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Thread: Anandtech News

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    Anandtech: Sage Microelectronics To Introduce Enterprise SSD Controller Supporting ST

    Everspin has announced that Sage Microelectronics is introducing a new enterprise SSD controller that supports Everspin's latest 1Gb magnetoresistive memory (MRAM) chips. A similar partnership between Everspin and Phison was announced last week.
    Everspin's toggle MRAM is well-established as a non-volatile memory option for embedded and industrial applications, with a strong record for reliability. However, their small capacities of up to 16Mb (so far) have severely limited the potential use cases. Everspin's more recent spin-transfer torque MRAM (STT-MRAM) still can't directly compete with NAND flash on capacity, but with 1Gb parts now in production and larger parts in development, STT-MRAM is becoming useful for a new class of applications.
    DDR memory controller IP that supports DRAM and Everspin's STT-MRAM is readily available, so designers of SSD controllers and other ASICs can easily add support for MRAM to products that can benefit from 1Gb or more of high-speed non-volatile memory. For SSDs, the most compelling use for MRAM is to reduce or eliminate the need for supercapacitors in enterprise SSDs. MRAM capacity is not quite high enough to entirely replace DRAM buffers in large, high-performance SSDs, but the 1Gb parts make for a decent write cache that is inherently non-volatile. Since MRAM has performance competitive with DRAM, it can be used to store FTL updates and newly written user data while still meeting the strict performance consistency requirements of enterprise SSDs.
    It's not clear how much cost savings MRAM currently allows compared to a bank of supercapacitors, but Everspin and their partners cite other benefits as well: it's often much easier to fit MRAM into a small SSD form factor, and MRAM chips can outlast the useful lifespan of large capacitors, which sometimes fail before an SSD's NAND flash write endurance is exhausted.
    Using DRAM, MRAM and NAND flash together in a solid state drive is not a new idea. Seagate showed prototypes at Flash Memory Summit 2017 based around Marvell controllers, and last year at FMS IBM announced a shipping product with all three types of memory and an FPGA-based controller. Now that two more controller designers are on board with the concept, it's clear that this is a viable market for Everspin if they can follow through on reducing cost per bit and continuing to increase capacities.
    Everspin and Sage are both exhibiting at Flash Memory Summit next week, and we are expecting more MRAM-related announcements at the show.


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    Anandtech: ADATA Launches XPG Gammix S50: A PCIe 4.0 x4 SSD

    ADATA has introduced its first PCIe 4.0 x4 NVMe SSD, which is aimed at the latest AMD Ryzen-based PCs using the AMD X570 platform. The ADATA XPG Gammix S50 will be the company’s new flagship drive for users looking for the maximum performance possible today.
    Set to be available in 1 TB and 2 TB capacities, the XPG Gammix S50 drive is based on Phison’s PS5016-E16 controller (the only PCIe 4.0 SSD controller available today) paired with 3D TLC NAND memory. The drive comes in an M.2-2280 form-factor and features a PCIe 4.0 x4 interface (an, of course, the unit is backwards compatible with PCIe 3.0 systems). What is a bit surprising is that unlike other SSDs powered by the same controller, ADATA’s XPG Gammix S50 is not equipped with a large heat spreader, but comes with a relatively regular sized one.
    As far as performance is concerned, ADATA says that the XPG Gammix S50 offers up to 5000 MB/s sequential read speeds and up to 4400 MB/s sequential write speeds when SLC caching is used (data based on CDM benchmark). Meanwhile, the SSD is rated for up to 750K random read/write IOPS.
    When it comes to endurance and reliability levels, the XPG Spectrix S50 drives feature up to 1800 or 3600 TB written over a five-year warranty period, depending on the drive's capacity.
    ADATA XPG Gammix S50 Specifications
    Capacity 1 TB 2TB
    Model Number AGAMMIXS50-1TT-C AGAMMIXS50-2TT-C
    Controller Phison PS5016-E16
    NAND Flash 3D TLC NAND
    Form-Factor, Interface M.2-2280, PCIe 4.0 x4, NVMe 1.3
    Sequential Read 5000 MB/s
    Sequential Write 4400 MB/s
    Random Read IOPS 750K IOPS
    Random Write IOPS 750K IOPS
    Pseudo-SLC Caching Supported
    DRAM Buffer Yes, capacity unknown
    TCG Opal Encryption No
    Power Management DevSleep, Slumber (0.05 W).
    Warranty 5 years
    MTBF 1,700,000 hours
    TBW 1800 TB 3600 TB
    Additional Information Link
    MSRP ? ?
    ADATA’s XPG Gammix S50 will be available in the near future. Prices will vary by region.
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    Source: ADATA


