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Thread: Anandtech News

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    Anandtech: The ASRock Z390 Taichi Review: Jack of All Trades, Master of None

    In the first of our new Z390 motherboard reviews, we're taking a look at the ASRock Z390 Taichi. This model sits quite high up in the product stack and offers users 2x1G LAN, three PCIe 3.0 x4 M.2 and a total of eight SATA ports. ASRock has taken the unique Taichi design and implemented the new Z390 chipset into the mix for a high-performance and feature-packed offering designed for enthusiasts looking to push the new Intel processors.


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    Anandtech: AMD Investor Relations Announces “Next Horizon” Event for November 6th

    Earlier today on their Investor Relations website, AMD posted notice of a new event. Dubbed “AMD Next Horizon”, the event is currently slated for November 6th – no time is provided – and this is all we know. In fact the event page is outright barren, containing nothing except the name of the event and the calendar links. No other details are provided regarding the content or who might be presenting this event.
    Meanwhile, that this went up on the Investor Relations site is telling. US financial regulations require AMD to post notice of events where significant material information will be disclosed – meaning that when AMD announces new products or releases significant information about products, architectures, & roadmaps, they’re required to make that information accessible to investors. So whatever AMD is up to next week, it’s important enough to trigger those rules.
    As for a best guess at just what AMD is up to, the name “Next Horizon” is notable because this is the second time AMD has used the “Horizon” moniker for an event. Almost two years ago, AMD held their “New Horizon” event, where the company disclosed for the first time the Ryzen brand name as well as revealing some basic information about the then-forthcoming Ryzen processors and related platform. So assuming this is an intentional pattern, then it stands to reason that we’re going to hear something about AMD’s Zen 2 plans next week. The company is intending to launch Zen 2 products in 2019, so an event now would be consistent with those plans.
    As for AnandTech, we’ll have more on the matter if and when AMD releases anything else about the event. So stay tuned.


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    Anandtech: U.S. Government Indicts Chinese DRAM Maker JHICC on Industrial Espionage;

    The U.S. Department of Commerce this week banned U.S. exports to a China-based maker of DRAM. The DoC believes that Fujian Jinhua Integrated Circuit Company (also known as Fujian or JHICC) not only uses technologies obtained from Micron, but also threatens the latter’s long-term economic viability and therefore could also be involved in activities that are contrary to the U.S. national security interests.
    In the meantime, the U.S. Department of Justice has also filed an indictment against JHICC, United Microelectronics Corp. (UMC), and several individuals accusing them of corporate espionage and stealing IP from Micron. Between the two, the U.S. authorities essentially sided with claims that Chinese makers of memory have illegally obtained IP and technologies from DRAM makers from the U.S. and potentially other countries.
    A Complicated Situation

