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Thread: Anandtech News

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    #9621

    Anandtech: Realtek Demonstrates RTD2893: A Platform for 8K Ultra HD TVs

    Just like with any other major transitions, the shift to 8K Ultra HD TVs will require not only new display panels (and even new display technologies), new cables, and new media, but also new codecs as well as new SoCs. To this end, Realtek demonstrated its first platform for 8K televisions and Ultra HD set-top-boxes/players at Computex.
    Realtek’s RTD2983 SoC can support decoding 8K resolution videos encoded using the AV1, HEVC, and VP9 codecs. The chip can process all HDR formats, reduce noise, upscale, and perform all the other functions common for processors for televisions and digital media players. The RTD2983 has PCIe and USB 3.0 interfaces, it can receive data via an HDMI 2.1 48 Gbps interface, and transmit pixel data over Vby1 wires. One advantage the RTD2983 has is embedded memory, which eliminates necessity to use external DRAM devices, lowering the BOM costs for finished products.
    Since Ultra HD content is scarce, Realtek demonstrated the RTD2983 platform at Computex using a static picture encoded using one of the aforementioned codecs. The lack of complex motion is a bit of a letdown here, but considering how hot the SoC's heatspreader got, Realtek certainly wasn't running a light workload here.
    As for consumer applications for the new chip, Realtek ultimately brought the RTD2983 to Computex to show potential customers that it's ready, and that interested parties can start designing their devices based on the SoC. Though keeping in mind long design cycles for consumer electronics, it bears noting that we won't see Realtek's new SoC show up in finished products for a while yet. But in a year or two down the line, this is likely to be one of several SoCs we'll see at the heart of various mass-market Ultra HD boxes.
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    #9622

    Anandtech: The OnePlus 7 Pro Review: Outstanding Performance & Screen, Adequate Every

    It’s been a month since OnePlus released their new flagship devices for 2019: The OnePlus 7 and OnePlus 7 Pro. The phone is one of the most awaited devices of the year and with the OnePlus 7 Pro, the company is promising to deliver a significantly better “ultra-high-end” device than ever before. Indeed over the last few years OnePlus has evolved from being a niche brand to actually being one of the most recognized smartphone vendors. With the increased popularity and product maturity, prices have also gone up, and the new OP7Pro carves itself into a higher tier device segment. Still, OnePlus’ product mantra remains unchanged and the new phone promises to deliver outstanding value for the price, being nick-named the “Flagship Killer”.
    Today we review the OnePlus 7 Pro in depth, and investigate the device’s outstanding performance, the new unique 90Hz 1440p OLED display, and OnePlus’ take on a new triple-camera setup and implementation of a 48MP sensor. Naturally, we also have to talk about the phone’s new design – characterised by the new full-screen bezel-less display and pop-up front camera.

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    #9623

    Anandtech: Phison Readies PS2251-17: A USB 3.2 Gen 2x2 Controller for External SSDs

    At this year's Computex trade show, Phison revealed that it is working on a USB 3.2 Gen 2x2 controller for external SSDs. Dubbed the PS2251-17 (U17), the company expects drives based on the chip to offer sequential transfer rates up to 1300 MB/s, which is notably higher than USB SSDs featuring a lower-bandwidth USB 3.2 Gen 2 interface. Retail USB drives based on this new controller, in turn, should be available sometime next year.
    The Phison PS2251-17 controller features two NAND channels with 16 CEs that support modern types of flash, including 3D TLC and 3D QLC NAND, with Toggle 3.0 or ONFI 4.0 interfaces. The chip also supports Phison’s 4th Gen implementation of LDPC and RAID-based ECC, SmartZIP technology, AES256, and other features found on other controllers from this company.
    When it comes to performance, Phison says that SSDs based on the PS2251-17 will offer up to 1300 MB/s sequential read/write speeds as well as up to 200K IOPS. Real-world performance will, of course, depend on type of 3D NAND use as well as implementation by the manufacturer.
    Phison plans to sample single-chip controller for USB 3.2 Gen 2x2 solid-state storage devices in the fourth quarter of this year. Retail drives would then follow in later quarters, hitting the market sometime in 2020.
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    #9624