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    Anandtech: Samsung’s Aggressive EUV Plans: 6nm Production in H2, 5nm & 4nm On Track

    Samsung Foundry formally started to produce chips using its 7LPP (7 nm low power plus) fabrication process last October and has not slowdown development of its manufacturing technologies since then. The company is on track to start mass production using its refined 6LPP (6 nm low power plus) technology in the second half of 2019. In addition, the company said that it would tape out its first 5LPE (5 nm low power early) SoCs and would complete development of its 4LPE (4 nm low power early) process in the coming months too.
    Strong Demand for Chips

    Because of dropping DRAM and NAND prices, consolidated revenue of Samsung’s Semiconductor Business dropped to KRW 16.09 trillion ($14.302 billion) in the second quarter, whereas operating profit totaled KRW 3.4 trillion ($2.877 billion). While Samsung’s memory businesses were weak, the company said that its foundry business demonstrated robust results.
    According to Samsung, its contract production division saw strong demand for mobile SoCs made using 10LPP/8LPP technologies as well as mobile, HPC, automotive, and network products fabbed using 14LPx/10LPP processes. Overall, it is evident that Samsung Foundry makes loads of premium products using its leading-edge FinFET process technologies.
    In the next several years Samsung Foundry will continue to use its 14 nm, 10 nm, and 7 nm nodes perfected for particular applications either by optimizations or by plugging in advanced modules.
    Like other contract makers of semiconductors, Samsung refines each of its nodes in order to meet requirements of various applications and clients rather than leaps ahead with radically different nodes every 18 – 24 months (like makers of chips used to do traditionally). Considering all the difficulties that engineers have to overcome developing new manufacturing technologies, the approach allows Samsung to better manage its R&D costs and manufacturing risks.
    7LPP Refinements: 6LPP, 5LPE, 4LPE

    As expected, extreme ultraviolet lithography (EUVL) will be a key enabler for Samsung’s leading-edge next-generation fabrication processes. The first technology to use EUV is 7LPP and its successors will use it more extensively.
    Later this year Samsung will initiate production of chips using its 6LPP process technology, which returned to its roadmap earlier. Samsung’s 6LPP is a refined version of Samsung’s 7LPP that offers higher (~10%) transistor density, lower power, but can re-use IP originally designed for 7LPP. In addition, 6LPP supports smart structures for clients willing to develop all-new new IP. As a result, Samsung Foundry’s clients will either be able to re-use their 7LPP IP without smart structures, or go with the latter, but will have to rely on new IP. In addition to smart structures, 6LPP will add support for things like multi diffusion break.
    The next step in evolution of Samsung’s 7LPP production technology will be its 5LPE manufacturing process. This one provides more benefits when it comes to power, performance, and area than 6LPP, but can also reuse IP originally designed for the initial process. Samsung expects to tape out the first chips using its 5LPE technology in the second half of this year and expects to mass produce it in the first half of 2020.
    Samsung Foundry expects 5LPE to become its main EUVL node in 2020 in terms of customer tape outs, probably because the technology will be able to offer numerous benefits for a wide variety of applications, whereas Samsung’s EUV yields will get higher. Another reason why 6LPP and 5LPE technologies will be used more widely than 7LPP process is because Samsung Foundry will have more EUV capacity in the coming months after it builds its EUV line in Hwaseong, which was architected for the EUV equipment from the start. The fab, which costs $4.615 billion, will be completed shortly and is projected to start high-volume manufacturing in 2020.
    The pinnacle of Samsung’s 7LPP evolution will be the company’s 4LPE technology (and possibly 4LPP that is absent from the latest Samsung Foundry roadmap). The foundry will complete its development in the second half of this year, so expect the first tape out in 2020 and volume production sometimes in 2021.
    Official Statement

    The official statement by Samsung about its Foundry Business reads as follows:
    “For the Foundry Business, results were robust on the back of strong demand from a major customer’s 8/10-nm mobile AP and image sensor products. In addition, new orders from customers increased in the 10/14-nm process and applications diversified to include mobile, HPC, automotive and network products. In the second half, earnings growth is expected to continue due to the ongoing expansion of orders for AP, image sensors and DDI as well as increased demand for HPCs, including crypto currency mining chips. The Company plans to start mass production of EUV 6-nm process and aims to strengthen its competitiveness through tape-out of the EUV 5-nm process and by completing 4-nm process development.”
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    Source: Samsung