    As a result of DoC actions against JHICC, all U.S.-based (and, actually, non-U.S.-based too) companies will require a special license for all exports, re-exports, and transfers of commodities, software and technology subject to the Export Administration Regulations (EAR). DoC makes no secret that such license applications will be “reviewed with a presumption of denial”, so it will be tremendously hard for JHICC to obtain practically everything, including Windows 7 licenses for manufacturing equipment and production tools themselves (ASML has a strong presence in the U.S., whereas Nikon Precision is based in California). Meanwhile, the whole situation is somewhat more complex.
    “When a foreign company engages in activity contrary to our national security interests, we will take strong action to protect our national security. Placing Jinhua on the Entity List will limit its ability to threaten the supply chain for essential components in our military systems,” Secretary of Commerce Ross said.
    The indictment from DoJ may also have very serious consequences for JHICC, UMC, and several individuals. If found guilty, the companies will face forfeiture and a maximum fine of more than $20 billion, which might easily destroy almost any firm. As for individual defendants, they are facing a maximum sentence of 15 years imprisonment and a $5 million fine. Besides, any products containing allegedly stolen IP will be banned from the U.S. market.
    Without any doubts, a strong new player on the DRAM market poses a threat for the whole industry when it comes to its economic viability, and the DoC is correct when it does not underestimate the DRAM effort. If Chinese companies flood its domestic market with their own memory, global businesses of Micron, Samsung, and SK Hynix might suffer. Micron will of course suffer the most as it is the only DRAM maker with no semiconductor production facilities in China. Meanwhile, for Tianxia the DRAM effort is part of a larger “Made in China 2025” project (which we are going to discuss below) that includes establishment of a domestic semiconductor industry, so actions of the DoC against JHICC may slow down the DRAM endeavor, but will barely affect the grand plan that the Chinese authorities have.
    Since DRAM and NAND are commodities that China has to buy from abroad in order to build hardware that is then sold worldwide, it is natural for China to want to produce them locally. It does not mean that producing DRAM is easy. Developing a competitive chip manufacturing technology from scratch is a tremendously hard task these days as leading makers of semiconductors have spent decades researching microelectronics and have both experience and IP. Building an industry that requires a variety of manufacturing processes is close to impossible. Meanwhile, this is exactly what the Chinese government is attempting to do these days with semiconductors. In the recent months Micron and some other makers of memory accused Chinese DRAM producers of illegally obtaining IP from memory makers based in South Korea and the U.S.
    Micron Acquisition Attempt

    It all began in May 2015, when the Chinese government announced its “Made in China 2025” initiative to broadly upgrade Chinese industry a decade later and reduce the country’s reliance on foreign goods and components. Establishing a competitive domestic semiconductor industry is a significant part of the plan and producing volatile and non-volatile memory is considered one of its crucial parts.
    At first, government-controlled Tsinghua Unigroup tried to acquire Micron and get all the technologies and IP it needed to make DRAM and NAND legally. That deal never worked out and it is widely believed that the Committee on Foreign Investment in the United States (CFIUS) would have blocked the deal. Since by 2015 only three major makers of DRAM remained on the planet, and as giants like Samsung as well as SK Hynix could not be purchased, the Chinese government turned to different tactics in a bid to get what they needed.
    Buying DRAM Technology from… UMC?

    In February 2016 local authorities in Fujian, China, (which are still controlled by the central government) established Fujian Jin Hua Integrated Circuit (JHICC). In May, 2016, JHICC signed a contract with UMC to develop a competitive DRAM manufacturing technology. According to Micron, UMC would get $300 million in R&D equipment in exchange for an advanced DRAM technology. JHICC started to construct its first 300-mm fab in July 2016 (i.e., well before it had a process technology ready). This fab costs $5.65 billion and is about to start production of chips. However there is substantial proof that UMC did not really develop a new DRAM process, but instead headhunted engineers from Micron’s operations in Taiwan in early 2016 and asked them to steal specs and peculiarities of Micron’s chips and process technologies.
    Micron accuses Stephen Chen, a former site director at Rexchip in Taiwan (Rexchip became a part of Micron in 2013) who was hired by UMC in the second half of 2015 and became a senior vice president, of stealing ‘trade secrets’. The company also accuses J.T. Ho and Kenny Wang, its former process integration managers, of stealing documents related to Micron’s process technologies. All three people had all the information about then-current and some upcoming memory products from Micron. Based on what is publicly known about JHICC’s process technology that will be used to make DRAM chips, it appears like that UMC and JHICC have managed to obtain and at least partially replicate one of Micron’s 20 nm-class fabrication process they now call ‘22 nm’.
    Furthermore, the U.S. DoJ has found the evidence from Micron and Taiwanese authorities viable enough to file a civil lawsuit seeking to prohibit JHICC and UMC products developed using Micron's IP from exporting to the U.S.
    Micron started to suspect that it had a leak of confidential information after JHICC and UMC demonstrated a presentation containing Micron’s code names at a recruiting event aimed at Micron staff in the U.S. In the meantime, Taiwanese authorities charged Stephen Chen of stealing trade secrets from Micron. After conducting an internal investigation, Micron filed a complaint against the said companies in Federal District Court for the Northern District of California in December, 2017.
    In response, JHICC and UMC sued Micron in Fuijan, accusing it of infringing their patents in China. All of these patents were originally issued to UMC and given the fact that this company does not produce DRAM or NAND, it is highly likely that they are related to production of semiconductors in general. Micron denies that it had infringed them because they are invalid, according to the company.
    Samsung and SK Hynix Targeted Too

