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Thread: Anandtech News

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    #9661

    Anandtech: AMD Launches Xbox Game Pass for PC Bundle for Current Radeon & Ryzen Produ

    Last month back at the Radeon RX 5700 series reveal, AMD announced that they would be launching a new kind of game bundle with the new video cards. Rather than going with the traditional game bundle, the company would instead be bundling a 3 month subscription to Microsoft’s new all-you-can-eat game subscription service, Xbox Game Pass for PC. Meanwhile, as it turns out, AMD’s bundle offer is more comprehensive than they first let on: this week the company announced the bundle also covers most of AMD’s current-generation products as well, with that program kicking off right now.
    Over the years AMD has offered a number of game bundles, especially on the video card side of matters. However, a game bundle covering such a wide swath of both their CPUs and GPUs is a bit more unique. In this case the company is looking to hit the ground running on their Ryzen 3000 and Radeon RX 5700 series launches, while also including their current-generation products to entice buyers there as well. All told, along with the new parts, the bundle covers the Radeon RX 560 and higher on the video card side, and the Ryzen 5 2400G and better on the CPU side of matters.
    AMD Xbox Game Pass for PC Bundle
    Hardware Bundle Campaign End Date
    AMD Radeon RX 560 & Above
    (Including Radeon RX 5700 series)
    Xbox Game Pass for PC
    3 Months Free

    (Cannot be stacked)
    March 10th, 2020
    AMD Ryzen 5 2400G & Above
    (Including Ryzen 5/7/9 3000 series)
    Up until now, at least, bundling a game subscription service is unorthodox for this industry; vendors have typically bundled specific games with their products, often as part of large cross-promotional and bulk purchase deals. Resale shenanigans aside, the drawback for hardware vendors has been the need to select games well in advance, and hope they’ve selected good and popular games that will entice their customers. A game subscription service, on the other hand, sidesteps those issues by offering a large selection of games for customers across a number of genres, which in the case of Microsoft’s service includes Metro Exodus and Microsoft-published games like Forza Horizon 4 and Gears 5.
    The flip side is that outside of a few headliner titles, these sorts of services tend to be comprised of older games, and Microsoft’s service is no exception to that rule. So while the library is relatively extensive, few of the games available are highly-popular AAA titles (as publishers would want to sell full-priced copies of those anyhow). The very nature of a subscription service also means that while hardware buyers come out of the deal with free service time, they don’t end up owning (and getting to keep) any games. In this respect a free subscription offer falls closer to a free trial, especially with AMD’s bundle since it’s only for 3 months and the vouchers can’t be stacked (so you can’t buy a Ryzen CPU + Radeon GPU and get 6 months, for example).
    At any rate, AMD’s Xbox Game Pass bundle has kicked off this week for AMD’s current-generation products, and will go into effect on Sunday for their next-generation products when those launch. Most retailers are participating in the program, but you’ll want to check AMD’s website for a complete list, along with information on how to redeem the vouchers. The program is set to end on March 10th of 2020, or when AMD runs out of vouchers.


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    #9662

    Anandtech: Synopsys to Accelerate Samsung’s 7nm Ramp with Yield Explorer Platform

    Synopsys has announced an acceleration of development on its yield learning platform designed to speed up ramp up of chips made using Samsung Foundry’s 7LPP (7 nm low power plus) process and newser technologies. The Yield Explorer is a complex yield learning platform that is designed to analyze product layouts, fab data, and product test data in order to find weak spots and enable engineers to improve yields of various chips. Eventually, the Yield Explorer will be enhanced for Samsung’s 5 nm, 4 nm, and 3 nm nodes.
    Production of modern chips is an extremely complex process that takes several months to accomplish and involves thousands of steps. Actual yields of chips depend on quality of their designs as well as their power and performance requirements. Therefore, to improve yields of a particular silicon chip, multiple things have to be analyzed to identify systematic yield limiters, and this is exactly what Synopsys’ Yield Explorer does.
    The Yield Explorer is a complex set of programs that analyzes data from three sources using advanced machine learning and data visualization techniques. First up, Yield Explorer analyzes product design, including layout and static timings. Secondly, the complex analyzes fab data, including inspection and metrology. Thirdly, the platform considers various product test data, such as binning, system level testing.
    Synopsys' Yield Explorer at a Glance
    Source Feature
    Product design data Layout, netlist, test diagnosis, static timing analysis
    Fab data Inspection, metrology, wafer acceptance test (WAT)
    Product test data Bin, parametric, system-level test
    Keeping in mind that silicon design is a property of the designer, whereas information about peculiarities of fab operations and characteristics is confidential, the platform that analyzes yields enables secure collaboration between the foundry and customer.
    At present, Samsung Foundry and Synopsys offer Yield Explorer for designs produced using 10LPE, 10LPP, 8LPP, 8LPU, and 7LPP fabrication technologies (10 nm, 8 nm, and 7 nm nodes). Compatibility with 7LPP enables the two companies to leverage the platform to 5LPE, 4LPE (and possibly to 6LPP) processes. Furthermore, there is a plan to use Yield Explorer for chips made using 3GAE technology that uses gate all around MBCFET transistors based on silicon nanosheets.
    "The secure collaboration model using Yield Explorer has greatly helped us to work efficiently with key customers to achieve target production yields quickly. We look forward to expanding this cooperation with Synopsys as we ramp up production on our 5-nanometer technology node."
    - JY Choi, vice president of the Foundry Design Technology Team at Samsung Electronics
    Related Reading:


    Source: Synopsys


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    #9663

    Anandtech: The Sennheiser GSP670 Wireless Gaming Headset Review: Cutting The Cord

    Here at AnandTech we usually don’t really review much audio hardware or audio accessories, however we’ve been given the opportunity to take a look at Sennheiser’s new GSP670 gaming headset. Sennheiser is well known in the higher end audiophile market and various HD series of headphones in particular have a good reputation when it comes to sound fidelity.
    The recently released GSP670 is a successor and alternative to last year’s GSP600 gaming headset, with the big distinction that the new model is a fully wireless model, introducing Sennheiser’s new low-latency RF codec and USB adapter, as well as supporting Bluetooth connectivity.
    Today we’ll be going over the headphone in detail, and specifically looking at the implementation of the wireless connectivity, detailing the pros and cons of having a non-wired alternative.

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    #9664

    Anandtech: ASRock’s 4X4 Box-R1000: A Ryzen-Based 0.87-Liter PC

    ASRock has introduced what could be the world’s smallest system based on AMD Ryzen processor. The 4X4 Box-R1000 ultra-compact form-factor (UCFF) PC can fit on the palm of a hand, yet it packs everything needed to run a variety of software required for digital signage, kiosks, thin clients and other applications.
    Measuring 110×118.5×67.3 mm and weighing 0.7 kilograms, the ASRock 4X4 Box-R1000 is based on AMD’s dual-core Ryzen Embedded R1000-series SoC (the R1606G or the R1505G model) with integrated Radeon Vega graphics. The system can accommodate up to 32 GB of DDR4-2400 memory (using two SO-DIMMs), a 2.5-inch SATA storage device, as well as an M.2-2260 SSD featuring a SATA or PCIe 3.0 x4 interface.
    When it comes to connectivity, the ASRock 4X4 Box-R1000 features two GbE connectors (controlled by the Realtek RTL8111G controllers), a Wi-Fi 5 controller (Intel Wireless-AC 3168), three USB 3.0 Type-A ports, two USB 2.0 Type-A connectors, one HDMI, two DisplayPorts, and a 3.5-mm audio connector for headsets.
    While the 4X4 Box-R1000 can be used as a UCFF desktop PC, it is primarily aimed at embedded applications. As a result, it is equipped with a watchdog timer and is rated to run at temperatures of up to 40ºC.
    ASRock's 4X4 Box-R1000 PCs
    Model 4X4 Box-R1000V 4X4 Box-R1000M
    CPU AMD Ryzen R1505G
    2C/4T
    2.4 - 3.3 GHz
    12 - 25 W
    AMD Ryzen R1606G
    2C/4T
    2.6 - 3.5 GHz
    12 - 25 W
    GPU AMD Radeon Vega 3 graphics with 192 stream processors
    DRAM Two DDR4 SO-DIMM slots
    Up to 32 GB of DDR4-2400 in dual-channel mode
    Motherboard proprietary
    Storage SSD M.2-2260 (PCIe x4 or SATA)
    DFF 1 × 2.5-inch/7.5-mm SATA 6 Gbps
    SD -
    Wireless Intel Wireless-AC 3168
    802.11ac Wi-Fi + Bluetooth module
    Ethernet 2 × GbE port (Realtek RTL8111G)
    USB Front 1 × USB 3.1 Gen 1 Type-A
    2 × USB 2.0 Type-A
    Back 2 × USB 3.1 Gen 1 Type-A
    Display Outputs 2 × DisplayPort
    1 × HDMI
    Audio 1 × 3.5mm audio jack (Realtek)
    PSU External
    Warranty Typical, varies by country
    Dimensions Length: 118.5 mm
    Width: 110 mm
    Height: 67.3 mm
    MSRP ? ?
    ASRock already lists its 4X4 Box-R1000 systems on its website, so their release is just around the corner. Meanwhile, it is unclear when exactly the UCFF PCs will be available and how much they are set to cost.
    Related Reading:


    Source: ASRock (via Liliputing)


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    #9665

    Anandtech: Supply of DRAM, NAND & Displays Could Be Disrupted by Japan & South Korea