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    Anandtech: Xiaomi Unveils Black Shark 2 Pro: Snapdragon 855+, UFS 3.0 Storage

    Xiaomi has introduced a refined version of its Black Shark 2 gaming smartphone. The new Black Shark 2 Pro is based on Qualcomm’s Snapdragon 855 Plus SoC and features a UFS 3.0 storage device. Besides the SoC uplift, Xiaomi has managed to reduce its input latency versus predecessor, providing a snappier gaming experience.
    While the Black Shark 2 Pro is not a brand new handset, it does come in a new chassis designed to enable a very comfortable grip during gaming sessions and it is also compatible with Xiaomi’s Gamepad 2.0 Bluetooth add-on that adds 12 buttons, a physical joystick, and a touchpad. Just like the original version, the Black Shark 2 Pro comes with a 6.39-inch AMOLED display featuring a 2340x1080 resolution, a 19.5:9 aspect ratio, 430 nits brightness, a 60,000:1 contrast ratio, and a 240 Hz touchscreen polling rate. In a bid to provide an even better gaming experience, the Black Shark 2 Pro features 34.7 ms input latency, down from 43.5 ms in case of the original one.
    Another key feature of the Black Shark 2 Pro is Qualcomm’s top-of-the-range Snapdragon 855 Plus application processor that provides higher performance than the predecessor and which is cooled down using a new cooling system that uses a vapor chamber-like technology. The SoC is paired with 12 GB of LPDDR4X memory, as well as a 128 GB or 256 GB UFS 3.0 storage device. While the new smartphone uses new internals, it still comes with a 4000 mAh battery.
    Imaging capabilities of the Black Shark 2Pro handset include main camera comprising of a 48 MP RGB sensor as well as a 12 MP telephoto sensor, which are accompanied by a dual-LED flash, as well as an HDR-enabled 20-MP sensor for selfies on the front.
    The Black Shark 2 Pro Smartphone
    Preliminary Specifications
    Display AMOLED
    Corning Gorilla Glass 6
    SoC Qualcomm Snapdragon 855 Plus
    Adreno 640
    Storage 128 or 256 GB of UFS 3.0 NAND flash
    Local Connectivity Wi-Fi 802.11ac Wi-Fi
    Bluetooth Bluetooth 5.0
    Data/Charging USB 2.0 Type-C
    Audio No 3.5-mm jack
    NFC Yes
    LTE X24 Modem
    Navigation dual-band A-GPS, GLONASS, BDS, GALILEO, QZSS
    Rear Camera 48 MP, f/1.75,
    0.8µm pixels,
    12 MP, f/2.2,
    54mm (telephoto),
    1.0µm pixels,
    Front Camera 20 MP, f/2.0, 0.9µm
    Battery Capacity 4000 mAh
    Expected Life ?
    SIM Size Nano SIM + Nano Sim
    Sensors accelerometer, gyro, proximity, compass
    Biometric Security Fingerprint in-screen
    Facial Recognition -
    Dimensions Height 163.6 mm | 6.44 inches
    Width 75 mm | 2.95 inches
    Thickness 8.8 mm | 0.35 inches
    Weight 205 grams | 7.23 ounces
    Colors black, blue, silver, orange, purple
    Protection Drop ?
    OS Google Android 9.0
    Launch Countries China initially, NA/EU launch later
    Price $385+
    Xiami will start shipments of the Black Shark 2 Pro smartphones in black, blue, silver, orange and purple colors. The 128 GB variant will cost CNY 2,999 ($385), whereas the 256 GB version will be priced at CNY 3,499 ($450).
    Related Reading:

    Sources: Liliputing, GSM Arena


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    Anandtech: The Ice Lake Benchmark Preview: Inside Intel's 10nm

    Intel's new Ice Lake platform is the company's second attempt at producing a 10nm chip for the mass market, and follows on from the Cannon Lake platform. Using 'the same but different' 10nm process, Ice Lake holds inside a new 10th Gen Core microarchitecture called Sunny Cove, Gen11 graphics, and support for LPDDR4X-3733 as well as Thunderbolt and Wi-Fi 6. In advance of systems coming onto the market, Intel gave a small number of press a day of hands-on time with its Software Development Systems so we could get a taste of performance of Sunny Cove, Gen11, and Intel's newest 10nm product.