    Anandtech: PowerColor's External Behemoth: The 750 Watt TBX-750FA eGFX Box, With 100

    Tul, the parent company of PowerColor, currently has two external graphics (eGFX) boxes for high-end graphics cards, as well as low-power miniature eGFX solutions. Both sides of the coin have allowed the company to gain a lot of experience when it comes to external Thunderbolt 3 graphics. At this year's Computex, the company demonstrated its upcoming enclosure for high-performance customers that will offer even more advantages over their previous-gen chassis.
    The TBX-750FA eGFX box is equipped with a 750 W power supply, which allows it to deliver up to 500 W of power to a graphics card as well as up to 100 W of power to its host laptop via USB-PD. With 500 W of power available to a video card, the chassis will be compatible even with the highest-performing video card, with a good bit of headroom to spare for overclocking. Furthermore, the box will be able to power high-end 15.6-inch laptops.
    Traditionally for Tul, and PowerColor, the TBX-750FA eGFX box supports loads of additional capabilities. In particular, the unit has a 2.5-inch SATA bay, a GbE port, an SD 4.0 card reader, as well as five-port USB 3.0 hub.
    The TBX-750FA can house a 2.5-slot wide graphics card and integrates a standard power supply along with multiple additional components, which makes the chassis rather bulky.
    At Computex, Tul demonstrated its TBX-750FA eGFX enclosure under its own brand, which means that the chassis will be available not only to PowerColor, but to other suppliers of eGFX products too. It is hard to say when this product is set to be available from any brand, but at Computex the company demonstrated a pre-production sample.
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    #9625

    Anandtech: A Super Fanless Chassis from TureMetal: For DIY & 0 db Workstations

    High-performance and DIY desktop computers use either sophisticated air or liquid cooling systems. While there are passively cooled PCs, they typically are either proprietary or work with a limited set of components. Mical Wong, an enthusiast from Shanghai, decided to change that and founded TureMetal Fanless Design Studio, which builds cases for fanless DIY desktops. TureMetal was at Computex this year to show off its latest designs.
    TureMetal currently offers five fanless PC cases: the DP2, UP7, UP3, UP5, and UP10, all aimed at different kinds of systems. Three of them are designed for smaller desktops that do not need a lot of compute horsepower, but two of them can be used to build high-performance gaming or workstation PCs with discrete graphics, plenty of storage space and so on.
    All the enclosures use the same cooling principle: transfer heat from the key components to large radiators located on the sides of the chassis using heat pipes, almost in effect using the whole chassis as a heatsink. The main advantage – and the main selling point of all cases from TureMetal – is that they are adjustable, with movable vapor chambers to allow the cooling system to match the layout of the installed motherboard.
    We are going to start from TureMetal’s cases for lower-power systems. The smallest DP2 chassis only supports Mini-ITX motherboards, can cool down a 50 ~ 70W CPU with integrated graphics, and uses a proprietary PSU. The larger UP3 case is compatible with Mini-ITX platforms carrying a CPU with up to 85 W TDP, but also does not support a standalone video card. The UP7 enclosure looks like a typical Mini-ITX system, can work with appropriate motherboards and can house a discrete graphics card (yet, the unit does not support passive cooling of a GPU natively). It is noteworthy that all of their cases can work with a variety of Mini-ITX motherboards, thanks in big part to its adjustable CPU vapor chambers.
    TureMetal’s UP5 and UP10 chassis are considerably larger yet considerably more sophisticated than the other boxes. Both can cool down higher-end CPUs and GPUs and house multiple storage devices. The UP5 can accommodate a Mini-ITX or Micro-ATX motherboard and cool down a performance-mainstream CPU and GPU.
    By contrast, the UP10 can house an ATX mainboard. Furthermore, the UP10 can remove 120 ~ 180 W of heat from a CPU as well as 170 ~ 250 W of heat from a GPU, enough for HEDT processors and top-of-the-range graphics cards.
    The UP5 and UP10 chassis from TureMetal are naturally the most versatile cases from the company yet as they can accommodate a variety of components and enable a great variety of PCs: from utterly quiet HTPCs to advanced 0 dB fanless workstations.
    In addition to its desktop form-factor cases, TureMetal is also developing a tower case that will be rated for an even higher TDP and thus enable even faster PCs. The case is due sometime in 2020, but the company isn't disclosing any firm launch dates.
    Right now, TureMetal’s cases can only be bought directly from the company or from Taobao. The manufacturer hopes that as it gets better known, it will gain retail partners in Asia, Europe, and the US, so its cases will be more widely available.
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    #9626