    South Korean companies produce 70% of the world’s DRAM, about a half of 3D NAND, and a significant share of OLED and LCD displays on the planet. Meanwhile, Japanese suppliers make 70% - 90% of three materials crucially required for manufacturing of the said components. As the two countries have a multi-decade-long dispute over compensations, Japan recently implemented new export rules that could disrupt supply of the important materials to South Korea, which in turn could hurt supply of DRAM, NAND, and various types of displays.
    Japan-based JSR, Showa Denko (SDK), and Shin-Etsu Chemical control 70% - 90% of the global supply of polyimides (used both for LCDs and OLEDs), photoresists, and high-purity hydrogen fluoride (used to make chips, such as LSI, DRAM and NAND devices). Starting July 4, Japanese producers must get an approval for individual exports of the aforementioned chemicals to South Korea. Export reviews may take up to three months, whereas South Korean companies typically only keep one to two months' worth of materials in stock.
    If South Korean companies cannot procure enough chemicals from their Japanese partners or their competitors in other countries, they will have to halt production, which will have a drastic effect on global supply of DRAM, 3D NAND, chips by Samsung Foundry, LCDs, and OLEDs.
    According to Nikkei and Reuters, SK Hynix only has enough materials to keep production going in the short-term future, or for the next couple of months. Samsung is reportedly trying to deal with the situation, but nothing is clear at this point. Both South Korean giants have manufacturing plants in China, which could partially offset a potential disruption of supplies by domestic fabs. Meanwhile, LG Display and Samsung Display only make their products in South Korea and have to source fluorinated polyamide from Japan (despite the fact that LG controls LG Chem, the largest chemical company in South Korea).
    The Empire of Japan colonized the Korean peninsula from 1910 to 1945, which is a reason of conflict between Japan and the two Koreas. During the WWII, Japan used free South Korean labor at many of its factories and now survivors demand compensations. Late last year South Korean court ordered Japan’s Nippon Steel & Sumitomo Metal as well as Mitsubishi Heavy Industries to pay compensations to South Korean plaintiffs, verdicts criticized by Japan as ‘unthinkable’ because the issue was settled in 1965.
    In additions to new export controls, Japan reportedly plans to exclude South Korea from the whitelist of 27 friendly countries. If this happens, export of all items that can be potentially used for military applications will require appropriate government approvals, which will further slowdown business between the two countries.
    Components made in South Korea are then used by various companies across the world, including Apple, Dell, HP, Lenovo, Panasonic, Sony, and so on. As a result, if supply is indeed disrupted, Japanese companies will be hurt too.
    Related Reading:


    Sources: Nikkei Asian Review, Reuters, OLED-Info



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    #9666

    Anandtech: AMD Adjusts Launch Price of Radeon RX 5700 Series: XT Down To $399, Standa

    The new Radeon RX 5700 hasn’t even yet officially launched as we’re still awaiting Sunday the 7th of July, yet AMD in a rare event has now officially announced that is it adjusting the launch prices of the new Navi cards to lower price points.
    Originally, the Radeon 5700 XT Anniversary edition, the XT, and the standard variant were priced at $499, $449, and $379. AMD has now lowered the price points to $449, $399 and $349.
    AMD Radeon RX Series Specification Comparison
    AMD Radeon RX 5700 XT AMD Radeon RX 5700 AMD Radeon RX 590 AMD Radeon RX 570
    Stream Processors 2560
    (40 CUs)
    2304
    (36 CUs)
    2304
    (36 CUs)
    2048
    (32 CUs)
    Texture Units 160 144 144 128
    ROPs 64 64 32 32
    Base Clock 1605MHz 1465MHz 1469MHz 1168MHz
    Game Clock 1755MHz 1625MHz N/A N/A
    Boost Clock 1905MHz 1725MHz 1545MHz 1244MHz
    Throughput (FP32) 9.75 TFLOPs 7.9 TFLOPs 7.1 TFLOPs 5.1 TFLOPs
    Memory Clock 14 Gbps GDDR6 14 Gbps GDDR6 8 Gbps GDDR5 7 Gbps GDDR5
    Memory Bus Width 256-bit 256-bit 256-bit 256-bit
    VRAM 8GB 8GB 8GB 4GB
    Transistor Count 10.3B 10.3B 5.7B 5.7B
    Typical Board Power 225W 180W 225W 150W
    Manufacturing Process TSMC 7nm TSMC 7nm GloFo/Samsung 12nm GloFo 14nm
    Architecture RDNA (1) RDNA (1) GCN 4 GCN 4
    GPU Navi 10 Navi 10 Polaris 30 Polaris 10
    Launch Date 07/07/2019 07/07/2019 11/15/2018 08/04/2016
    Launch Price $449