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    Anandtech: Innogrit Debuts With Four NVMe SSD Controllers

    A new SSD controller designer is coming out of stealth mode today. Innogrit was founded in 2016 by storage industry veterans with the goal of developing storage technology to support AI and big data applications. We spoke with co-founder Dr. Zining Wu (formerly Marvell's CTO) about the company's planned product lineup, and he will be presenting more information next week in a keynote speech at Flash Memory Summit.
    Innogrit's long term goal is to go after the enterprise storage market, but they are starting small with a DRAMless client SSD controller, the IG5208 "Shasta". This is already in mass production with full turnkey reference SSD designs available. It will be followed up incrementally larger controllers with more advanced feature sets: Shasta+, Rainier and Tacoma. With each iteration, Innogrit is increasing performance, adding more features and improving their LDPC error correction engine.
    Innogrit NVMe SSD Controller Roadmap
    Controller Shasta Shasta+ Rainier Tacoma
    Model Number IG5208 IG5216 IG5236 IG5668
    Host Interface PCIe 3 x2 PCIe 3 x4 PCIe 4 x4 PCIe 4 x4
    Protocol NVMe 1.3 NVMe 1.4
    NAND Channels 4 4 8 16
    Max Capacity 2 TB 2 TB 16 TB 32 TB
    DRAM Support No (HMB Supported) DDR3/4, LPDDR3/4
    32/16-bit bus
    DDR3/4, LPDDR3/4,
    72-bit bus
    Manufacturing Process 28nm "16/12nm"
    BGA Package Size 10x9mm,
    15x15mm 17x17mm
    Sequential Read 1750 MB/s 3.2 GB/s 7 GB/s 7 GB/s
    Sequential Write 1500 MB/s 2.5 GB/s 6.1 GB/s 6.1 GB/s
    4KB Random Read 250k IOPS 500k IOPS 1M IOPS 1.5M IOPS
    4KB Random Write 200k IOPS 350k IOPS 800k IOPS 1M IOPS
    Market Segment Client Client High-end Client,
    Datacenter, Enterprise
    The Shasta and Shasta+ controllers are both primarily targeting the client SSD market, and they are designed as low-cost mainstream solutions. Shasta has just two PCIe 3 lanes while Shasta+ has four lanes and consequently higher performance, but otherwise they are quite similar. Both are 28nm designs and use the NVMe Host Memory Buffer feature rather than including DRAM controllers. Both controllers are small enough to be packaged inside single-chip BGA SSDs, and Innogrit's reference designs for Shasta-based SSDs include the standard 11.5x13mm and 16x20mm BGA SSD footprints and a CFX card design. The improved ECC capabilities of Shasta+ will make it a better choice for QLC-based SSDs, but both controllers support the full range of SLC through QLC from multiple manufacturers.
    Because Shasta and Shasta+ are stepping stones toward the enterprise and datacenter markets, they include support for some features not commonly found on client SSDs, such as an Open-Channel SSD operating mode. End-to-end data path protection is included, with ECC on all the controller's SRAM buffers and on data stored in the Host Memory Buffer. Power management appropriate for client and embedded use is supported, with Shasta peaking at 0.9W and supporting idle states at 55mW and less than 1mW, while Shasta+ will peak at about 1.35W. The NVMe Boot Partition feature is also supported for embedded systems that don't include a separate boot ROM device.
    Innogrit's Rainier controller is a significant generational advance over the Shasta family, moving up to the high-end client and entry-level datacenter markets. Rainier switches to one of TSMC's 16/12nm FinFET processes, which Innogrit (and most other controller designers) sees as necessary for PCIe gen4 support with reasonable power consumption. Rainier has 8 NAND channels that can run at up to 1200MT/s, fast enough for any currently-available NAND. This allows for sequential read and write speeds of up to 7GB/s and 6.1GB/s respectively, more or less saturating the PCIe 4 x4 interface. Rainier adds enterprise-oriented features like multiple namespace support and SR-IOV virtualization, but client-oriented power management is still supported, with idle states for 50mW and less than 2mW.
    The most powerful controller on Innogrit's roadmap is Tacoma, which builds on Rainier by doubling the NAND channel count to 16 (bringing the maximum supported capacity up to 32TB), widening the DRAM interface to 72 bits (64b with ECC), and adding more high-end enterprise features. Sequential IO performance will be roughly the same as for Rainier but random IO gets a boost from the extra parallelism. The virtualization capabilities have been enhanced relative to Rainier and the NVMe Controller Memory Buffer feature is supported, which comes in handy for NVMe over Fabrics deployments. A special low-latency mode is introduced, which Innogrit will be demonstrating with Toshiba's XL-FLASH (their answer to Samsung's Z-NAND). Perhaps the most important feature of Tacoma is the addition of in-storage compute with a deep learning accelerator; more information about this will be shared next week during Innogrit's keynote presentation at Flash Memory Summit.