    Micron is not the only company that poses interest to Chinese makers of DRAM. Apparently, South Korean producers of memory are also targets of industrial espionage by the said companies, a report from The Korea Times said citing an “official directly involved with the issue.”
    Both Samsung and SK Hynix have production plants in China, so it remains to be seen how these companies deal with this delicate situation. Neither of them are interested in helping a potentially mighty rival, but they cannot fight government-controlled companies without a risk of ruining relationship with authorities.
    Chinese DRAM Is Already Here

    Despite controversies when it comes to DRAM-related IP, patents, process technologies, and other factors, there are at least three DRAM producers from China that either already make memory, or are about to start manufacturing operations. Besides JHICC, there are Innotron Memory and about Xi'an UniIC Semiconductors. Ironically, the latter inherited IP and process technologies originally developed by Qimonda (which assets were acquired by Elpida and which itself was taken over by Micron). Neither of these companies are under attack by foreign companies or governments (at least as of today), so the Chinese DRAM industry is developing and actual memory chips are already available. Furthermore, if you take a look at the list of JEDEC members, you will find a lot more names from Tianxia that are not only getting ready to make DRAM or NAND, but test equipment for memory chips too.
    With the “Made in China 2025” plan in place, it is evident that China will work rigorously to develop its own semiconductor industry. The early attempts look like a mixed bag, given the DRAM controversies, CPU joint-ventures with AMD and Via Technologies (as well as multiple developers of Arm-based SoCs), licensing of 3D NAND, and so on. The big question is whether you can sustain an industry by either licensing or copying someone else’s work?
    A History Lesson

    Here is a quick example from the past. Having plenty of natural resources, but lacking the industry and designs, the USSR began to buy factories and blueprints from companies like Ford in the 1930s. The country needed both manufacturing technologies and actual products to develop after the devastating civil war of 1917 – 1922, so timing was crucial. The USSR did not stop there: it bought multiple designs from the U.S.-based companies after the World War II, then it bought the Fiat 124 blueprint and factory from Fiat in 1970 (i.e., a process technology + the design). The Fiat 124 small family car design branded as VAZ in the USSR and then in modern Russia had been evolving from 1973 all the way to the 2000s (because at some point the USSR/Russia was no longer able to buy technologies from the West), but it had never been truly competitive against the Western counterparts. Nowadays the automaker AutoVAZ is majority owned by the Renault-Nissan-Mitsubishi Alliance, it produces vehicles based on platforms developed by Renault/Nissan with some customization considering local realities. From a high point of view, the Russian automotive industry has never taken off and today it is a part of the international auto industry.
    Something similar might happen to the Chinese semiconductor industry. Now that Micron, (as well as Samsung and SK Hynix, but unofficially) has accused JHICC of stealing its IP, it is probably going to great length to avoid such a situation in the future. All DRAM makers are going to protect their secrets and technologies more rigorously than ever in a bid not to help their rivals. Therefore, once Micron (or any of the aforementioned memory companies) moves to, say, 4F² cell structure for DRAMs (that has been in the plans for sub-20 nm processes anyway) that will enable to them to make chips smaller and cheaper, companies with outdated fabrication processes and cell structures will not be able to compete in terms of costs. Eventually, with DDR5 and various specific DRAM products (LPDDR, HBM, Wide I/O, etc.) they will not be able to compete in terms of performance too, essentially shrinking their addressable markets.
    Things Getting Tougher