    $399
    $379

    $349
    $279 $179
    The move isn’t unprecedented, but is something extremely rare. What is interesting is that AMD’s Scott Herkelman (CVP & GM AMD Radeon) yesterday posted an interesting but short tweet:
    Jebaited
    — Scott Herkelman (@sherkelman) July 4, 2019
    Scott's snarky tweet is suggesting AMD had planned the move all along- playing a bait & switch in terms of the pricing of the RX 5700, most likely in preparation and in response to Nvidia’s newest Super card line-up.
    We’re looking forward to covering the RX 5700 series cards when the time comes – hopefully soon!
    Related Reading




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    #9667

    Anandtech: The AMD 3rd Gen Ryzen Deep Dive Review: 3700X and 3900X Raising The Bar

    It’s the review we’ve all been waiting for. Since December last year – and particularly since CES – AMD has been teasing us about the new Zen 2 microarchitecture and AMD’s newest Ryzen 3000 series of CPUs. Incorporating a significantly upgraded CPU architecture and built using TSMC's latest generation manufacturing process, AMD has continued to run at full speed at a time when rival Intel has struggled to move at all. The end result is that while the first and second generation of Ryzen CPUs were all about AMD returning to competition and eating into Intel's substantial performance lead, the Ryzen 3000 series is nothing less than AMD's first shot in nearly 13 years at meeting (or beating) Intel at their own game in the desktop CPU market. It's a big moment for AMD, and an exciting one in the CPU industry as a whole.
    Today AMD launches its entire new CPU lineup and platform, alongside the new Navi-based Radeon RX 5700 series. In terms of CPU coverage, we’ll be taking a closer look at the new flagship, the $499 12-core Ryzen 3900X, as well as the $329 8-core Ryzen 7 3700X and its peculiar low TDP of 65W.

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    #9668

    Anandtech: The AMD Radeon RX 5700 XT & RX 5700 Review: Navi Renews Competition in the

    There have been teasers, press conferences, architectural announcements, and pricing games all around – and all before the first card has even shipped. The run-up to the launch of AMD’s new Radeon RX 5700 series of video cards has been a dynamic and memorable time, and a very fitting outcome for a family of cards named after AMD’s legendary Radeon HD 5700 series. However, at some point all the showmanship must come to an end and the cards will fall where they may: launch day is upon us for AMD’s Radeon RX 5700 series and RDNA GPU architecture. Does AMD have what it takes to claim the midrange market for themselves? Let's find out!

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    #9669

    Anandtech: Samsung’s 5nm EUV Technology Gets Closer: Tools by Cadence & Synopsys Cert

    Samsung Foundry has certified full flow tools from Cadence and Synopsys for its 5LPE (5 nm low-power early) process technology that uses extreme ultraviolet lithography (EUV). Full flow design tools are required by chip developers to create efficient and predictable chip designs for advanced nodes quickly.
    Samsung Foundry certified the Synopsys Fusion Design Platform as well as the Cadence Full-Flow Digital Solution full-flow design tools for its 5LPE technology using the Arm Cortex-A53 and Arm Cortex-A57 cores. The certification means that these sets of tools meet Samsung Foundry’s requirements and that by using them chip designers can attain optimal power, performance and area (PPA) benefits that 5LPE technology promises to offer.
    Samsung’s 5LPE technology relies on FinFET transistors with a new standard cell architecture and uses both DUV and EUV step-and-scan systems. The new fabrication process enables chip designers to reuse 7LPP IP on ICs designed for 5LPE while enjoying all benefits the latter provides. When compared to 7LPP, the new technology has an up to 25% higher ‘logic efficiency’, it also enables chip developers to reduce power consumption of their designs by 20% or improve their performance by 10%.
    The set of tools from Candence and Synopsys that is certified by Samsung includes compilers, validators, power circuit optimizers as well as EUV-specific tools.
    Since Samsung’s 5LPE uses more EUV layers than the company’s 7LPP process, expect it to be used on Samsung’s upcoming EUV fab in Hwaseong. The production line is set to cost 6 trillion Korean Won ($4.615 billion), it is expected to be completed in 2019, and start high volume manufacturing in 2020.
    Related Reading:


    Sources: Cadence, Synopsys


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    #9670

    Anandtech: The AMD X570 Motherboard Overview: Over 35+ Motherboards Analyzed

    During Computex 2019, AMD's CEO Dr Lisa Su introduced the company's newest AM4 chipset, the X570. Designed to support the new AMD Ryzen 3000 series processors, X570 is just as big of an update as the new Zen 2 architecture is. On paper, it has a lot of talking points: the new PCIe 4.0 interface, the 11 W operating TDP, and more USB 3.1 G2 connectivity for vendors to work with. In this article, we've analyzed all of the available X570 motherboards we can find.

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