on their iPhone XS teardown blog post, I do think it missed the mark in terms of the CPU complexes. Therefor I did my own analysis and took the liberty of adding a bit more visibility and custom labelling of the die shot:

    AnandTech modified TechInsights Apple A12 Die Shot
    We see two big cores in the centre-left next to what TechInsights labelled as the NPU. The cores have seen some larger restructuring and this is most obvious in the doubling of the SRAM macros of the L1 data caches which I’ve confirmed to be tested at 128KB – twice the size over last year’s 64KB of the A11 cores. We also similarly see a doubling of the L1 instruction cache macro cells – which also likely hints that this has also seen a doubling to up to 128KB.
    The CPU complex cache remains largely the same size as on the A11, with the only difference being a re-layout in a more clean manner. I have big expectations of this part of the new microarchitecture, something we’ll dwell more deeply in our upcoming full review.
    The small cores are found in the bottom centre – four of them surrounding their L2 cache logic and memory banks.
    The system cache block of the A12 has seen a very major redesign, as opposed to the A11 and prior SoCs, we see a very obvious slice separation into four units. Ironically, at least on the die, this looks a lot more to what we’ve seen in the Snapdragon 845 system cache block.
    On the GPU side of things, it’s very clear that this is very much a direct successor to last year’s GPU as the blocks structure in the common shared logic and inside a GPU core is pretty much in line with what we’ve seen last year. We’ll be dwelling into GPU IP discussions more in our upcoming review.
    We break down the individual IP block sizes alongside the total die size in the following table:
    Die Block Comparison (mm²)

    Process Node
    Apple A12

    TSMC N7
    Apple A11

    TSMC 10FF
    Total Die 83.27 87.66
    Big Core 2.07 2.68
    Small Core 0.43 0.53
    CPU Complex 11.90 14.48
    GPU 14.88 15.28
    GPU Core 3.23 4.43
    In terms of determining the actual process node shrink, the closest valid apples-to-apples comparison we can make are in the small cores and an individual GPU core. Here we see a shrink from 0.53mm² to 0.43mm² in the small CPU cores – representing a 23% reduction. On the GPU core side we see a more significant 37% reduction down from 4.43mm² to 3.23mm².
    All in all Apple is again at the leading edge of manufacturing technology and the new A12 showcases some really interesting changes in its silicon blocks. Stay tuned for our full iPhone XS and XS Max review in the near term future.


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    Anandtech: GeForce RTX 2070 Gets a Release Date: October 17th

    With the release of the GeForce RTX 2080 barely behind them – and the RTX 2080 Ti technically still in front of them – NVIDIA has announced the release date for their next RTX card: the 2070. The previously revealed card, which was scheduled for an ambiguous October, has been locked in for October 17th, where the Founders Edition version will hit the streets at $599.
    In line with the general performance progression for the GeForce RTX family, the RTX 2070 is slated to deliver around 75% of the RTX 2080’s performance. The exact performance depending on how each game scales with the smaller collection of resources. The RTX 2070 has about 75% of the shading/texturing/tensor hardware as the RTX 2080, however it has the same ROP count and the same 256-bit memory bus. So we expect that the biggest performance differences are going to be in SM-bound scenarios – now including ray tracing – while pixel-bound scenarios that rely mostly on ROP throughput should take a much smaller hit.
    NVIDIA GeForce x70 Specification Comparison
    RTX 2070
    Founder's Edition
    RTX 2070 GTX 1070 GTX 970
    CUDA Cores 2304 2304 1920 1664
    ROPs 64 64 64 64
    Core Clock 1410MHz 1410MHz 1506MHz 1050MHz
    Boost Clock 1710MHz 1620MHz 1683MHz 1178MHz
    Memory Clock 14Gbps GDDR6 14Gbps GDDR6 8Gbps GDDR5 7Gbps GDDR5
    Memory Bus Width 256-bit 256-bit 256-bit 256-bit
    VRAM 8GB 8GB 8GB 4GB
    Single Precision Perf. 7.9 TFLOPs 7.5 TFLOPs 6.5 TFLOPs 3.9 TFLOPs
    "RTX-OPS" 45T 45T N/A N/A
    TDP 185W 175W 150W 145W
    GPU TU106 TU106 GP104 GM204
    Transistor Count 10.8B 10.8B 7.2B 5.2B
    Architecture Turing Turing Pascal Maxwell
    Manufacturing Process TSMC 12nm "FFN" TSMC 12nm "FFN" TSMC 16nm TSMC 28nm
    Launch Date 10/17/2018 N/A 06/10/2016 09/18/2014
    Launch Price $599 $499 MSRP: $379
    Founders $449
    Overall, the RTX 2070 is a bit of a wildcard. Rather than being a cut-down version of the GPU used in the 2080, as has been the case for NVIDIA product stacks for most of the last decade, the RTX 2070 gets its own GPU: the TU106. A third GPU in as many cards has more upfront costs, as NVIDIA has to tape out and manufacture another die, however the 454mm2 GPU allows them to min-max costs by not having to use the larger TU104 to fill what will be greater demand for the cheaper card. Still, like the rest of the RTX 20 series, relatively speaking this is a very large die for this product segment.
    Consequently, while NVIDIA is officially setting the MSRP for baseline RTX 2070 cards at $499, we don’t expect to actually see them at that price any time soon. NVIDIA’s own Founders Edition card will carry a $100 premium, pushing it to $599, and we expect NVIDIA’s board partners to follow suit. This will price the RTX 2070 well ahead of current GTX 1080 cards, so it will be interesting to see where the new card fits in the bigger picture.