    Innogrit's business model will be similar to most other independent SSD controller vendors, offering SSD vendors a range of options from a basic SDK for custom firmware up to full turnkey SSD designs. They have several design wins with the Shasta family controllers and are already sampling the Rainier and Tacoma controllers.


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    Anandtech: Samsung Introduces Galaxy Tab S6: 10.5-Inch AMOLED, Snapdragon 855, New S-

    Samsung has introduced its new flagship tablet aimed at consumers that need advanced functionality and performance. The Galaxy Tab S6 comes with a large AMOLED display, Qualcomm’s high-end application processor for smartphones and tablets, plenty of storage, compatibility with Samsung’s DeX platform for productivity applications, the company’s Knox security platform, as well as Samsung’s refined S Pen stylus with remote control functionality and wireless charging.
    The Samsung Galaxy Tab S6 is based on Qualcomm’s Snapdragon 855 SoC featuring four high-performance cores, four low-power cores, and Adreno 640 integrated GPU. The application processor accompanied by 6 or 8 GB of LPDDR4/LPDDR4X memory as well as 128 or 256 GB of NAND flash storage (expandable using a microSDXC card). Like other high-end consumer tablets from Samsung released in the recent quarters, the Galaxy Tab S6 is equipped with a 10.5-inch Super AMOLED display with a 2560×1600 resolution, stylus support, and thin bezels. On the audio side of matters, the tablet has four speakers and two microphones.
    Imaging capabilities of the Galaxy Tab S6 look rather interesting. For the first time on a consumer tablet from a well-known manufacturer, the device has two camera modules on the back: a 13 MP RGB sensor and a 5 MP 123-degree ultra-wide lens. For some reason, the company decided not to equip its dual camera with a flash though. Meanwhile, there is an 8 MP camera for selfies and video calls on the front.
    As far as wireless connectivity features are concerned, the Galaxy Tab S6 has an 802.11ac Wi-Fi controller with MU-MIMO support, Bluetooth 5.0, as well as GPS (+ GLONASS, Beidou, Gallileo). The manufacturer claims that variants with a 4G/LTE modem will be available later this year, but does not elaborate. On the wired side of things, the tablet has a USB 3.1 Type-C interface for audio, data, and charging, as well as a set of POGO connectors for keyboards or other gear.
    When it comes to sensors, the Galaxy Tab S6 has an on-screen fingerprint reader, an accelerometer, a compass, a gyroscope, a proximity sensor, RGB light sensor, and so on.
    Since the Galaxy Tab S6 is designed primarily for consumers, it is very thin (5.7 mm), light (420 grams), and comes in consumer-friendly gray, blue, or rose enclosures.
    Despite it's consumer positioning, the Galaxy Tab S6 can be a very powerful tool for professionals: it comes with a new S Pen stylus that can serve as a remote controller for select applications, it support Samsung’s Knox mobile security platform to protect valuable and confidential information, and it is compatible with Samsung’s DeX platform that enables desktop-like experience on Android-based tablets (e.g., open up multiple windows, re-size windows, drag and drop content, etc.). To make usage of DeX more convenient, the Galaxy Tab S6’s dedicated book cover keyboard comes with a special DeX key to launch or close the environment. Meanwhile, there is no word whether the tablet can support an external display via its USB Type-C connector using an appropriate adapter, however since the smartphone Galaxy counter-parts support this, it's likely the Tab S6 does as well.
    Samsung Galaxy Tab S6
    SoC Qualcomm Snapdragon 855
    1x Kryo 485 Gold (A76 derivative) @ 2.84GHz 1x512KB pL2
    3x Kryo 485 Gold (A76 derivative) @ 2.42GHz 3x256KB pL2
    4x Kryo 485 Silver (A55 derivative) @ 1.80GHz 4x128KB pL2
    2MB sL3
    Graphics Adreno 640
    Display 10.5-inch
    Storage 128 GB or 256 GB
    + microSD
    Memory 6 GB or 8 GB LPDDR4 (?)
    Wireless Wi-Fi 802.11 a/b/g/n/ac 2.4G+5GHz, MU-MIMO, Wi-Fi Direct,
    Bluetooth v5.0
    GPS GPS, Glonass, Beidou, Galileo
    Connectivity USB 3.1 Type-C for data and charging
    POGO connectors for keyboard
    Camera Rear Camera: 13 MP RGB + 5 MP ultra-wide
    Front Camera: 8 MP
    Video Recording: UHD 4K (3840×2160) @ 30 fps
    Playback: UHD 4K (7680×430) @ 30 fps
    Audio 4 × Speakers co-developed with AKG with Dolby Atmos certification
    USB-C headset
    Sensors Accelerometer, Fingerprint Sensor, Gyro Sensor, Geomagnetic Sensor, Hall Sensor, RGB Light Sensor, etc
    Battery 7040 mAh
    Dimensions 244.5 × 159.5 × 5.7 mm
    420 grams (Wi-Fi)
    Color Mountain Gray, Cloud Blue, Rose Blush
    OS Android 9.0 Pie
    Price starts at $649.99
    Accessories Book Cover Keyboard, POGO Charging Dock, Slim cover, etc.
    Samsung will start to take pre-orders on the Galaxy Tab S6 on August 23 and will start retail sales on September 6th. MSRP of the basic version of the tablet will start at $649. The new S Pen is bundled with the device, whereas the keyboard will be sold separately.
    Related Reading:

