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Thread: Anandtech News

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    #9701

    Anandtech: Western Digital Unveils IntelliFlash N5100: An Entry-Level All-Flash Stora

    Western Digital has introduced its most affordable NVMe all-flash storage array, the new IntelliFlash N5100. The device offers up to 92 TB of raw NAND flash using SN200 NVMe SSDs, and can be further expanded when needed using additional 2U IntelliFlash SAS modules featuring 24 SAS drive bays, offering hundreds of terabytes of raw NAND flash. The IntelliFlash N5100 is aimed at customers who need to accelerate business applications, but who do not need extreme levels of performance at high prices.
    Western Digital’s IntelliFlash N-series NVMe all-flash arrays sit above the company’s IntelliFlash HD-series all-flash and T-series hybrid-flash offering the lowest latency of around 200 µsec and the highest data transfer rates. The N-series family contains three types of arrays: the highest-end N5800, the mainstream N5200, and now the entry-level N5100. The top-of-the-range N5800 offers up to 1.7M sustained IOPS and up to 23 GB/s data throughput, the midrange N5200 provides up to 800K IOPS, whereas the entry-level N5100 features up to 400K sustained IOPS.
    Western Digital's IntelliFlash N-series
    N5100 N5200 N5800
    Random Read/Write Performance 400K IOPS 800K IOPS 1.7M IOPS
    Sustained Data Transfer Rate ? ? 23 GB/s
    Latency 200 µsec 200 µsec 200 µsec
    Maximum RAW Capacity 400 TB 1.4 PB 2.5 PB
    All the Western Digital IntelliFlash N-series all-flash arrays are based on Intel’s Xeon processors, and use WD's dual-active controller architecture in a 2U form-factor. The N5100-series AFAs can be expanded using 2U SAS-based HD-series AFAs that carry SSDs with up to 15.36 TB capacity (Ultrastar DC SS530) and providing up to 368 TB of raw NAND flash (in case of the HD2160 version) as well as 1 ms latency. Meanwhile, the IntelliFlash N5800 can support multiple IntelliFlash HD or 2U or 3U machines for a total raw NAND capacity of up to 2.5 PB.
    From software standpoint, all the latest IntelliFlash machines run Western Digital’s IntelliFlash OE 3.10 operating system that supports block (FC, iSCSI) as well as file (NFS, CIFS, SMBv3) protocols and therefore are compatible with a variety of software from multiple vendors. Furthermore, the OS fully supports virtualization, data protection, data reduction, inline deduplication, and compression to improve performance, reliability, and increase effective capacity.
    Interestingly, the IntelliFlash OE 3.10 adds support for Storage Class Memory as well as NVDIMMs to further boost their performance, but Western Digital does not disclose what kind of SCE and NVDIMMs are currently supported or which future configurations will be supported.
    Western Digital’s IntelliFlash N5100 AFAs will be available in the near future. Actual pricing will depend on exact configurations.
    Related Reading:


    Source: Western Digital


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    #9702

    Anandtech: AMD Joins CXL Consortium: Playing in All The Interconnects

    AMD's CTO, Mark Papermaster, has published a blog post this week said that AMD has joined the Compute Express Link (CXL) Consortium. The industry group is led by a set of nine industry giants such as Intel, Alibaba, Google, and Microsoft. The CXL 1.0 technology uses the PCIe 5.0 physical infrastructure to enable a coherent low-latency interconnect protocol that allows to share CPU and non-CPU resources efficiently and without using complex memory management. The announcement indicates that AMD now supports all of the current and upcoming high-speed interconnect protocols, including CCIX, Gen-Z, and OpenCAPI.


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    #9703

    Anandtech: The Kingston KC2000 SSD Review: Bringing BiCS4 To Retail

    The Kingston KC2000 is a new high-end consumer M.2 NVMe SSD. Kingston had been neglecting this market segment for a while, but the two year old KC1000 has finally been replaced by a proper successor using the latest flash memory and controllers..The company's latest flagship consumer SSD is a better contender than they've had in a long time, but despite its use of the latest 96-layer 3D NAND it comes up short when compared to more reasonably priced drives that are still using 64-layer NAND.