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    Anandtech: The Team Group Delta RGB SSD Review: Lite Performance, Light Drive

    Today we're looking at another SATA SSD with RGB lighting, but the Team Delta RGB is very different from our previous RGB SSD. The lighting design is far more efficient and flexible, and the storage performance is satisfactory. The RGB LEDs do give the drive a premium price tag, and most users would prefer a fast M.2 NVMe drive over a flashy SATA drive.


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    Anandtech: Join Us This Week for an AT Forums AMA with Intel's Optane Memory Team

    On Wednesday, September 26th through Thursday, September 27th AnandTech's community team will be hosting an ask-me-anything session with Intel’s Optane Team, which will be taking place in the AnandTech Memory & Storage forums. Have a question about Optane drives and Intel’s phase-change 3D XPoint technology? Now’s your chance to speak with Intel directly. Log into the forums to join the discussion and learn about the latest news on the future of Intel’s non-flash persistent memory efforts.
    Intel Optane Technology Team

    • Bill Leszinske, Intel Corporate Vice President, Strategic Planning, Marketing, and Business Development.
    • Chris Tobias, Director, Intel Optane Technology Acceleration Team.
    • James Myers, Director, Data Center Storage Solutions Architecture
    • Avinash Shetty, Senior SSD Strategic Planner and Product Line Manager
    • Roger Corell, Marketing Manager

    This thread will be unlocked, open and live for 48 hours starting at 11:00am ET on Wednesday. Questions will be moderated and supervised by AnandTech Assistant Community Manager, Joshua Simenhoff, as well as a full team of moderators.
    Ask Me Anything Rules

    • No tech support questions, as these require in-depth personal follow-up and diagnostics.
    • All Rules of Conduct apply.
    • Keep questions direct and to the point.
    • Avoid opinion bias, as in, "Why are all your products awesome/horrible?"
    • Be respectful of our guests--no insults, no leading questions.
    • Do not post duplicate questions or repost your question multiple times.
    • Not all questions may be answered. Questions may not be answered in the order in which they are received or posted.

    Only registered users will be able to ask questions, so if you haven’t yet, be sure to register now for your chance to participate!
    The official representatives will reply periodically, using a recognized and verified account.
    Please join us on this date to throw your questions into the mix and ask the Optane team what you've always wanted to know!