    Anandtech: Apple Recalls Mid-2015 15-inch "Retina" MacBook Pro Laptops For Battery Sa

    Apple has initiated a voluntary recall for their mid-2015 15-inch "Retina" MacBook Pros over a potential safety issue with their integrated batteries. The manufacturer says that some of these batteries can overheat, which poses a safety risk.
    Apple claims that a limited number of the 15-inch MacBook Pros sold between September 2015 and February 2017 use a battery that pose potential safety risk as they can overheat. Notably, this is the final generation of "Retina" MacBook Pros, and the issue does not affect either earlier (pre-2015) or the later USB-C models. As part of the program, Apple will replace affected batteries free of charge worldwide.
    Owners of mid-2015 MacBook Pros are, in turn, being asked to visit a special page on Apple’s website to submit their device's serial number in order to find out whether their notebooks are eligible for the program. Affected laptops can be taken to an Apple store, an authorized repair center, or mailed in, with Apple advising owners that the entire service process may take one to two weeks. In the meantime, owners of affected laptops should not be using them any longer than necessary to grab a fresh backup of their contents.
    Meanwhile, typical for Apple, the company has not disclosed how many notebooks may be affected; though that information may show up once they submit a formal statement with the US Consumer Products Safety Commission. And while there is nothing good about an overheating battery, one of the other AnandTech editors did point out there is a silver lining to all of this: affected laptop owners are about to get a free battery replacement for laptops that are now coming up on a few years old, breathing some new life into Apple's final generation of 15-inch laptops with multiple port types and a (proper) set of function keys.
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    Source: Apple


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    #9627

    Anandtech: Huawei Clarifies Android Update Situation, Commits to Android Q for Last 2

    Huawei last night launched an information campaign about the status of software updates on existing devices in the face of the company’s troubles with the U.S. Commerce Department.
    The important news is that Huawei is confirming to and committing to continues security and Android platform updates, specifically the upcoming release of Android Q.
    In general the news is no surprise as certification and approval happens several months before the actual software update. With Huawei receiving a reprieve on updates, it means in general business continues as usual for the moment being.
    Specifically, Huawei confirms Android Q firmware updates approval requests have already been submitted for the following devices:

    • P30 Pro
    • P30
    • Mate 20
    • Mate 20 Pro
    • PORSCHE DESIGN Mate 20 RS
    • P30 lite
    • P smart 2019
    • P smart+ 2019
    • P smart Z
    • Mate 20 X
    • Mate 20 X (5G)
    • P20 Pro
    • P20
    • Mate 10 Pro
    • PORSCHE DESIGN Mate 10
    • Mate 10
    • Mate 20 Lite

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    #9628

    Anandtech: Huawei Announces Nova 5 & Nova Pro in China: Introduces New Kirin 810 Chip

    Today Huawei announced the brand new Nova 5 series of smartphones. The company released the new Nova 5, Nova 5 Pro and Nova 5i in China with availability later this month. The new Nova 5 and 5 Pro are particularly interesting because they now represent Huawei’s lowest priced devices with OLED displays, also featuring high-end cameras and SoC options.