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    #9704

    Anandtech: ASUS Announces New ROG Phone II: 120Hz OLED, 6000mAh & Snapdragon 855+

    Today ASUS is releasing the successor to last year’s enthusiast-level gaming phone – the ROG Phone. This year’s model features the same DNA that the original model was built on- but this time around ASUS went for bigger and better in every regard, upgrading the new ROG Phone II with some new impressive hardware, creating quite a beast of a phone.
    ASUS’s rationale for releasing a gaming-focused phone is that the mobile market is seeing some exceptional annual growth, with mobile accounting for 47% of the total gaming market world-wide, with a healthy growth of 12.8% for mobile and specifically a 14.2% year-on-year growth for smartphone gaming. As such, ASUS sees a large opportunity to carve out a niche in the market in terms of offering a phone that maxes out the mobile gaming experience.
    [TABLE="align: center"]
    [TR="class: tgrey"]
    [TD="colspan: 6, align: center"]ASUS ROG Phones[/TD]
    [/TR]
    [TR="class: tlblue"]
    [TD="width: 72, colspan: 2"] [/TD]
    [TD="colspan: 2, align: center"]ROG Phone[/TD]
    [TD="colspan: 2, align: center"]ROG Phone II[/TD]
    [/TR]
    [TR]
    [TD="class: tlgrey, colspan: 2"]SoC[/TD]
    [TD="colspan: 2, align: center"]Snapdragon 845 (OC)
    4x Cortex-A75 @ 2.96GHz
    4x Cortex-A55 @ 1.80GHz


    Adreno 630 @ MHz[/TD]
    [TD="colspan: 2, align: center"]Qualcomm Snapdragon 855+
    1x Cortex-A76 @ 2.96GHz
    3x Cortex-A76 @ 2.42GHz
    4x Cortex-A55 @ 1.80GHz

    Adreno 640 @ 675MHz[/TD]
    [/TR]
    [TR]
    [TD="class: tlgrey, colspan: 2"]DRAM[/TD]
    [TD="colspan: 2, align: center"]8 GB LPDDR4X[/TD]
    [TD="colspan: 2, align: center"]12 GB LPDDR4X[/TD]
    [/TR]
    [TR]
    [TD="class: tlgrey, colspan: 2"]Storage[/TD]
    [TD="colspan: 2, align: center"]128 / 512GB UFS 2.1[/TD]
    [TD="colspan: 2, align: center"]

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    #9705

    Anandtech: The NVIDIA GeForce RTX 2080 Super Review: Memories of the Future

    The last two months have been a period of tit-for-tat in the PC video card industry. Both AMD and NVIDIA have been going back and forth, making announcements and launching products as part of a broader restructuring of the mid-range and high-end video card markets in response to the launch of AMD’s Radeon RX 5700 series of video cards. Performance is going up while last-minute maneuvering has brought prices slightly down, all the while the two major players in the GPU space look to solidify their product lineups and secure their competitive edge against their competition.
    For all practical purposes, NVIDIA’s GeForce RTX 20 Super series has been the company’s response to AMD’s new video cards. A combination of a mid-generation kicker and a product stack realignment to go head-to-head with AMD, the Super cards have given NVIDIA’s product lineup a modest performance boost at almost every level. After launching the first two cards in this sub-series early this month with the GeForce RTX 2070 Super and GeForce RTX 2060 Super, NVIDIA is back again to launch the last (?) of the Super cards: the previously announced GeForce RTX 2080 Super.

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    #9706

    Anandtech: Western Digital’s Ultrastar DC HC330: A 10 TB HDD for Enterprises w/ 40% F