    To make things even harder for Chinese DRAM makers in general, there is an ongoing trade feud between the U.S. and China. The actions of DoC and DoJ against JHICC may be an isolated case, or may be an element of this confrontation. Considering the background of the ongoing Micron vs. UMC legal battle and with facts already discovered by the Taiwanese authorities, it is highly likely that the plaintiff will win a cease and desist in the order barring all devices featuring the infringing memory chips from the U.S. market. In fact, the DoJ is essentially doing the same thing as Micron: barring any JHICC-made memory or products containing such chips from the U.S.
    Another move could be getting a cease and desist order in the Netherlands (the ports of Amsterdam and Rotterdam are the points of entry for virtually all the electronics made in China in the E.U.). Blocking two major markets for devices featuring DRAMs from JHICC will be a problem for this memory maker in particular and for China in general. Considering the fact that JHICC now cannot license anything or buy new equipment, it is going to be extremely hard for the company to take off and stay competitive even if it does.
    There is a reason why China wants its semiconductor industry up and ready right now. The government wants to maintain its exports and lower its imports. China has already done a lot to build up its internal market, but it is unclear whether it is big enough for domestic designs and locally-developed process technologies. The latter may not be as advanced as those designed in the U.S. or South Korea, but remain good enough for mainstream products sold in China. Meanwhile, the U.S. DoC and DoJ just demonstrated that they have a toolset that they will not hesitate to use if they find that interests of companies like Micron are affected by infringements of IP rights by emerging rivals. If more companies join the U.S. DoC’s Entity List, then without proper access to technologies and new equipment, it will be far more difficult to develop Chinese semiconductor industry in the coming years.
    Related Reading:

    Sources: Department of Justice, Department of Commerce, NY Times, Korea Times, Micron, Micron’s Complaint.


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    Anandtech: Apple Announces Q4 FY 2018 Earnings: Revenue Up, Sales Not

    This afternoon Apple announced their earnings for the fourth quarter of their 2018 fiscal year, and in what can only be described as a very Apple-esque quarter, revenue was up 20% year-over-year to $62.9 billion. Gross margin came in at 38.2%, up 0.3% from a year ago. Operating income was up 22.9% to $16.1 billion, and partially due to the new tax cuts, net income was up 31.8% to $14.1 billion. Earnings per share were up 40.6% to $2.91.
    Apple Q4 2018 Financial Results (GAAP)
    Q4'2018 Q3'2018 Q4'2017
    Revenue (in Billions USD) $62.900 $53.265 $52.579
    Gross Margin (in Billions USD) $24.084 $20.421 $19.931
    Operating Income (in Billions USD) $16.118 $12.612 $13.917
    Net Income (in Billions USD) $14.125 $11.519 $10.714
    Margins 38.5% 38.3% 37.9%
    Earnings per Share (in USD) $2.91 $2.34 $2.07
    As usual, iPhone leads the way at Apple, but as has become the norm the Q4 results will only have a glimpse at the new launch sales, since this quarter ended on September 29. iPhone revenue was up a staggering 29% year-over-year to $46.9 billion, but overall unit sales were up only 0.4% from Q4 2017, with 46.9 million devices sold this quarter. But with iPhone pricing moving in an upward trajectory, Apple now has an amazing $793.04 average selling price on iPhone.
    The other half of iPhone is Apple’s services, which are up 17% year-over-year to just under $10 billion for the quarter. Services include digital content, Apple Pay, and of course iTunes sales.
    We just saw a Mac event this week, showing off the new MacBook Air and Mac Mini, but with this quarter ending in September we won’t be able to see that impact Mac sales until Q1 2019. For this quarter, Mac sales fell 2% to 5.3 million units, with revenue up 3% reflecting the higher price of the new models.
    iPad sales also fell. Apple sold 9.7 million iPads this quarter, which was down 6% from last year. Revenue fell even further though, coming in at $4.1 billion for the quarter, which is a 15% drop from Q4 2017. Apple’s price-reduced iPad has likely eaten into sales of the more profitable Pro models, but like the Mac updates, the latest iPad Pros were just announced and won’t be reflected in this quarter’s earnings.
    Apple Q4 2018 Device Sales (thousands)
    Q4'2018 Q3'2018 Q4'2017 Seq Change Year/Year Change
    iPhone 46,889 41,300 46,677 +14% +0.4%
    iPad 9,699 11,553 10,326 -16% -6%
    Mac 5,299 3,720 5,386 +42% -2%
    Finally, Apple’s “Other” category, which has become their catch-all, had $4.2 billion in revenue, which was up 31% from a year ago. Other now includes HomePod, in addition to Apple TV, Apple Watch, Beats, and accessories.
    Apple is expecting revenues for Q1 2019 to be between $89 and $93 billion, with margins between 38% and 38.5%.
    Moving forward, Apple has also decided to stop reporting unit sales. This is unfortunate, because Apple has been more open on their earnings than several of their competitors, even though they’ve never broken-down sales per-model in a category. There’s likely a good reason for this of course. With device sales declining, they will be taking heat, despite the company continuing to increase revenue.
    Source: Apple Investor Relations