    Source: Samsung


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    Anandtech: Thermaltake’s Launches Liquid-Cooled WaterRam RGB DDR4-3600 Kits

    Seemingly intent on proving that everything in a PC should in fact be liquid cooled, Thermaltake this week has expanded its WaterRAM lineup of water-cooled RAM with DDR4-3600 kits.
    Available as a 32 GB dual-channel/quad-channel kit, Thermaltake’s WaterRAM DDR4-3600 (CL-W262-CA00SW) feature CL18 19-19-36 timings and 1.35 V operating voltage. The modules are based on tightly-screened SK Hynix’s C-die memory chips, a 10-layer PCB, and feature XMP 2.0 profiles for easier overclocking.
    The key selling feature of Thermaltake’s WaterRAM DDR4-3600 kit is its cooling system. It includes 2-mm thick aluminum heatsinks on the modules as well as a copper nickel-plated water block with a PMMA cover that is installed on top of the DIMMs. The water block is equipped with G ¼ fittings compatible with the majority of open loop liquid cooling systems. Meanwhile, following the latest trends, the water block features 12 built-in addressable LEDs that can be controlled using Thermaltake’s hardware controller (bundled) or using software from leading motherboard makers, Razer Chroma, and Amazon Alexa.
    The manufacturer says that liquid cooling allows them to reduce RAM temperatures by 32% when compared to regular heat spreaders, a claim that has to be tested independently. Ideally, lower temperatures should enable at least some higher overclocking potential and/or improve stability.
    Thermaltake’s WaterRAM DDR4-3600 kit will be available shortly. The modules themselves are backed with a lifetime warranty, whereas the water block is covered with a two-year warranty.
    Related Reading:

    Source: Thermaltake (via TechPowerUp)


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    Anandtech: G.Skill Reveals Trident Z Neo DDR4-3800 CL14 Kit for AMD Ryzen 3000