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    Anandtech: Arm Unveils Arm Safety Ready Initiative, Cortex-A76AE Processor

    The market of automobiles is changing. Modern cars use more electronics than ever and adoption of electronic components in general and processors in particular is not going to slow down. All major automakers are working on self-driving vehicles, which means that cars of the future will need even more sophisticated SoCs.
    As demand for components needed for autonomous cars is about to explode in the coming years, it is not surprising that more companies start to develop solutions specifically designed for such vehicles. Arm on Wednesday launched its new Arm Safety Initiative that is aimed to develop solutions for self-driving cars. In addition, the company launched its Cortex-A76AE, its first processor IP designed specifically for autonomous vehicles.
    Arm Safety Initiative

    Arm is clearly not a newcomer to the automotive market. The company’s general-purpose and real-time cores have been used by makers of various vehicles since 1996. Nowadays Arm’s IP is used for ADAS (collision avoidance, cruise control, etc.), connectivity, infotainment, powertrain control, and other components of the cars.
    Meanwhile, up until lately Arm supplied automakers its IP originally developed for various devices in general. By contrast, the Arm Safety Initiative is a multi-year program under which the company will develop Automotive Enhanced (AE) custom and semi-custom solutions for autonomous cars. Initially, Arm will start with solutions for Level 3 self-driving vehicles, but over time it will offer products built for Level 4 and Level 5 autonomous cars sometimes in 2020 and beyond.
    The Arm Safety Initiative spans the company’s entire portfolio of products and will include certified physical IP blocks to be made using specific process technologies, ISO 26262-certified software tools and components, safety documentation, and so on.
    Right now, Arm only talks about its Cortex-A76AE processor for self-driving cars, but the grand plan includes Automotive Enhanced processors based on the Helios and the Hercules microarchitectures. Besides, Arm intends to offer AE versions of its future Cortex-R cores sometimes in 2020 and beyond. While Arm is developing AE flavors of its future IP, it will keep offering its existing cores (e.g., Cortex-A72, Cortex-R5, Cortex-R52, Cortex A53, Cortex-M4, Cortex-M7, Cortex-M44, etc.) to developers of SoCs for automotive market.
    The implementation of the ASI program will enable makers of cars to obtain IP that will make their systems for autonomous driving significantly more energy efficient and cheaper, which will make self-driving vehicles more affordable in general. Besides making the said systems cheaper, Arm Safety Initiative also promises to speed up their development.
    Arm’s Cortex-A76AE: The First Member of the AE Family

    The first product that is a part of Arm’s Safety Initiative is the company’s Cortex-A76AE processor with integrated redundancy. As the model number suggests, a Cortex-A76AE compute complex relies on up to 16 Cortex-A76 cores that support all the RAS (reliability, availability, serviceability) capabilities featured by the Arm v8.2 microarchitecture, and work in work in Split-Lock mode to ensure reliability.
    Actual SoCs based on the Cortex-A76AE can scale to up to 64 cores. Besides general-purpose compute cores, Arm’s autonomous-class compute complexes also integrate Mali-G76 graphics cores, ARM’s ML cores, and other necessary IP. Besides, the complexes are set to support Arm’s memory virtualization and protection technologies required for flawless operation of ML and NN accelerators.
    According to Arm, a 30-Watt 16-core Cortex-A76AE SoC implementation made using TSMC’s 7nm process technology has performance of over 250 KDMIPS, which is enough for today’s applications. If a customer wants a higher performance, it may build into more cores, or even use more than one SoC.
    Raw performance is what actually matters for self-driving vehicles. Modern Level 3 autonomous cars run multiple programs at once and that is not going to change anytime soon. According to Arm, software for a Level 5 self-driving auto will contain 1 billion lines of code. By contrast, software used to run a Boeing 787 Dreamliner contains 14 million lines of code.
    Arm’s Split-Lock: Redundant Computing in Hardware

    Now, time to talk about the key feature of Arm’s Cortex-A76AE — the Split-Lock technology. The Split-Lock feature enables SoC developers to use the cores in two modes: the Split Mode to runs the cores independently and achieves higher performance, and in the Lock Mode a core is run in lockstep with a paired core, running the same code and monitoring for any kind of divergences that would be then reported as an error, and failure recovery mechanisms would take over (or at least a driver will be notified).
    The Lock Mode somehow resembles how HP’s NonStop works for mission-critical applications, but the key difference is that Arm’s solution relies completely on hardware and is therefore compatible with any software (think AutoWare, Deepscale, Linaro, Linux, QNX, etc.).
    Arm proposes to use the locked clusters for ASIL-D application that are critically important for safety. By contrast split clusters are intended for ASIL-B apps like infotainment. Given the flexibility of Arm’s hardware-only approach, the Split-Lock can be used by any automaker to run almost any software while ensuring either performance and error-free computing.
    Related Reading:

    Gallery: Arm Unveils Arm Safety Ready Initiative, Cortex-A76AE Processor


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    Anandtech: Seagate Fast SSD and SanDisk Extreme Portable SSD 1TB USB 3.1 DAS Review

    The advent of 3D TLC flash and high-speed interfaces such as USB 3.1 Gen 2 and Thunderbolt 3 has resulted in a number of economical high-performance direct-attached storage devices in the market. These are essentially SATA or PCIe SSDs behind a SATA - USB 3.1 Gen 2 bridge or a Thunderbolt 3 controller. SATA SSDs behind a USB bridge are budget-friendly. Yet, the performance is quite good for the average consumer workload (particularly those sporting a USB 3.1 Gen 2 bridge). Today, we will take a detailed look at the 1TB variants of two such products - the Seagate Fast SSD and the SanDisk Extreme Portable SSD.


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    Anandtech: ASRock Jupiter: 1 Liter UCFF PCs with Six-Core Coffee-Lake CPUs

    ASRock has quietly added a new family of ultra-compact form-factor (UCFF) PCs into its product lineup. The Jupiter-series one-liter systems are designed for Intel’s Coffee Lake processors and feature rather robust expansion capabilities.
    The ASRock Jupiter-series UCFF PCs are compatible with various Intel’s 8th Generation processors with up to 65 W TDP and are based on Intel’s H310 or Q370 platforms, thus aiming at different segments of the market: from entry-level Pentium-powered PCs to higher-end Core i7-powered desktops. Both H310 and Q370 Jupiter machines feature two slots for DDR4-2666 memory modules (up to 32 GB is supported), an M.2-2280 slot for PCIe 3.0 x4 or SATA SSD, two 2.5-inch/9.5-mm bays for storage devices, an M.2-2230 slot for optional 802.11ac + Bluetooth module, and so on.
    While the systems seem to be generally similar internally, they have a number of differences when it comes to connectors and features. The Q370 platform supports Intel’s vPro technology and is therefore more suitable for enterprise users. Next up are connectors. The H310-based machine has three display outputs, including a native D-Sub as well as a DisplayPort and an HDMI. By contrast, the Q370-powered one has two DPs and one HDMI. There is still an option for a D-Sub, yet it is available only for custom-made orders. Meanwhile, there are also differences in USB connectivity. While both do have USB-A and USB-C on the front, the more expensive one supports USB 3.0 speed on the back, whereas the cheaper one has USB 2.0 due to the chipset limitations.
    ASRock Jupter UCFF PCs
    Model Jupiter H310 Jupiter Q370
    CPU Coffee Lake CPU with 35 W or 65 W TDP
    Up to Intel Core i7-8700
    GPU Intel UHD Graphics 630
    DRAM Two DDR4 SO-DIMM slots
    Up to 32 GB of DDR4-2667 in dual-channel mode
    Motherboard H310D4-P1 Q370D4-P1
    Intel vPro Support - Yes
    Storage SSD M.2-2280 (PCIe x4 or SATA) M.2-2280 (PCIe x4 or SATA)
    Intel Optane support
    DFF 2 × 2.5-inch/9.5-mm SATA 6 Gbps
    SD -
    Wireless Optional 802.11ac Wi-Fi + Bluetooth module
    Ethernet 1 × GbE port (Realtek)
    USB Front 2 × USB 3.1 Gen 1 Type-A
    2 × USB 3.1 Gen 1 Type-C
    Back 4 × USB 2.0 Type-A 4 × USB 3.1 Gen 1 Type-A
    Display Outputs 1 × DisplayPort 1.2
    1 × D-Sub
    1 × HDMI 2.0
    2 × DisplayPort 1.2
    1 × D-Sub (optional)
    1 × HDMI 2.0
    Audio 2 × 3.5mm audio jacks (Realtek)
    Other I/O 1 × COM port -
    PSU External 90 W PSU
    Warranty Typical, varies by country
    Dimensions Length: 178 mm
    Width: 178 mm
    Height: 34 mm
    MSRP ? ?
    ASRock already lists its Jupiter H310 system on its website, so expect it to hit the market shortly. The Jupiter Q370 is noted only briefly, so most probably it will arrive a bit later.
    Related Reading

    Source: ASRock (via Tom’s Hardware)


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