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    Anandtech: GlobalFoundries Establishes Avera Semiconductor: a Custom Chip Company

    GlobalFoundries this week announced that it has spun off its ASIC Solutions division, establishing Avera Semiconductor, a wholly owned subsidiary that will help fabless chip developers to design their products. Avera will work closely with GlobalFoundries' customers to enable them take advantage of various process technologies that GF has, but the company will also establish ties with other contract makers of semiconductors to help their clients develop chips to be made using leading edge process technologies at 7 nm and beyond.
    Avera Semi will inherit a rich portfolio of silicon-proven IP containing Arm cores, performance and density-optimized SRAMs, embedded TCAMs, high-speed SerDes, interfaces, and other necessary things. In addition, Avera will offer production-proven design methodologies as well as advanced packaging options. Right now, Avera naturally has silicon-proven IP for GlobalFoundries’ manufacturing technologies as well as Samsung Foundry’s 14LPP fabrication process, but over time the company will have to gain silicon-proven IP for other contract makers of semiconductors, namely TSMC.
    GlobalFoundries says that Avera’s team can serve clients from virtually every semiconductor industry, including AI/ML (think leading edge technologies), aerospace & defense (think special-purpose technologies as well as radiation-resistant semiconductors), HPC, storage, wired/wireless networking, and so on.
    The new wholly owned subsidiary of GlobalFoundries has over 850 employees, an annual revenue of over $500 million, and ongoing projects worth $3 billion. By working not only with clients of GlobalFoundries, but expanding to customers of companies like Samsung Foundry and TSMC, Avera has a chance to increase its earnings over time. Avera Semi is led by Kevin O’Buckley, a former head of ASIC Solutions, who joined GlobalFoundries from IBM.
    Avera Semiconductor will continue to work with a variety of industry partners, including Arm and Synopsys, who have already endorsed the new business unit.
    Related Reading:

    Source: GlobalFoundries


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    Anandtech: The Google Pixel 3 Review: The Ultimate Camera Test

    The Pixel 3 is Google’s third generation in-house design, meant to showcase the company’s own view of what an Android device should be, whilst fully embracing Google’s first-party software applications and services. The one thing Google’s Pixel phones have become synonymous with is the camera experience. The Pixel 3 continues this focal point of the line-up, and promises to be “the best smartphone camera”, period. We’ll dive into the phone and verify Google claims, including an extensive camera comparison between all of this year’s major camera shooters.