    G.Skill has introduced its new high-end Trident Z Neo memory kits for systems based on AMD’s latest Ryzen 3000 processors. According to G.Skill, its Trident Z Neo DDR4-3800 CL14 kits reach up to 58 GB/s in measured memory bandwidth.
    AMD says — and many third-party observers confirm — that its Ryzen 3000 CPUs based on the Zen 2 microarchitecture show the highest memory subsystem performance when frequencies of Infinity Fabric (fClk), memory controller (uClk), and DRAM (mClk) are equal (i.e., the fClk to mClk ratio is set at 1:1). However, far not all Ryzen processors can support high fClk clocks, so using extremely fast DDR4 memory modules (e.g., DDR4-4000+) may be detrimental in many cases. G.Skill says that its Trident Z Neo DDR4-3800 kit, which runs at CL14-16-16-36 timings at a toasty 1.5 V, offers an optimal combination of high clocks, low latency, and fClk to mClk ratio of 1:1 for AMD’s latest CPUs.
    G.Skill’s Trident Z Neo DDR4-3800 CL14 8 GB modules (F4-3800C14-8GTZN) are based on Samsung’s 8 Gb B-die memory chips and use a custom PCB. The unbuffered DIMMs come with aluminum heat spreaders as well as RGB LEDs. To set up rather extreme clocks and low latencies, users will need to enable an XMP 2.0 profile.
    Apart from the combination of frequency and timings, a key feature of the Trident Z Neo DDR4-3800 CL14 modules is their unprecedented voltage of 1.5 Volts, a 25% increase over DDR4 specification (1.2 Volts), that is only supported properly on high-end platforms equipped with a high-quality VRM. The module maker itself has validated its new DIMMs with ASUS ROG Crosshair VIII Formula as well as MSI MEG X570 Godlike motherboards that run AMD’s Ryzen 5 3600X or Ryzen 9 3900X CPUs.
    According to G.Skill, internal tests revealed that a memory subsystem comprising of an AMD Ryzen 3000 processor as well as its Trident Z Neo DDR4-3800 CL14 modules can hit 58 GB/s, 56 GB/s, and 58 GB/s of memory bandwidth for read, write, and copy benchmarks respectively.
    G.Skill will supply its Trident Z Neo DDR4-3800 CL14 8 GB DIMMs in 16 GB or 32 GB dual-channel memory kits. The kits will hit the market shortly, their MSRPs will depend on demand and supply.
    Related Reading:

    Source: G.Skill


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    Anandtech: LG Unveils New UltraFine 4K & 5K Monitors: Now with iPad Pro Support

    LG has updated its UltraFine lineup of displays, which are aimed especially at computers made by Apple. The entry-level UltraFine 4K has received a larger screen, whereas the more advanced UltraFine 5K has gained a USB Type-C port. Both monitors are now compatible with Macs as well as the latest iPad Pro tablets, enabling owners of the latter to use them as desktops.
    The new entry-level LG UltraFine 4K monitor is now based on a 23.7-inch IPS panel featuring a 3840×2160 resolution, 500 nits brightness, a 60 Hz refresh rate, and the usual 178°/178° horizontal/vertical viewing angles. The display comes with integrated stereo speakers, and an built-in PSU. When compared to the original UltraFine 4K introduced in 2016, the new LCD is bigger, but its resolution is the same, and as a result the pixel density got lower.
    The larger LG UltraFine 5K display uses a 27-inch IPS panel featuring a 5120×2880, 500 nits brightness, a 60 Hz refresh rate, and 178°/178° horizontal/vertical viewing angles. The new LCD is equipped with a webcam, built-in stereo speakers and a microphone, as well as an integrated power supply. In an important change, this model now no longer requires a Thunderbolt 3 connection; the monitor can be used with a USB-C port as well (with DP alt mode), making it compatible with a wider range of devices, and likely indicating that LG has upgraded to Intel's Titan Ridge TB3 controller.
    As these monitors are primarily meant to be used with Apple products, LG’s UltraFine monitors only support the P3 color gamut – where Apple offers very robust OS-level support – and are compatible with Apple’s latest Macs as well as 2019 iPad Pro tablets, making this the first time these displays have worked with an iPad. Both displays can connect to hosts using a Thunberbolt 3 or a USB 3.1 Gen 1 Type-C ports that can deliver up to 85 W or 94 W of power to a laptop or a tablet.
    LG's 2019 UltraFine Displays
    LG UltraFine 4K LG UltraFine 5K
    Panel 23.7" IPS 27" IPS
    Native Resolution 3840 x 2160 5120 x 2880
    Refresh Rate 60 Hz
    Brightness 500 cd/m²
    Color Gamut Display P3
    Color Depth 8 bit (?) 10 bit (?)
    Viewing Angles 178°/178° horizontal/vertical
    Inputs Thunderbolt 3 or USB-C
    USB Hub 3 x 5Gbps USB-C
    Audio Stereo speakers Stereo speakers
    Webcam - Integrated
    Stand Adjustable stand
    Power Delivery 85 W 94 W
    Price $699.95 $1,299.95
    The new LCDs are currently available from Apple. The LG UltraFine 4K 23.7-inch display is priced at $699.95, whereas the UltraFine 5K 27-inch monitor is priced at $1,299.95.
    Related Reading:

    Source: LG


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