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    #9629

    Anandtech: SK Hynix Launches 2nd Gen Enterprise SSD: 72-Layer 3D NAND & In-House Cont

    SK Hynix on Thursday introduced its 2nd generation enterprise-grade NVMe SSDs, which are based entirlely on the company's in-house SSD technology. The new drives offer 4 – 8 TB capacities depending on form-factor, and compared to their predecessors offer 30% improve sequential read speeds as well as 70% faster random write speeds. Select customers of SK Hynix have already received the new drives for qualification purposes.
    SK Hynix’s 2nd gen enterprise NVMe SSDs are based on the company’s Gemini controller – an eight NAND channel design – as well as 72-layer 3D NAND chips marked at H25QFTMG4A9R (these stacks rely 512 Gb 3D TLC NAND devices with a 13.5 MB page size). The drives will be available in M.2 form-factor with up to 4 TB capacity as well as in U.2 form-factor with up to 8 TB capacity.
    As far as performance is concerned, SK Hynix says that its 2nd gen enterprise NVMe SSDs offer up to 3.2 GB/s sustained sequential read speeds as well as up to 160K sustained random write IOPS, both of which are significantly higher performance numbers than the company’s 1st gen enterprise NVMe drives introduced last summer.
    When it comes to applications, the new SSDs can be configured for both read-intensive as well as mixed-use workloads, which means they can be applied to the vast majority of use cases that are out there (cloud, datacenters, AI/ML, big data, edge computing, etc.)
    SK Hynix will demonstrate its 2nd gen enterprise NVMe SSDs at HPE Discover in Las Vegas, which takes place from June 18th to 20th. Mass production of the SSDs will kick off in the second half of the year. Meanwhile, global cloud service providers and server makers have already begun qualification of the new drives.
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    Source: SK Hynix
    Gallery: SK Hynix Launches Enterprise SSD: 72-Layer 3D NAND, Own Controller





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    #9630

    Anandtech: ADATA Demonstrates HD830 Ultra-Rugged HDDs

    There are many reasons why external storage devices are gaining traction these days, so storage vendors have been aiming to expand their product lineups and offer storage solutions that meet market needs while still offering a degree of differentiation from their rivals. ADATA for its part already has a comprehensive lineup of consumer-grade external HDDs and SSDs, so at this year’s Computex the company introduced its new HD830 ruggedized external hard drive, which is designed to withstand rather tremendous pressure and is water, dust, and shock-proof.
    ADATA’s HD830 comes in 2 TB, 4 TB, and 5 TB capacities. The drive can survive up to 3 tons (3000 kilograms) of pressure – enough to survive being run over by a car. It can also withstand drops from 4 feet as well as the regular bumps of life. The HD830 storage devices are completely sealed against dust and water: they can survive for 120 minutes when submerged at a two-meter depth. The drives use a micro-B USB 3.1 to USB 3.1 Type-A cable to connect to their hosts.
    To ensure the durability of their drives, for the HD830 series ADATA packs a 2.5-inch HDD into a special plastic container that guards against shocks and liquids, which is then put inside an aluminum enclosure that further reinforces the whole container. The aluminum chassis is then itself protected by using a special silicone shock-absorbing casing. Last but not least, the HD830 has its own shock sensors as well as LEDs that detect and inform users the drive is hit during its operation or a disk error occur.
    One thing to keep in mind is that modern high-capacity 2.5-inch HDDs are based on shingled magnetic recording with all of its peculiarities when it comes to performance. So expect HD830 to come with those associated performance quirks. Though admittedly, the main advantage of these drives is their rugged construction, not extreme performance.
    ADATA is already selling its HD830 external HDDs via Amazon for $103, $152, and $196 for 2 TB, 4 TB, and 5 TB, respectively. Expect wider retail availability in the near future.
    Buy ADATA HD830 on Amazon.com
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