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    Anandtech: Corsair Unveils Hydro H100i & Hydro H115i RGB Platinum LCSes with Mag Lev

    Corsair on Thursday introduced two new closed-loop CPU liquid cooling systems, both of which feature its magnetic levitation fans and RGB lighting..The new Hydro Series RGB Platinum LCSes also feature what Corsair is calling a Zero RPM cooling profile, which stops the fans entire at low processor temperatures to further reduce the noise levels generated by the PC.
    Corsair’s Hydro H100i RGB Platinum and Hydro H115i RGB Platinum use the company’s new pump with a copper base and integrated RGB lighting, as well as new magnetic levitation PWM fans that minimize the friction on their magnetic bearing. The company’s mag lev bearing promises to generate high airflow and static pressure while making less noise than fans featuring a ball bearing. The H100i model is equipped with two 120-mm fans spinning at 400 – 2400 RPM and a 240-mm radiator, whereas the H115i model is outfitted with two 140-mm fans spinning at 400 – 2000 RPM as well as a 280-mm radiator.
    Corsair does not disclose maximum amount of heat that its new Hydro Series RGB Platinum LCSes can dissipate, but given the fact that the coolers can handle AMD’s Ryzen Threadripper and Intel’s Core X parts, it is safe to say that their thermal performance is well north of 250 W (400 W is a relatively safe bet, but it is not an official figure). Besides AMD TR4 and Intel 2066-pin processors, the coolers also come with mounting brackets for AMD’s AM2/AM3/AM4 CPUs as well as Intel’s 115x-pin chips.
    One thing to keep in mind when using the Hydro Series RGB Platinum coolers with AMD’s Ryzen Threadripper is that they feature a square base and therefore they cannot cover 100% of the large TR4 IHS surface. This won't prevent reliable operation of these processors, but it remains to be seen how efficient they are going to be during overclocking of AMD’s HEDT products.
    Modern high-end PC hardware not only has to perform well, but also look good in a bid to attract the enthusiast/modding community. The new Hydro Series RGB Platinum closed-loop liquid coolers from Corsair do just that: they feature 16 addressable RGB light LEDs in the pump and four ARGB LEDs in each fan. The lights can be controlled using Corsair’s iCUE software, which can also adjust pump and fan speeds as well as create custom cooling profiles that automatically regulate speeds in accordance with a range of monitored system temperatures.
    Specifications of Corsair Hydro Platinum RGB Cooling Systems
    Hydro H100i Platinum RGB Hydro H115i RGB Platinum
    CPU Socket Compatibility Intel: 2066, 2011-3, 2011, 115x
    AMD: AM2/AM3, AM4, TR4
    Radiator Material Aluminum
    Dimensions 277 × 120 × 27 mm 322 × 137 × 27 mm
    Fan Dimensions 120 x 120 x 25mm 140 x 140 x 25mm
    Speed 400 ~ 2400 RPM (PWM) 400 ~ 2000 RPM (PWM)
    Air Flow up to 75 CFM up to 97 CFM
    Air Pressure up to 4.2 mm H2O up to 3 mm H20
    MTTF ?
    Noise Level up to 37 dBa
    Connector 4-Pin (PWM)
    Pump Dimensions ?
    MTTF ?
    Noise Level ?
    Connector 4-Pin
    Price $160 $170
    Warranty 5 Years
    Corsair’s Hydro H100i RGB Platinum as well as Hydro H115i RGB Platinum liquid coolers are backed by a five-year warranty and are available immediately from the company’s resellers as well as directly. The smaller H100i model costs $160, whereas the bigger H115i model is priced at $170.
    Buy Corsair Hydro H100i RGB Platinum on
    Buy Corsair Hydro H115i RGB Platinum on
    Related Reading:


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    Anandtech: Intel Goes For 48-Cores: Cascade-AP with Multi-Chip Package Coming Soon

    Ahead of the annual Supercomputing 2018 conference next week, Intel is today announcing part of its upcoming Cascade Lake strategy. Following on from its server-focused Xeon Scalable Skylake family, Intel has already pre-announced that Cascade Lake-SP will form the next generation, with a focus on compute and security. Today’s announcement is for a product family to run alongside Cascade Lake-SP, called Cascade Lake-AP, or Cascade-AP for short. Cascade-AP is going to be aimed at ‘advanced performance’. In order to implement this new processor family, Intel is combining multiple chips in the same package.