    Western Digital has introduced its new top-of-the-range air-filled hard drive for enterprises that use storage servers, RAID arrays, and distributed storage. The Ultrastar DC HC330 HDD expands the capacities that Western Digital offers for this market segment to 10 TB and also introduces the company’s Media Cache Plus technology that promises to improve write performance by up to 40% in certain cases.
    The Western Digital Ultrastar DC HC330 is the latest addition to the company’s Ultrastar DC HC300-series family that includes 4, 6, and 8 TB hard drives (that were originally introduced under different model numbers). While these hard drives are classified as ‘datacenter’ devices, they are aimed at enterprises that need loads of storage space and high performance, but not those operating large datacenters that require maximum capacities. All the HDDs in the lineup are based on the company’s enterprise-class platform that uses conventional magnetic recording (CMR, which refers to perpendicular magnetic recording in this case) featuring appropriate reliability and durability enhancements (e.g., bottom and top attached motors, RAFF technology to protect against vibration, dual-stage micro actuator to improve positioning, etc.).
    The Ultrastar DC HC330 10 TB air-filled hard drives rely on six 1.66-TB CMR platters (the highest-capacity commercially available platters in the industry today), down from seven 1.42 TB PMR disks in case of the helium-filled Ultrastar He10. The HDDs use a motor featuring a 7200 RPM spindle speed, a 256 MB buffer, and will be offered with a SATA 6 Gbps or a SAS 12 Gbps interface as well as 4 KB and 512E sectors.
    Usage of high-capacity platters enabled the Ultrastar DC HC330 10 TB to increase its sustained transfer rate up to 273 MB/s (faster than cheap SSDs when it comes to large data transfers). In addition, the new hard drive features non-volatile Media Cache Plus technology that boosts random write performance by up to 40% when the queue depth is low or the transfer length is short.
    In theory, reduction of the number of platters should have reduced the power consumption of the Ultrastar DC H330 compared to the Ultrastar He10, yet it is not the case as the drive is air-filled, not helium-filled. The new drive consumes up to 9.2 W of power in operating mode, up from 6.8 W in case of its predecessor. This does not mean that the new HDD is necessarily worse than its 10 TB predecessor. Firstly, it is cheaper to manufacture, and secondly, since it is faster in general use-cases as well as in certain write-intensive scenarios, it may still be power efficient enough for most use-cases (especially keeping positioning of the product). On the other hand, even when in idle, it consumes 3 W more when compared to its predecessor (8 W vs. 5 W), which might be a problem for companies like Amazon or Netflix that use millions of HDDs across tens of large datacenters, but shouldn't represent too much of a big issue for companies employing smaller deployments.
    HGST Ultrastar Ultrastar DC HC300-Series General Specifications
    Ultrastar DC HC 310 Ultrastar DC HC 320 Ultrastar DC HC330
    Capacity 4 TB, 6 TB 8 TB 10 TB
    RPM 7200 RPM
    Interface SATA 6Gbps SAS 12 Gbps SATA 6 Gbps SAS 12 Gbps SATA 6 Gbps SAS 12 Gbps
    Format: Sector Sizes 4Kn 4096 4096, 4104
    4160, 4224
    4096 4096, 4104,
    4160, 4224
    4096 4096, 4104,
    4160, 4224
    512n 512 - - -
    512e 512 512, 520, 528 512 512, 520, 528 512 512, 520, 528
    DRAM Cache 256 MB
    Helium-Filling No
    Sustained Transfer Rate Up to 255 MB/s (4Kn)
    Up to 233 MB/s (512n)
    Up to 273 MB/s
    Average Latency 4.16 ms
    Seek Time (read/write) 8/8.6 ms
    Acoustics 2.9/3.6 Bels 3.4/3.8 Bels
    Power Rating Idle 5.9 W 7 W 7 W 8 W 8 W
    Operating 7 W 12.1 W 8.3 W 13.4 W 9.2 W
    MTBF 2 million hours
    Warranty 5 Years
    Covered by a five-year warranty, Western Digital’s Ultrastar DC HC330 10 TB HDDs will be available to OEM, cloud, and enterprise customers in September. Pricing will depend on volumes, amongst other factors.
    Related Reading:


    Source: Western Digital


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    #9707

    Anandtech: TSMC: 3nm EUV Development Progress Going Well, Early Customers Engaged

    Development of new fabrication technologies never stops at leading-edge companies such as TSMC. Therefore, it is not surprising to hear the annoucement that development of TSMC’s 3nm node is well underway, something the company publicly confirmed last week. As it appears, the manufacturing technology is out of its pathfinding mode and TSMC has already started engaging with early customers.
    “On N3, the technology development progress is going well, and we are already engaging with the early customers on the technology definition,” said C.C. Wei, CEO and co-chairman of TSMC, in a conference call with investors and financial analysts. “We expect our 3-nanometer technology to further extend our leadership position well into the future.”
    Since its N3 technology is in its early stages of development, TSMC doesn't currently talk about the specific characteristics of the process nor its advantages over N5. TSMC said that it had evaluated all possible transistor structure options for 3nm and came out with ‘a very good solution’ for its clients. The specification is under development and the company is confident it would meet requirements of its leading partnering customer.
    One of TSMC’s arch-rivals, Samsung Foundry, plans to use nanosheet-based Gate-All-Around MBCFET transistors for its own 3nm (3GAAE) process technology. Since TSMC will have to be competitive with its rival, we expect the company to also advance its 3nm node significantly in comparison to its 5nm node. In fact, TSMC confirms that N3 is a brand-new process technology, not an improvement or iteration of N5.
    Meanwhile, it is safe to say that that TSMC’s 3 nm node will use both deep ultraviolet (DUV) and extreme ultraviolet (EUV) lithography equipment. Since TSMC’s N5 uses 14 EUV layers, it is likely that N3 will go even higher in the amount of layers employed. The world’s largest contract maker of semiconductors also seems to be quite happy with its EUV progress and considers the technology important for its future.
    Related Reading:


    Source: TSMC


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    #9708

    Anandtech: Honor Unveils 9X & 9X Pro: All-View Display, Kirin 810, 48 MP Camera

    Honor has introduced two new smartphones aimed at demanding users. The 9X and 9X Pro handsets combine a large All-View display with a 92% screen-to-body ratio, a high-end SoC, a 48 MP camera, and a number of other premium technologies currently found primarily on expensive devices. In the meantime, the Honor 9X will start at around $180 in China.
    Equipped with a 6.59-inch IPS LCD display featuring a Full-HD+ resolution, the Honor 9X and the Honor 9X Pro smartphones are based on the HiSilicon Kirin 810 SoC that is made using TSMC’s 7 nm process technology and packs eight general purpose cores (two Arm Cortex-A76 + six Arm Cortex-A55) as well as Arm’s Mali-G52 MP6 GPU (enhanced with GPU Turbo 3.0 technology). Depending on exact model, the Honor 9X features 4 or 6GB of RAM as well as 64GB or 128GB of storage, whereas the Honor 9X Pro comes with 8GB of RAM as well as 128GB or 256GB of UFS 2.1 NAND flash.
    Imaging capabilities of the Honor 9X and the Honor 9X Pro have a lot in common, but also have differences. The 9X has a dual-module main camera with a 48 MP RGB sensor with an f/1.8 aperture lens and a 2 MP depth sensor, whereas the 9X Pro comes with a triple-module main camera with a 48 MP RGB sensor, a 2 MP depth sensor, and an 8 MP wide-angle sensor. Both handsets are also equipped with a 16 MP pop-up selfie camera.
    As far as battery life is concerned, Honor’s 9X-series smartphones come with a 4000-mAh battery that enables up to 10 hours or gaming.
    Being aimed at the younger audience, Honor’s 9X series features a 3D gradient X-shaped glass back finish and will be available in various colors, including black, red, and sea blue.
    Honor began to take pre-orders on its 9X and 9X Pro smartphones in China on July 23 and will ship the hardware on July 30. The Honor X9 starts at RMB 1399 (around $180), whereas the 9X Pro starts at RMB 2199 (around $280).
    Honor's 9X Series Smartphones
    9X 9X Pro
    SoC HiSilicon Kirin 810
    2x Arm Cortex-A76
    6x Arm Cortex-A55
    GPU Arm Mali-G52 MP6 GPU
    DRAM 4 or 6 GB RAM 8 GB RAM
    Storage 64 GB or 128 GB
    microSD slot
    128 GB or 256 GB
    microSD slot
    Display 6.59-inch IPS LCD
    Full-HD+
    Size Height 163.1 mm
    Width 77.2 mm
    Depth 8.8 mm
    Weight 206 grams
    Battery Capacity 4000 mAh
    Wireless Charging ?
    ? >
    Rear Cameras
    Main 48MP
    f/1.8
    48MP
    f/1.8
    Depth 2 MP 2 MP
    Wide - 8 MP
    Selfie Camera Pop-Up 16 MP f/2.0
    I/O USB-C
    3.5-mm audio jack
    Wireless (local) Wi-Fi 5, Bluetooth 5.0, NFC
    Cellular 4G/LTE Cat 12 (600/50 Mbps)
    Features Side-mounted fingerprint sensor
    Dual-SIM Single or Dual
    Operating System Android 9.0 (Pie) with Huawei's EMUI 9.1
    Launch Price In China: RMB 1399
    (around $180)
    In China: RMB 2199
    (around $280)
    Related Reading:


    Sources: Honor, GSMArena


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    #9709

    Anandtech: Honor Announces MagicBook Pro with 16.1-Inch Display

    Honor has announced its new laptop featuring a rare 16.1-inch display with ultra-thin bezels. The MagicBook Pro notebook packs a quad-core processor from Intel as well as a discrete graphics chip from NVIDIA, yet it remains relatively compact and lightweight. Set to be available in China initially, the notebook will cost less than $1000 in Honor's domestic market.
    Recent developments of display manufacturing technologies enabled makers of monitors to cost-efficiently produce screens featuring sizes that are different from those primarily used for notebooks today (e.g., 13.3, 14, 15.6 inches). Driven by necessity to differentiate their products from competing offerings, makers of mobile PCs are keen to adopt the latest components, and Honor will be one of the first vendors to use such 16.1-inch displays. The new size is meant to help close the gap between 15.6-inch as well as 17-inch class laptops by offering larger screen real estate in a more compact form-factor.
    Aimed at users looking for high performance, Honor’s MagicBook Pro is based on Intel’s quad-core Core i5/i7 codenamed Whiskey Lake processor, and is accompanied by NVIDIA’s GeForce MX250 discrete graphics chip with 2 GB of GDDR5 memory. To ensure consistent performance of the two key components, the laptop uses a cooling system that includes two thick heat pipes and two fans. Depending on the SKU, these notebooks will come with 8 or 16 GB of RAM, as well as with a 512 GB or 1 TB SSD.
    Despite the large display and high-end components inside, the Honor MagicBook Pro weighs only 1.7 kilograms and is 16.9 mm thick.
    The MagicBook Pro comes in an aluminum chassis that resembles the look of Apple’s MacBook Pro. Meanwhile, Honor’s laptop has a number of distinctions: it has a pop-up webcam that is integrated into a dedicated keyboard key, and it features a common set of physical ports typically found on a notebook: one USB 3.1 Type-C port, three USB 3.0 Type-A ports, a HDMI, and a 3.5-mm audio jack for headsets.
    The wireless department of the notebook includes a 2x2 Wi-Fi controller supporting up to 1733 Gbps throughput over 160 MHz channels. As for battery life, the MagicBook Pro features a 56 Wh battery, which is common inside 13.3-inch PCs, but is less so for larger machines such as the MagicBook Pro. In this regard, it seems Honor has put priority on the weight and size of the laptop rather than integrating bigger cells.
    Honor’s MagicBook Pro with a 16.1-inch display will be available in the near future in China starting from RMB 5499 (think MSRP of around $710 in the USA), but there is no word whether Honor or its parent company Huawei intend to offer the laptop outside of their domestic market.
    Related Reading:


    Source: Honor


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    #9710

    Anandtech: Corsair Acquires Origin PC

    Corsair on Wednesday said that it had acquired Origin PC, a well-known boutique PC maker from the USA. Origin PC will remain a separate brand from Corsair and will continue to offer custom gaming and workstation machines. From now on, Origin PC will start to offer more Corsair products inside its systems.
    Both Corsair and Origin PC are private companies, so the terms of the acquisition are not published. The only thing that Corsair announced today is that Origin PC would remain a separate brand and would continue to operate from its offices in Miami, Florida. After Corsair completes acquisition of Origin PC, Corsair will still continue to offer its Vengeance PC, Corsair One, and Corsair One Pro systems under its own brand. Obviously, both companies will continue to honor all existing warranties, purchases, and support obligations with their respective teams.
    Since Corsair specializes on computer components, it is natural that Origin PC will over time expand use of hardware from the parent company inside its computers. In the near future, Origin PC is set to start using Corsair’s Hydro X-series custom liquid cooling systems and will integrate Corsair’s iCue software for lighting synchronization and performance monitoring into its machines. Further plans regarding collaboration and integration of the two companies’ products will be disclosed in the near future.
    Andy Paul, Founder and CEO of Corsair, made the following statement:
    “With the gaming PC market continuing to expand as an increasing number of players make the jump from console to PC, we wanted to do more to reach customers in North America that prefer to buy, rather than build, their system. With Origin PC’s expertise in personalized custom gaming systems and Corsair’s strength in performance PC hardware and the iCue software ecosystem, we’re excited to combine our efforts to create new world-class gaming experiences for PC gamers.”
    Corsair was established in 1994, over 25 years ago, and originally focused on high-end memory modules. As the market of enthusiast-class hardware evolved, Corsair extended its product range significantly to computer cases, NAND flash-based storage, liquid cooling systems, keyboards, mice, PSUs, and even gaming PCs in the last couple of years.
    Origin PC was founded in 2009 by former employees of Alienware after the latter was acquired by Dell. The company is primarily known for its high-performance and ultra-high-end desktop and mobile PCs featuring custom paint and some custom hardware.
    By taking over Origin PC, Corsair hits multiple birds with one stone. Firstly, it expands its opportunities when it comes to high-performance gaming and workstation desktop PCs. Secondly, it enters the market of high-end notebooks. Thirdly, it ensures a solid sales channel for its components and peripherals. Fourth, it just becomes bigger and will enjoy greater economies of scale when working with other partners and suppliers.
    Kevin Wasielewski, CEO of Oirign PC, made the following statement:
    “Corsair is a fantastic partner to help take Origin PC forward, known for creating quality, high-performance products that fully align with Origin PC. With a complete range of enthusiast PC products, Origin PC and Corsair are uniquely placed to create amazing new systems that make the experience of owning a personalized custom gaming PC better than ever.”
    Related Reading


    Source: Corsair


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