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    Anandtech: Lexar Launches 512 GB microSD Card with A2 App Performance Spec

    Lexar this past week introduced its new family of A2-class microSD cards, the Lexar High-Performance 633x A2. Supporting the highest Application Performance class, the new microSD card is designed in particular for smartphones that need additional storage space for applications. Overall the Lexar High-Performance 633x family of microSD cards is fairly diverse; the cards range in capacity from 16 GB to 512 GB in capacity, and not all of the cards meet an App Performance class standard. Indeed, only the new 512 GB card meets the A2 class standard, while the medium-sized cards are A1 class.
    Under the hood, all the cards use the UHS-I bus and are rated for 95 MB/s – 100 MB/s reads as well as 45 MB/s – 70 MB/s writes. Most of the cards in the lineup support the Video Speed Class 30 spec, therefore offering at least 30 MB/s sequential write speeds. As for operating temperature range, it is pretty standard: from 0° to 70° C (32°F to 158°F), which is good enough for everyone except those using specialized devices to work in extreme conditions.
    The key feature of the Lexar High-Performance 633x range is of course support for A1 and A2 App Performance specifications, for use with Android phones that need more space for applications. While A1 cards are pretty common these days, A2 cards are still rare partly because they require a more sophisticated (and expensive) controller and partly because not all of their features can be experienced on commonly available hosts.
    As we've mentioned before, A2-badged microSD cards mandate a random performance of at least 4000 read IOPS and 2000 write IOPS (vs. 1500/500 read/write IOPS mandated by the A1). Meanwhile, A2-compliant controllers have to support such functions as command queuing (with a minimum depth queue of 2 and a maximum depth queue of 32) to optimize random read performance, caching to hit write performance targets, as well as self-maintenance capabilities. Though to get the most out of an A2 card, the host also needs to support command queuing to guarantee the device's read performance.
    Lexar High-Performance 633x microSD Cards
    512 GB 256 GB 128 GB 64 GB 32 GB 16 GB
    Sequential Read Speed 100 MB/s 95 MB/s
    Sequential Write Speed 70 MB/s 45 MB/s ?
    Minimum Sequential Write Speed 30 MB/s 10 MB/s
    Minimal Random Read Speed 4000 IOPS 1500 IOPS ?
    Minimal Random Write Speed 2000 IOPS 500 IOPS ?
    Operating Temperatures 0° to 70° C (32°F to 158°F)
    Interface UHS-I
    Availability Q4 2018
    SDA Labels A2, V30, U3 A1, V30, U3 A1, V10, U1 U1
    Part Numbers LSDMI512BBNL633A
    Lexar’s High-Performance 633x family of microSD are already available from retailers like Amazon. The models featuring capacities up to 256 GB are priced up to $179.99. The top-of-the-range 512 GB A2-compliant model is expected to hit the market shortly at a price of $299.99.
    Buy Lexar High-Performance microSDXC 633x 256GB on
    Related Reading:

    Source: Lexar


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    Anandtech: Intel Xeon E Six-Core Review: E-2186G, E-2176G, E-2146G, and E-2136 Tested

    Despite having officially launched back in July, Intel’s Xeon E desktop platform has yet to see the light of day in systems casually available to users or small businesses. This should change today, with the official embargo lift for reviews on the parts, as well as the announcement today that SGX-enabled versions are coming for Server use. The Xeon E platform is the replacement for what used to be called the E3-1200 family, using Intel’s new nomenclature, and these parts are based on Intel’s Coffee Lake (not Coffee Lake Refresh) microarchitecture. We managed to get a few processors in to test, and today we’ll start by examining most of the six-core family.


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